| Patent | Date |
|---|
Integrated circuit package and method
Grant 11,450,581 - Lo , et al. September 20, 2 | 2022-09-20 |
Semiconductor device, package structure including a heat dissipation element having a conductive base and a plurality of antenna patterns and method of fabricating the semiconductor device
Grant 11,444,023 - Hsu , et al. September 13, 2 | 2022-09-13 |
Method Of Forming Semiconductor Packages Having Thermal Through Vias (ttv)
App 20220285241 - Hsu; Sen-Kuei ; et al. | 2022-09-08 |
Semiconductor Package
App 20220270987 - Yu; Chi-Yang ; et al. | 2022-08-25 |
Semiconductor Package And Manufacturing Method Thereof
App 20220238505 - Chen; Shih-Wei ; et al. | 2022-07-28 |
Package Structure
App 20220216194 - Hsu; Sen-Kuei ; et al. | 2022-07-07 |
Semiconductor packages having thermal through vias (TTV)
Grant 11,373,922 - Hsu , et al. June 28, 2 | 2022-06-28 |
Manufacturing method of semiconductor package including thermal conductive block
Grant 11,309,302 - Chen , et al. April 19, 2 | 2022-04-19 |
Package structure
Grant 11,296,067 - Hsu , et al. April 5, 2 | 2022-04-05 |
Semiconductor Package And Method Of Manufacturing The Same
App 20220102314 - Chen; Shih-Wei ; et al. | 2022-03-31 |
Integrated Circuit Package And Method
App 20220068736 - Lo; Teng-Yuan ; et al. | 2022-03-03 |
Semiconductor Packages And Methods Of Forming The Same
App 20220020655 - Cheng; Jung-Wei ; et al. | 2022-01-20 |
Semiconductor Package
App 20210407914 - Hsu; Sen-Kuei ; et al. | 2021-12-30 |
Semiconductor package and method of manufacturing the same
Grant 11,205,636 - Chen , et al. December 21, 2 | 2021-12-21 |
Semiconductor package and manufacturing method thereof
Grant 11,145,639 - Cheng , et al. October 12, 2 | 2021-10-12 |
Semiconductor Package And Manufacturing Method Thereof
App 20210296221 - Yang; Ching-Feng ; et al. | 2021-09-23 |
Semiconductor Package And Manufacturing Method Thereof
App 20210249372 - Hsu; Sen-Kuei ; et al. | 2021-08-12 |
Semiconductor Package And Manufacturing Method Thereof
App 20210242172 - Wang; Tsung-Ding ; et al. | 2021-08-05 |
Memory Device And Manufacturing Method Thereof
App 20210202354 - Chuang; Lipu Kris ; et al. | 2021-07-01 |
Conductive Traces in Semiconductor Devices and Methods of Forming Same
App 20210183760 - Shih; Chao-Wen ; et al. | 2021-06-17 |
Semiconductor Package And Manufacturing Method Thereof
App 20210183844 - Cheng; Jung-Wei ; et al. | 2021-06-17 |
Memory module, semiconductor package including the same, and manufacturing method thereof
Grant 11,018,113 - Chuang , et al. May 25, 2 | 2021-05-25 |
Package structure and method of forming the same
Grant 11,004,812 - Hung , et al. May 11, 2 | 2021-05-11 |
Memory Module, Semiconductor Package Including The Same, And Manufacturing Method Thereof
App 20210118847 - Chuang; Lipu Kris ; et al. | 2021-04-22 |
Dam For Three-dimensional Integrated Circuit
App 20210098318 - Wang; Tsung-Ding ; et al. | 2021-04-01 |
Conductive traces in semiconductor devices and methods of forming same
Grant 10,937,734 - Shih , et al. March 2, 2 | 2021-03-02 |
Semiconductor Device, Package Structure And Method Of Fabricating The Same
App 20210043564 - Hsu; Sen-Kuei ; et al. | 2021-02-11 |
Package Structure And Manufacturing Method Thereof
App 20210043590 - Hsu; Sen-Kuei ; et al. | 2021-02-11 |
Semicondcutor Package And Method Of Manufacturing The Same
App 20210013177 - Chen; Shih-Wei ; et al. | 2021-01-14 |
Package Structure
App 20200411499 - Hsu; Sen-Kuei ; et al. | 2020-12-31 |
Semiconductor device and manufacturing method thereof
Grant 10,872,842 - Wan , et al. December 22, 2 | 2020-12-22 |
Semiconductor package, semiconductor device and method for packaging semiconductor device
Grant 10,867,882 - Wan , et al. December 15, 2 | 2020-12-15 |
Dam for three-dimensional integrated circuit
Grant 10,867,878 - Wang , et al. December 15, 2 | 2020-12-15 |
Semiconductor Packages Having Thermal Through Vias (ttv)
App 20200373219 - Hsu; Sen-Kuei ; et al. | 2020-11-26 |
Package structure and manufacturing method thereof
