Pagaila; Reza A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Pagaila; Reza A..The latest application filed is for "semiconductor device and method of forming interposer with opening to contain semiconductor die".

Company Profile

6.200.160

Pagaila; Reza A. - Tangerang ID
Pagaila; Reza A. - Singapore N/A SG

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die Grant 10,998,248 - Pagaila , et al. May 4, 2	2021-05-04
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect Grant RE48,408 - Pagaila , et al. January 26, 2	2021-01-26
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect Grant RE48,111 - Pagaila , et al.	2020-07-21
Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die Grant 10,643,952 - Pagaila , et al.	2020-05-05
Semiconductor device and method of forming Fo-WLCSP with recessed interconnect area in peripheral region of semiconductor die Grant 10,388,584 - Pagaila , et al. A	2019-08-20
Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die Grant 10,068,843 - Pagaila September 4, 2	2018-09-04
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die App 20180108542 - Pagaila; Reza A. ; et al.	2018-04-19
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect Grant 9,893,045 - Pagaila , et al. February 13, 2	2018-02-13
Semiconductor device and method of forming interposer with opening to contain semiconductor die Grant 9,875,911 - Pagaila , et al. January 23, 2	2018-01-23
Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die Grant 9,824,975 - Pagaila , et al. November 21, 2	2017-11-21
Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die Grant 9,754,858 - Pagaila , et al. September 5, 2	2017-09-05
Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer Grant 9,685,403 - Pagaila June 20, 2	2017-06-20
Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material Grant 9,679,881 - Pagaila , et al. June 13, 2	2017-06-13
Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in Fo-WLCSP Grant 9,679,824 - Pagaila , et al. June 13, 2	2017-06-13
Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core Grant 9,640,504 - Pagaila , et al. May 2, 2	2017-05-02
Semiconductor device and method of forming anisotropic conductive film between semiconductor die and build-up interconnect structure Grant 9,620,455 - Pagaila , et al. April 11, 2	2017-04-11
Semiconductor device and method of forming conductive vias with trench in saw street Grant 9,601,369 - Do , et al. March 21, 2	2017-03-21
Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die Grant 9,589,910 - Pagaila , et al. March 7, 2	2017-03-07
Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant App 20170062390 - Chua; Linda Pei Ee ; et al.	2017-03-02
Semiconductor device and method of forming a shielding layer between stacked semiconductor die Grant 9,583,446 - Pagaila , et al. February 28, 2	2017-02-28
Semiconductor Device and Method of Forming EMI Shielding Layer with Conductive Material Around Semiconductor Die App 20170018507 - Pagaila; Reza A. ; et al.	2017-01-19
Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant Grant 9,530,738 - Chua , et al. December 27, 2	2016-12-27
Semiconductor device and method of forming openings in thermally-conductive frame of FO-WLCSP to dissipate heat and reduce package height Grant 9,508,626 - Pagaila , et al. November 29, 2	2016-11-29
Semiconductor device and method of forming EMI shielding layer with conductive material around semiconductor die Grant 9,484,279 - Pagaila , et al. November 1, 2	2016-11-01
Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die Grant 9,449,932 - Do , et al. September 20, 2	2016-09-20
Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation Grant 9,443,828 - Pagaila , et al. September 13, 2	2016-09-13
Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure Grant 9,443,829 - Pagaila September 13, 2	2016-09-13
Semiconductor device and method of forming shielding layer over active surface of semiconductor die Grant 9,437,482 - Pagaila September 6, 2	2016-09-06
Semiconductor device including RDL along sloped side surface of semiconductor die for Z-direction interconnect Grant 9,437,538 - Pagaila , et al. September 6, 2	2016-09-06
Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure Grant 9,431,331 - Do , et al. August 30, 2	2016-08-30
Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP Grant 9,418,878 - Pagaila , et al. August 16, 2	2016-08-16
Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers Grant 9,418,962 - Pagaila August 16, 2	2016-08-16
Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP Grant 9,418,941 - Do , et al. August 16, 2	2016-08-16
