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name:-0.0058858394622803
name:-0.00042104721069336
Pandhumsoporn; Tamarak Patent Filings

Pandhumsoporn; Tamarak

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pandhumsoporn; Tamarak.The latest application filed is for "components and processes for managing plasma process byproduct materials".

Company Profile
1.6.9
  • Pandhumsoporn; Tamarak - Fremont CA
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Components and Processes for Managing Plasma Process Byproduct Materials
App 20210225616 - Peng; Gordon Wen-Yin ;   et al.
2021-07-22
Edge ring assembly for improving feature profile tilting at extreme edge of wafer
Grant 10,854,492 - Bosch , et al. December 1, 2
2020-12-01
Edge Ring Assembly For Improving Feature Profile Tilting At Extreme Edge Of Wafer
App 20170053820 - Bosch; William Frederick ;   et al.
2017-02-23
Minimization Of Mask Undercut On Deep Etch
App 20120298301 - Pandhumsoporn; Tamarak ;   et al.
2012-11-29
Minimization of mask undercut on deep silicon etch
Grant 8,262,920 - Pandhumsoporn , et al. September 11, 2
2012-09-11
Notch stop pulsing process for plasma processing system
Grant 7,985,688 - Pandhumsoporn , et al. July 26, 2
2011-07-26
Minimization of mask undercut on deep silicon etch
App 20080308526 - Pandhumsoporn; Tamarak ;   et al.
2008-12-18
Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrate
Grant 7,459,100 - Kiermasz , et al. December 2, 2
2008-12-02
Methods for minimizing mask undercuts and notches for plasma processing system
Grant 7,351,664 - Pandhumsoporn , et al. April 1, 2
2008-04-01
Methods For Minimizing Mask Undercuts And Notches For Plasma Processing System
App 20070281489 - Pandhumsoporn; Tamarak ;   et al.
2007-12-06
Notch stop pulsing process for plasma processing system
App 20070141847 - Pandhumsoporn; Tamarak ;   et al.
2007-06-21
Methods and apparatus for sequentially alternating among plasma processes in order to optimize a substrate
App 20060131271 - Kiermasz; Adrian ;   et al.
2006-06-22
Methods of processing a substrate with minimal scalloping
App 20050211668 - Pandhumsoporn, Tamarak
2005-09-29
Method Of Anisotropic Etching Of Substrates
App 20010044213 - PANDHUMSOPORN, TAMARAK ;   et al.
2001-11-22
Recessed bonding of target for RF diode sputtering
Grant 6,287,437 - Pandhumsoporn , et al. September 11, 2
2001-09-11

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