Grant 10,840,197 - Hsu , et al. November 17, 2 | 2020-11-17 |
Semiconductor device, package structure and method of fabricating the same
Grant 10,818,588 - Hsu , et al. October 27, 2 | 2020-10-27 |
Package structure
Grant 10,818,651 - Hsu , et al. October 27, 2 | 2020-10-27 |
Semiconductor package and method of manufacturing the same
Grant 10,811,384 - Chen , et al. October 20, 2 | 2020-10-20 |
Semiconductor Package And Manufacturing Method Thereof
App 20200303364 - Chen; Shih-Wei ; et al. | 2020-09-24 |
Semiconductor Device And Manufacturing Method Thereof
App 20200273773 - Wan; Albert ; et al. | 2020-08-27 |
Semiconductor packages having thermal through vias (TTV)
Grant 10,748,831 - Hsu , et al. A | 2020-08-18 |
Semiconductor Device, Package Structure And Method Of Fabricating The Same
App 20200251414 - Kind Code | 2020-08-06 |
Package Structure
App 20200243497 - Hsu; Sen-Kuei ; et al. | 2020-07-30 |
Semiconductor package including thermal relaxation block and manufacturing method thereof
Grant 10,720,416 - Chen , et al. | 2020-07-21 |
Semiconductor packages
Grant 10,672,681 - Lin , et al. | 2020-06-02 |
Semicondcutor Package And Method Of Manufacturing The Same
App 20200135692 - Chen; Shih-Wei ; et al. | 2020-04-30 |
Package Structure And Manufacturing Method Thereof
App 20200135670 - Hsu; Sen-Kuei ; et al. | 2020-04-30 |
Package Structure And Method Of Forming The Same
App 20200091097 - Hung; Tuan-Yu ; et al. | 2020-03-19 |
Semiconductor Package, Semiconductor Device And Method For Packaging Semiconductor Device
App 20200091031 - Wan; Albert ; et al. | 2020-03-19 |
Semiconductor Package And Manufacturing Method Thereof
App 20200058632 - Chen; Shih-Wei ; et al. | 2020-02-20 |
Semicondcutor package and method of manufacturing the same
Grant 10,510,713 - Chen , et al. Dec | 2019-12-17 |
Semiconductor Packages And Methods Of Forming The Same
App 20190371694 - Hsu; Sen-Kuei ; et al. | 2019-12-05 |
Packaging of semiconductor device with antenna and heat spreader
Grant 10,490,479 - Wan , et al. Nov | 2019-11-26 |
Semiconductor Packages
App 20190333836 - Lin; Chien-Chang ; et al. | 2019-10-31 |
Semiconductor device and semiconductor package
Grant 10,256,203 - Chuang , et al. | 2019-04-09 |
Semicondcutor Device And Semicondcutor Package
App 20190035752 - Chuang; Lipu Kris ; et al. | 2019-01-31 |
Lid design for heat dissipation enhancement of die package
Grant 10,163,754 - Ho , et al. Dec | 2018-12-25 |
Semiconductor device structure
Grant 10,157,859 - Chang , et al. Dec | 2018-12-18 |
Semiconductor structure and manufacturing method thereof
Grant 10,157,900 - Liang , et al. Dec | 2018-12-18 |
Dam for Three-Dimensional Integrated Circuit
App 20180323118 - Wang; Tsung-Ding ; et al. | 2018-11-08 |
Dam for three-dimensional integrated circuit
Grant 10,020,236 - Wang , et al. July 10, 2 | 2018-07-10 |
Semiconductor Device Structure
App 20180130756 - CHANG; Shou-Zen ; et al. | 2018-05-10 |
Semiconductor device structure and method for forming the same
Grant 9,875,972 - Chang , et al. January 23, 2 | 2018-01-23 |
Semiconductor Device Structure And Method For Forming The Same
App 20180019209 - CHANG; Shou-Zen ; et al. | 2018-01-18 |
Method of forming 3D integrated circuit package with panel type lid
Grant 9,859,266 - Wang , et al. January 2, 2 | 2018-01-02 |
Seal rings structures in semiconductor device interconnect layers and methods of forming the same
Grant 9,780,046 - Pan , et al. October 3, 2 | 2017-10-03 |
Conductive Traces In Semiconductor Devices And Methods Of Forming Same
App 20170250130 - Shih; Chao-Wen ; et al. | 2017-08-31 |
Seal Rings Structures In Semiconductor Device Interconnect Layers And Methods Of Forming The Same
App 20170141052 - Pan; Hsin-Yu ; et al. | 2017-05-18 |
Conductive traces in semiconductor devices and methods of forming same
Grant 9,653,406 - Shih , et al. May 16, 2 | 2017-05-16 |
Semiconductor Structure and Manufacturing Method Thereof
App 20170098640 - Liang; Shih-Wei ; et al. | 2017-04-06 |
Method Of Forming 3D Integrated Circuit Package With Panel Type Lid
App 20170077078 - Wang; Tsung-Ding ; et al. | 2017-03-16 |