Semiconductor device including pre-fabricated shielding frame disposed over semiconductor die Grant 9,406,619 - Pagaila , et al. August 2, 2	2016-08-02
Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die App 20160197022 - Pagaila; Reza A. ; et al.	2016-07-07
Semiconductor device and method of forming double-sided through vias in saw streets Grant 9,343,429 - Pagaila , et al. May 17, 2	2016-05-17
Semiconductor device and method of forming stepped interposer for stacking and electrically connecting semiconductor die Grant 9,337,116 - Pagaila , et al. May 10, 2	2016-05-10
Semiconductor device and method of forming through vias with reflowed conductive material Grant 9,331,002 - Pagaila , et al. May 3, 2	2016-05-03
Semiconductor device and method of forming dual-active sided semiconductor die in fan-out wafer level chip scale package Grant 9,324,672 - Pagaila April 26, 2	2016-04-26
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect App 20160111410 - Pagaila; Reza A. ; et al.	2016-04-21
Semiconductor device and method of forming sacrificial adhesive over contact pads of semiconductor die Grant 9,318,441 - Pagaila , et al. April 19, 2	2016-04-19
Semiconductor device and method of forming Fo-WLCSP with discrete semiconductor components mounted under and over semiconductor die Grant 9,263,301 - Pagaila , et al. February 16, 2	2016-02-16
Semiconductor device having a vertical interconnect structure using stud bumps Grant 9,263,361 - Pagaila , et al. February 16, 2	2016-02-16
Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation Grant 9,257,411 - Pagaila , et al. February 9, 2	2016-02-09
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect Grant 9,240,380 - Pagaila , et al. January 19, 2	2016-01-19
Semiconductor die and method of forming noise absorbing regions between THVs in peripheral region of the die Grant 9,236,352 - Pagaila , et al. January 12, 2	2016-01-12
Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe Grant 9,236,332 - Pagaila , et al. January 12, 2	2016-01-12
Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier Grant 9,224,693 - Pagaila , et al. December 29, 2	2015-12-29
Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars Grant 9,177,901 - Pagaila , et al. November 3, 2	2015-11-03
Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die Grant 9,153,544 - Pagaila , et al. October 6, 2	2015-10-06
Semiconductor device with protective layer over exposed surfaces of semiconductor die Grant 9,142,515 - Pagaila , et al. September 22, 2	2015-09-22
Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking Grant 9,142,431 - Pagaila September 22, 2	2015-09-22
Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structure App 20150262977 - Pagaila; Reza A.	2015-09-17
Semiconductor Device and Method of Forming WLP With Semiconductor Die Embedded Within Penetrable Encapsulant Between TSV Interposers App 20150249065 - Pagaila; Reza A.	2015-09-03
Semiconductor Device and Method of Embedding Thermally Conductive Layer in Interconnect Structure for Heat Dissipation App 20150228628 - Pagaila; Reza A. ; et al.	2015-08-13
Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure Grant 9,076,803 - Pagaila July 7, 2	2015-07-07
Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP Grant 9,064,876 - Pagaila , et al. June 23, 2	2015-06-23
Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers Grant 9,054,095 - Pagaila June 9, 2	2015-06-09
Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation Grant 9,048,211 - Pagaila , et al. June 2, 2	2015-06-02
Semiconductor Device and Method of Forming Stepped Interconnect Layer for Stacked Semiconductor Die App 20150145128 - Pagaila; Reza A. ; et al.	2015-05-28
Semiconductor Device and Method of Forming WLCSP Using Wafer Sections Containing Multiple Die App 20150137322 - Pagaila; Reza A. ; et al.	2015-05-21
Semiconductor Device and Method of Forming a Shielding Layer Between Stacked Semiconductor Die App 20150115394 - Pagaila; Reza A. ; et al.	2015-04-30
Semiconductor device and method of forming recessed conductive vias in saw streets Grant 9,006,882 - Pagaila , et al. April 14, 2	2015-04-14
Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure Grant 8,999,760 - Pagaila , et al. April 7, 2	2015-04-07
Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of FO-WLCSP Grant 8,994,184 - Pagaila March 31, 2	2015-03-31
Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die Grant 8,946,870 - Pagaila , et al. February 3, 2	2015-02-03
Through hole vias at saw streets including protrusions or recesses for interconnection Grant 8,940,636 - Pagaila , et al. January 27, 2	2015-01-27
Semiconductor device and method of forming WLCSP using wafer sections containing multiple die Grant 8,916,452 - Pagaila , et al. December 23, 2	2014-12-23
Semiconductor device and method of forming a shielding layer between stacked semiconductor die Grant 8,907,498 - Pagaila , et al. December 9, 2	2014-12-09
Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant App 20140353846 - Chua; Linda Pei Ee ; et al.	2014-12-04
Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die Grant 8,896,109 - Pagaila , et al. November 25, 2	2014-11-25
Semiconductor Device and Method of Forming Adhesive Material to Secure Semiconductor Die to Carrier in WLCSP App 20140332986 - Pagaila; Reza A. ; et al.	2014-11-13
Semiconductor device and method of forming adhesive material to secure semiconductor die to carrier in WLCSP Grant 8,883,559 - Pagaila , et al. November 11, 2	2014-11-11
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect App 20140327145 - Pagaila; Reza A. ; et al.	2014-11-06
Semiconductor Device and Method of Forming TMV and TSV in WLCSP Using Same Carrier App 20140319678 - Pagaila; Reza A. ; et al.	2014-10-30
Semiconductor Device and Method of Forming Shielding Layer Over Semiconductor Die Mounted to TSV Interposer App 20140319661 - Pagaila; Reza A.	2014-10-30
Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation Grant 8,866,294 - Pagaila , et al. October 21, 2	2014-10-21
Semiconductor Device and Method of Forming Shielding Layer Over Active Surface of Semiconductor Die App 20140291820 - Pagaila; Reza A.	2014-10-02
Semiconductor Device Including RDL Along Sloped Side Surface of Semiconductor Die for Z-Direction Interconnect App 20140264786 - Pagaila; Reza A. ; et al.	2014-09-18
Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die App 20140252631 - Pagaila; Reza A. ; et al.	2014-09-11
Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant Grant 8,823,182 - Chua , et al. September 2, 2	2014-09-02
Semiconductor device and method of forming TMV and TSV in WLCSP using same carrier Grant 8,822,281 - Pagaila , et al. September 2, 2	2014-09-02
Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation App 20140231989 - Pagaila; Reza A. ; et al.	2014-08-21
Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer Grant 8,810,011 - Pagaila August 19, 2	2014-08-19
Semiconductor Device and Method of Forming Conductive Vias with Trench in Saw Street App 20140217609 - Do; Byung Tai ; et al.	2014-08-07
Semiconductor device and method of forming RDL along sloped side surface of semiconductor die for z-direction interconnect Grant 8,796,137 - Pagaila , et al. August 5, 2	2014-08-05
Semiconductor device and method of forming shielding layer over active surface of semiconductor die Grant 8,791,015 - Pagaila July 29, 2	2014-07-29
Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure Grant 8,790,962 - Pagaila , et al. July 29, 2	2014-07-29
Semiconductor Device and Method of Providing Z-Interconnect Conductive Pillars with Inner Polymer Core App 20140203443 - Pagaila; Reza A. ; et al.	2014-07-24
Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die App 20140175623 - Pagaila; Reza A. ; et al.	2014-06-26
Semiconductor device and method of providing Z-interconnect conductive pillars with inner polymer core Grant 8,742,579 - Pagaila , et al. June 3, 2	2014-06-03
Semiconductor device and method of forming conductive vias with trench in saw street Grant 8,729,694 - Do , et al. May 20, 2	2014-05-20
Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die Grant 8,710,635 - Pagaila , et al. April 29, 2	2014-04-29
Semiconductor device and method of forming conductive TSV with insulating annular ring Grant 8,703,610 - Pagaila , et al. April 22, 2	2014-04-22
Semiconductor Device with Protective Layer Over Exposed Surfaces of Semiconductor Die App 20140077344 - Pagaila; Reza A. ; et al.	2014-03-20
Semiconductor Device and Method of Forming Conductive THV and RDL on Opposite Sides of Semiconductor Die for RDL-to-RDL Bonding App 20140070427 - Pagaila; Reza A.	2014-03-13
Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structure App 20140048932 - Pagaila; Reza A.	2014-02-20
Semiconductor device and method of shielding semiconductor die from inter-device interference Grant 8,648,448 - Pagaila , et al. February 11, 2	2014-02-11
Semiconductor device and method of forming protective layer over exposed surfaces of semiconductor die Grant 8,642,381 - Pagaila , et al. February 4, 2	2014-02-04