Substrate with touch function and display using the same
Grant 9,547,398 - Pan , et al. January 17, 2 | 2017-01-17 |
Semiconductor structure and manufacturing method thereof
Grant 9,543,373 - Liang , et al. January 10, 2 | 2017-01-10 |
3D integrated circuit package processing with panel type lid
Grant 9,502,383 - Wang , et al. November 22, 2 | 2016-11-22 |
Conductive Traces in Semiconductor Devices and Methods of Forming Same
App 20160307852 - Shih; Chao-Wen ; et al. | 2016-10-20 |
3d Integrated Circuit Package Processing With Panel Type Lid
App 20150262973 - Wang; Tsung-Ding ; et al. | 2015-09-17 |
Dam for Three-Dimensional Integrated Circuit
App 20150262900 - Wang; Tsung-Ding ; et al. | 2015-09-17 |
Lid Design for Heat Dissipation Enhancement of Die Package
App 20150187679 - Ho; Kuan-Lin ; et al. | 2015-07-02 |
Optical touch display panel
Grant 9,035,916 - Lien , et al. May 19, 2 | 2015-05-19 |
Semiconductor Structure And Manufacturing Method Thereof
App 20150108635 - LIANG; SHIH-WEI ; et al. | 2015-04-23 |
Flip-chip BGA assembly process
Grant 8,993,378 - Liu , et al. March 31, 2 | 2015-03-31 |
Substrate With Touch Function And Display Using The Same
App 20150062076 - PAN; HSIN-YU ; et al. | 2015-03-05 |
Reinforcement structure for flip-chip packaging
Grant 8,810,025 - Liu , et al. August 19, 2 | 2014-08-19 |
Optical Touch Display Panel
App 20140098064 - Lien; Chung-Min ; et al. | 2014-04-10 |
Flip-chip Bga Assembly Process
App 20130059416 - LIU; Yu-Chih ; et al. | 2013-03-07 |
Reinforcement Structure For Flip-chip Packaging
App 20120235303 - Liu; Yu-Wen ; et al. | 2012-09-20 |
Thermoelectric cooler for semiconductor devices with TSV
Grant 8,026,567 - Chang , et al. September 27, 2 | 2011-09-27 |
Synchronous rectifier control device and forward synchronous rectifier circuit
Grant 7,864,548 - Lin , et al. January 4, 2 | 2011-01-04 |
Thermoelectric Cooler for Semiconductor Devices with TSV
App 20100155700 - Chang; Shih Cheng ; et al. | 2010-06-24 |
Method and apparatus for increasing heat dissipation of high performance integrated circuits (IC)
Grant 7,583,502 - Tsao , et al. September 1, 2 | 2009-09-01 |
Synchronous rectifier control device and forward synchronous rectifier circuit
App 20090161396 - Lin; Chun-Ming ; et al. | 2009-06-25 |
Stacked structures and methods of fabricating stacked structures
Grant 7,514,775 - Chao , et al. April 7, 2 | 2009-04-07 |
Heat stud for stacked chip package
Grant 7,361,986 - Yuan , et al. April 22, 2 | 2008-04-22 |
Stacked Structures And Methods Of Fabricating Stacked Structures
App 20080083975 - Chao; Clinton ; et al. | 2008-04-10 |
Semiconductor packages and methods of manufacturing thereof
Grant 7,348,218 - Ni , et al. March 25, 2 | 2008-03-25 |
Method And Apparatus For Increasing Heat Dissipation Of High Performance Integrated Circuits (ic)
App 20070285890 - Tsao; Pei-Haw ; et al. | 2007-12-13 |
Semiconductor packages and methods of manufacturing thereof
App 20060286719 - Ni; Ching-Yu ; et al. | 2006-12-21 |
Sealing membrane for thermal interface material
App 20060261469 - Ni; Ching-Yu ; et al. | 2006-11-23 |
Structural design for flip-chip assembly
Grant 7,138,300 - Yuan , et al. November 21, 2 | 2006-11-21 |
Semiconductor packages and methods of manufacturing thereof
Grant 7,135,769 - Ni , et al. November 14, 2 | 2006-11-14 |
Semiconductor Packages And Methods Of Manufacturing Thereof
App 20060220225 - Ni; Ching-Yu ; et al. | 2006-10-05 |
Spacer Structures for Semiconductor Package Devices
App 20060170088 - Lee; Hsin-Hui ; et al. | 2006-08-03 |
Thermal expansion compensating flip chip ball grid array package structure
App 20060118947 - Yuan; Tsorng-Dih ; et al. | 2006-06-08 |
Heat stud for stacked chip package
App 20060113663 - Yuan; Tsorng-Dih ; et al. | 2006-06-01 |
Heat spreader for non-uniform power dissipation
App 20060060952 - Yuan; Tsorng-Dih ; et al. | 2006-03-23 |
Structural design for flip-chip assembly
App 20060063300 - Yuan; Tsorng-Dih ; et al. | 2006-03-23 |
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