Semiconductor Device and Method of Forming Cavity Adjacent to Sensitive Region of Semiconductor Die Using Wafer-Level Underfill Material App 20140008769 - Pagaila; Reza A. ; et al.	2014-01-09
Semiconductor device and method of forming conductive THV and RDL on opposite sides of semiconductor die for RDL-to-RDL bonding Grant 8,623,702 - Pagaila January 7, 2	2014-01-07
Semiconductor Device and Method of Embedding Thermally Conductive Layer in Interconnect Structure for Heat Dissipation App 20140001627 - Pagaila; Reza A. ; et al.	2014-01-02
Semiconductor device and method of forming through vias with reflowed conductive material Grant 8,592,950 - Pagaila , et al. November 26, 2	2013-11-26
Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure Grant 8,592,975 - Pagaila November 26, 2	2013-11-26
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die App 20130299982 - Pagaila; Reza A. ; et al.	2013-11-14
Semiconductor Device and Method of Forming Through Vias with Reflowed Conductive Material App 20130299975 - Pagaila; Reza A. ; et al.	2013-11-14
Semiconductor Device and Method of Forming Penetrable Film Encapsulant Around Semiconductor Die and Interconnect Structure App 20130299971 - Do; Byung Tai ; et al.	2013-11-14
Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die Grant 8,581,370 - Pagaila , et al. November 12, 2	2013-11-12
Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant App 20130292850 - Chua; Linda Pei Ee ; et al.	2013-11-07
Semiconductor Device and Method of Forming TSV Semiconductor Wafer with Embedded Semiconductor Die App 20130292851 - Pagaila; Reza A. ; et al.	2013-11-07
Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation Grant 8,575,769 - Pagaila , et al. November 5, 2	2013-11-05
Semiconductor device and method of forming cavity adjacent to sensitive region of semiconductor die using wafer-level underfill material Grant 8,574,960 - Pagaila , et al. November 5, 2	2013-11-05
Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces Grant 8,563,418 - Pagaila , et al. October 22, 2	2013-10-22
Apparatus for thermally enhanced semiconductor package Grant 8,557,639 - Pagaila , et al. October 15, 2	2013-10-15
Semiconductor device and method of forming interconnect structure and mounting semiconductor die in recessed encapsulant Grant 8,558,392 - Chua , et al. October 15, 2	2013-10-15
Semiconductor device and method of forming penetrable film encapsulant around semiconductor die and interconnect structure Grant 8,546,193 - Do , et al. October 1, 2	2013-10-01
Semiconductor Device and Method of Forming Interposer and Opposing Build-Up Interconnect Structure with Connecting Conductive TMV for Electrical Interconnect of FO-WLCSP App 20130241080 - Pagaila; Reza A.	2013-09-19
Semiconductor Device and Method of Forming Base Substrate with Recesses for Capturing Bumped Semiconductor Die App 20130241030 - Do; Byung Tai ; et al.	2013-09-19
Semiconductor device and method of forming air gap adjacent to stress sensitive region of the die Grant 8,530,274 - Pagaila September 10, 2	2013-09-10
Semiconductor device and method of forming bond wires between semiconductor die contact pads and conductive TOV in peripheral area around semiconductor die Grant 8,525,344 - Pagaila , et al. September 3, 2	2013-09-03
Semiconductor device and method of forming TSV semiconductor wafer with embedded semiconductor die Grant 8,518,746 - Pagaila , et al. August 27, 2	2013-08-27
Semiconductor Device and Method of Forming Bond-on-Lead Interconnection for Mounting Semiconductor Die in FO-WLCSP App 20130214409 - Pagaila; Reza A. ; et al.	2013-08-22
Semiconductor Device and Method of Forming Base Leads from Base Substrate as Standoff for Stacking Semiconductor Die App 20130214398 - Pagaila; Reza A. ; et al.	2013-08-22
Semiconductor Device and Method of Forming a Shielding Layer Over a Semiconductor Die After Forming a Build-up Interconnect Structure App 20130207247 - Pagaila; Reza A. ; et al.	2013-08-15
Semiconductor device with conductive vias between saw streets Grant 8,502,352 - Pagaila , et al. August 6, 2	2013-08-06
Semiconductor device and method of forming adhesive material over semiconductor die and carrier to reduce die shifting during encapsulation Grant 8,501,544 - Pagaila August 6, 2	2013-08-06
Semiconductor device and method of conforming conductive vias between insulating layers in saw streets Grant 8,501,541 - Pagaila , et al. August 6, 2	2013-08-06
Semiconductor device and method of forming through vias with reflowed conductive material Grant 8,492,201 - Pagaila , et al. July 23, 2	2013-07-23
Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die Grant 8,492,196 - Pagaila , et al. July 23, 2	2013-07-23
Semiconductor device and method of forming base substrate with recesses for capturing bumped semiconductor die Grant 8,476,772 - Do , et al. July 2, 2	2013-07-02
Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnect Structure on Leadframe App 20130154067 - Pagaila; Reza A. ; et al.	2013-06-20
Semiconductor device and method of forming interposer and opposing build-up interconnect structure with connecting conductive TMV for electrical interconnect of Fo-WLCSP Grant 8,466,544 - Pagaila June 18, 2	2013-06-18
Semiconductor Device and Method of Forming Cavity in Build-Up Interconnect Structure for Short Signal Path Between Die App 20130140683 - Pagaila; Reza A.	2013-06-06
Semiconductor device and method of forming base leads from base substrate as standoff for stacking semiconductor die Grant 8,435,835 - Pagaila , et al. May 7, 2	2013-05-07
Semiconductor device and method of forming bond-on-lead interconnection for mounting semiconductor die in FO-WLCSP Grant 8,435,834 - Pagaila , et al. May 7, 2	2013-05-07
Semiconductor device and method of forming a shielding layer over a semiconductor die after forming a build-up interconnect structure Grant 8,436,439 - Pagaila , et al. May 7, 2	2013-05-07
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect App 20130105989 - Pagaila; Reza A. ; et al.	2013-05-02
Semiconductor Device and Method of Forming Air Gap Adjacent to Stress Sensitive Region of the Die App 20130093068 - Pagaila; Reza A.	2013-04-18
Semiconductor Device and Method of Forming Conductive TSV With Insulating Annular Ring App 20130087928 - Pagaila; Reza A. ; et al.	2013-04-11
Semiconductor Device and Method of Forming a Shielding Layer Between Stacked Semiconductor Die App 20130087897 - Pagaila; Reza A. ; et al.	2013-04-11
Semiconductor device and method of forming vertically offset bond on trace interconnect structure on leadframe Grant 8,409,978 - Pagaila , et al. April 2, 2	2013-04-02
Semiconductor Device and Method of Forming Different Height Conductive Pillars to Electrically Interconnect Stacked Laterally Offset Semiconductor Die App 20130075903 - Pagaila; Reza A. ; et al.	2013-03-28
Semiconductor device and method of forming FO-WLCSP with recessed interconnect area in peripheralregion of semiconductor die App 20130056867 - Pagaila; Reza A. ; et al.	2013-03-07
Semiconductor device and method of forming interposer frame over semiconductor die to provide vertical interconnect Grant 8,383,457 - Pagaila , et al. February 26, 2	2013-02-26
Semiconductor device and method of forming a shielding layer between stacked semiconductor die Grant 8,378,383 - Pagaila , et al. February 19, 2	2013-02-19
Semiconductor device and method of forming cavity in build-up interconnect structure for short signal path between die Grant 8,367,470 - Pagaila February 5, 2	2013-02-05
Semiconductor device and method of forming air gap adjacent to stress sensitive region of the die Grant 8,368,187 - Pagaila February 5, 2	2013-02-05
Semiconductor device and method of forming dam material around periphery of die to reduce warpage Grant 8,367,480 - Pagaila February 5, 2	2013-02-05
Semiconductor Device and Method of Forming Base Substrate with Cavities Formed through Etch-Resistant Conductive Layer for Bump Locking App 20130015577 - Pagaila; Reza A.	2013-01-17
Semiconductor device and method of forming different height conductive pillars to electrically interconnect stacked laterally offset semiconductor die Grant 8,354,297 - Pagaila , et al. January 15, 2	2013-01-15
Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices Grant 8,349,657 - Do , et al. January 8, 2	2013-01-08
Semiconductor device and method of forming conductive TSV with insulating annular ring Grant 8,349,735 - Pagaila , et al. January 8, 2	2013-01-08
Semiconductor Device and Method of Forming FO-WLCSP with Discrete Semiconductor Components Mounted Under and Over Semiconductor Die App 20130001771 - Pagaila; Reza A. ; et al.	2013-01-03
Semiconductor Device and Method of Forming Shielding Layer Over Semiconductor Die Mounted to TSV Interposer App 20120299165 - Pagaila; Reza A.	2012-11-29
Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die App 20120292749 - Pagaila; Reza A. ; et al.	2012-11-22
Semiconductor Device and Method of Mounting Die with TSV in Cavity of Substrate for Electrical Interconnect of FI-POP App 20120292785 - Pagaila; Reza A. ; et al.	2012-11-22
Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structure App 20120286404 - Pagaila; Reza A.	2012-11-15
Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die App 20120280402 - Pagaila; Reza A. ; et al.	2012-11-08
Semiconductor Die and Method of Forming through Organic Vias having Varying Width in Peripheral Region of the Die App 20120280403 - Pagaila; Reza A. ; et al.	2012-11-08
Semiconductor device and method of forming base substrate with cavities formed through etch-resistant conductive layer for bump locking Grant 8,304,277 - Pagaila November 6, 2	2012-11-06
Semiconductor Device and Method of Forming Shielding Layer Over Active Surface of Semiconductor Die App 20120273926 - Pagaila; Reza A.	2012-11-01
Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation App 20120261818 - Pagaila; Reza A. ; et al.	2012-10-18
Semiconductor device and method of forming FO-WLCSP with discrete semiconductor components mounted under and over semiconductor die Grant 8,288,201 - Pagaila , et al. October 16, 2	2012-10-16
Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die Grant 8,283,205 - Pagaila , et al. October 9, 2	2012-10-09
Semiconductor Device and Method of Forming Thermally Conductive Layer Between Semiconductor Die and Build-Up Interconnect Structure App 20120248596 - Pagaila; Reza A. ; et al.	2012-10-04
Semiconductor Device and Method of Embedding Thermally Conductive Layer in Interconnect Structure for Heat Dissipation App 20120241940 - Pagaila; Reza A. ; et al.	2012-09-27
Apparatus for Thermally Enhanced Semiconductor Package App 20120241939 - Pagaila; Reza A. ; et al.	2012-09-27
Semiconductor device and method of forming shielding layer over semiconductor die mounted to TSV interposer Grant 8,268,677 - Pagaila September 18, 2	2012-09-18
Semiconductor Device And Method Of Forming Shielding Layer Over Semiconductor Die Mounted To Tsv Interposer App 20120228749 - Pagaila; Reza A.	2012-09-13
Semiconductor device and method of mounting die with TSV in cavity of substrate for electrical interconnect of Fi-PoP Grant 8,263,434 - Pagaila , et al. September 11, 2	2012-09-11
Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structure Grant 8,264,080 - Pagaila September 11, 2	2012-09-11
Making a semiconductor device having conductive through organic vias Grant 8,258,010 - Pagaila , et al. September 4, 2	2012-09-04
Semiconductor device and method of forming discontinuous ESD protection layers between semiconductor die Grant 8,258,012 - Pagaila , et al. September 4, 2	2012-09-04
Semiconductor Device and Method of Forming Bond Wires Between Semiconductor Die Contact Pads and Conductive TOV in Peripheral Area Around Semiconductor Die App 20120217643 - Pagaila; Reza A. ; et al.	2012-08-30
Semiconductor Device and Method of Forming Conductive THV and RDL on Opposite Sides of Semiconductor Die for RDL-to-RDL Bonding App 20120217644 - Pagaila; Reza A.	2012-08-30
Semiconductor Device and Method of Forming Interposer and Opposing Build-Up Interconnect Structure with Connecting Conductive TMV for Electrical Interconnect of FO-WLCSP App 20120217645 - Pagaila; Reza A.	2012-08-30
Semiconductor device and method of embedding bumps formed on semiconductor die into penetrable adhesive layer to reduce die shifting during encapsulation Grant 8,241,964 - Pagaila , et al. August 14, 2	2012-08-14
Semiconductor Device and Method of Forming Vertical Interconnect Structure Using Stud Bumps App 20120199972 - Pagaila; Reza A. ; et al.	2012-08-09
Semiconductor device and method of forming thermally conductive layer between semiconductor die and build-up interconnect structure Grant 8,236,617 - Pagaila , et al. August 7, 2	2012-08-07
Semiconductor device and method of embedding thermally conductive layer in interconnect structure for heat dissipation Grant 8,237,252 - Pagaila , et al. August 7, 2	2012-08-07
Semiconductor Device and Method of Forming B-Stage Conductive Polymer over Contact Pads of Semiconductor Die in Fo-WLCSP App 20120187580 - Do; Byung Tai ; et al.	2012-07-26
Apparatus for thermally enhanced semiconductor package Grant 8,227,910 - Pagaila , et al. July 24, 2	2012-07-24
Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area around the Device for Electrical Interconnection to Other Devices App 20120181689 - Do; Byung Tai ; et al.	2012-07-19
Semiconductor Device and Method of Stacking Die on Leadframe Electrically Connected by Conductive Pillars App 20120181673 - Pagaila; Reza A. ; et al.	2012-07-19
Semiconductor Device and Method of Forming Conductive Pillars in Recessed Region of Peripheral Area around the Device for Electrical Interconnection to Other Devices App 20120175770 - Do; Byung Tai ; et al.	2012-07-12
Semiconductor Device and Method of Providing Z-Interconnect Conductive Pillars with Inner Polymer Core App 20120153472 - Pagaila; Reza A. ; et al.	2012-06-21
Semiconductor device and method of forming B-stage conductive polymer over contact pads of semiconductor die in Fo-WLCSP Grant 8,193,610 - Do , et al. June 5, 2	2012-06-05
Semiconductor device and method of forming vertical interconnect structure using stud bumps Grant 8,193,034 - Pagaila , et al. June 5, 2	2012-06-05
Semiconductor Device and Method of Forming Base Substrate with Recesses for Capturing Bumped Semiconductor Die App 20120126429 - Do; Byung Tai ; et al.	2012-05-24
Semiconductor Device and Method of Forming Prefabricated EMI Shielding Frame with Cavities Containing Penetrable Material Over Semiconductor Die App 20120112327 - Pagaila; Reza A. ; et al.	2012-05-10
Semiconductor Device and Method of Mounting Pre-Fabricated Shielding Frame over Semiconductor Die App 20120112328 - Pagaila; Reza A. ; et al.	2012-05-10
Semiconductor Device and Method of Forming Stepped Interconnect Layer for Stacked Semiconductor Die App 20120112355 - Pagaila; Reza A. ; et al.	2012-05-10
Semiconductor Device and Method of Forming Prefabricated EMI Shielding Frame with Cavities Containing Penetrable Material Over Semiconductor Die App 20120112326 - Pagaila; Reza A. ; et al.	2012-05-10
Semiconductor Device and Method of Forming Stepped Interposer for Stacking and Electrically Connecting Semiconductor Die App 20120104623 - Pagaila; Reza A. ; et al.	2012-05-03
Semiconductor Device and Method of Forming Penetrable Film Encapsulant Around Semiconductor Die and Interconnect Structure App 20120104590 - Do; Byung Tai ; et al.	2012-05-03
Semiconductor Device and Method of Shielding Semiconductor Die from Inter-Device Interference App 20120104573 - Pagaila; Reza A. ; et al.	2012-05-03
Semiconductor Device and Method of Forming Stepped Interconnect Layer for Stacked Semiconductor Die App 20120104562 - Pagaila; Reza A. ; et al.	2012-05-03
Semiconductor device and method of stacking die on leadframe electrically connected by conductive pillars Grant 8,169,058 - Pagaila , et al. May 1, 2	2012-05-01
Semiconductor device and method of forming bond wires and stud bumps in recessed region of peripheral area around the device for electrical interconnection to other devices Grant 8,168,458 - Do , et al. May 1, 2	2012-05-01
Semiconductor device and method of forming conductive pillars in recessed region of peripheral area around the device for electrical interconnection to other devices Grant 8,164,184 - Do , et al. April 24, 2	2012-04-24
Semiconductor Die and Method of Forming Noise Absorbing Regions Between THVs in Peripheral Region of the Die App 20120091567 - Pagaila; Reza A. ; et al.	2012-04-19
Semiconductor device and method of forming conductive TSV with insulating annular ring App 20120068313 - Pagaila; Reza A. ; et al.	2012-03-22
Semiconductor Device And Method Of Forming Bond-on-lead Interconnection For Mounting Semiconductor Die In Fo-wlcsp App 20120061824 - Pagaila; Reza A. ; et al.	2012-03-15
Semiconductor Device and Method of Forming Base Substrate With Cavities Formed Through Etch-Resistant Conductive Layer for Bump Locking App 20120061822 - Pagaila; Reza A.	2012-03-15
Semiconductor device and method of providing z-interconnect conductive pillars with inner polymer core Grant 8,133,762 - Pagaila , et al. March 13, 2	2012-03-13
Semiconductor Device and Method of Forming Interposer Frame Over Semiconductor Die to Provide Vertical Interconnect App 20120056329 - Pagaila; Reza A. ; et al.	2012-03-08
Semiconductor Device and Method of Forming WLP With Semiconductor Die Embedded Within Penetrable Encapsulant Between TSV Interposers App 20120056321 - Pagaila; Reza A.	2012-03-08
Semiconductor Device and Method of Forming Base Leads from Base Substrate as Standoff for Stacking Semiconductor Die App 20120056314 - Pagaila; Reza A. ; et al.	2012-03-08
Semiconductor Device and Method of Forming TSV Semiconductor Wafer with Embedded Semiconductor Die App 20120056312 - Pagaila; Reza A. ; et al.	2012-03-08
Semiconductor Device and Method of Forming Different Height Conductive Pillars to Electrically Interconnect Stacked Laterally Offset Semiconductor Die App 20120056316 - Pagaila; Reza A. ; et al.	2012-03-08
Semiconductor Device and Method of Forming FO-WLCSP with Discrete Semiconductor Components Mounted Under and Over Semiconductor Die App 20120049344 - Pagaila; Reza A. ; et al.	2012-03-01
Semiconductor Device and Method of Forming Adhesive Material Over Semiconductor Die and Carrier to Reduce Die Shifting During Encapsulation App 20120049388 - Pagaila; Reza A.	2012-03-01
Semiconductor Device and Method of Forming Leadframe as Vertical Interconnect Structure Between Stacked Semiconductor Die App 20120049334 - Pagaila; Reza A. ; et al.	2012-03-01
Semiconductor Device and Method of Forming B-Stage Conductive Polymer Over Contact Pads of Semiconductor Die in FO-WLCSP App 20120038047 - Do; Byung Tai ; et al.	2012-02-16
Through Hole Vias at Saw Streets Including Protrusions or Recesses for Interconnection App 20120034777 - Pagaila; Reza A. ; et al.	2012-02-09
Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnects on Different Height Traces App 20120025373 - Pagaila; Reza A. ; et al.	2012-02-02
Semiconductor device and method of forming prefabricated EMI shielding frame with cavities containing penetrable material over semiconductor die Grant 8,105,872 - Pagaila , et al. January 31, 2	2012-01-31
Semiconductor Device and Method of Conforming Conductive Vias Between Insulating Layers in Saw Streets App 20120018899 - Pagaila; Reza A. ; et al.	2012-01-26
Semiconductor Device and Method of Conforming Conductive Vias Between Insulating Layers in Saw Streets App 20120018900 - Pagaila; Reza A. ; et al.	2012-01-26
Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structure App 20120018881 - Pagaila; Reza A.	2012-01-26
Semiconductor device and method of shielding semiconductor die from inter-device interference Grant 8,101,460 - Pagaila , et al. January 24, 2	2012-01-24
Semiconductor Device and Method of Forming Protective Layer Over Exposed Surfaces of Semiconductor Die App 20120012990 - Pagaila; Reza A. ; et al.	2012-01-19
Semiconductor device and method of mounting pre-fabricated shielding frame over semiconductor die Grant 8,097,489 - Pagaila , et al. January 17, 2	2012-01-17
Semiconductor device and method of forming stepped interconnect layer for stacked semiconductor die Grant 8,097,490 - Pagaila , et al. January 17, 2	2012-01-17
Semiconductor die and method of forming noise absorbing regions between THVS in peripheral region of the die Grant 8,093,151 - Pagaila , et al. January 10, 2	2012-01-10
Semiconductor Device and Method of Forming Vertically Offset Bond on Trace Interconnect Structure on Leadframe App 20110316132 - Pagaila; Reza A. ; et al.	2011-12-29
Semiconductor Device and Method of Forming Anisotropic Conductive Film Between Semiconductor Die and Build-Up Interconnect Structure App 20110316146 - Pagaila; Reza A. ; et al.	2011-12-29
Semiconductor Device and Method of Forming RDL Along Sloped Side Surface of Semiconductor Die for Z-Direction Interconnect App 20110316156 - Pagaila; Reza A. ; et al.	2011-12-29
Semiconductor Device and Method of Forming Dam Material Around Periphery of Die to Reduce Warpage App 20110309488 - Pagaila; Reza A.	2011-12-22
Semiconductor device and method of forming WLP with semiconductor die embedded within penetrable encapsulant between TSV interposers Grant 8,080,445 - Pagaila December 20, 2	2011-12-20
Semiconductor device and method of forming stepped-down RDL and recessed THV in peripheral region of the device Grant 8,080,882 - Do , et al. December 20, 2	2011-12-20
Semiconductor device having electrical devices mounted to IPD structure and method of shielding electromagnetic interference Grant 8,076,757 - Pagaila , et al. December 13, 2	2011-12-13
Semiconductor Device and Method of Forming Sacrificial Adhesive Over Contact Pads of Semiconductor Die App 20110298137 - Pagaila; Reza A. ; et al.	2011-12-08
Semiconductor Device And Method Of Forming Prefabricated Emi Shielding Frame With Cavities Containing Penetrable Material Over Semiconductor Die App 20110298109 - Pagaila; Reza A. ; et al.	2011-12-08
Semiconductor Device and Method of Forming Thermally Conductive Layer Between Semiconductor Die and Build-Up Interconnect Structure App 20110298110 - Pagaila; Reza A. ; et al.	2011-12-08
Semiconductor Device and Method of Forming EMI Shielding Layer with Conductive Material Around Semiconductor Die App 20110298101 - Pagaila; Reza A. ; et al.	2011-12-08
Apparatus for Thermally Enhanced Semiconductor Package App 20110298120 - Pagaila; Reza A. ; et al.	2011-12-08
Through hole vias at saw streets including protrusions or recesses for interconnection Grant 8,072,079 - Pagaila , et al. December 6, 2	2011-12-06
Semiconductor Device and Method of Forming Interconnect Structure and Mounting Semiconductor Die in Recessed Encapsulant App 20110278741 - Chua; Linda Pei Ee ; et al.	2011-11-17
Semiconductor Device and Method of Embedding Bumps Formed on Semiconductor Die Into Penetrable Adhesive Layer to Reduce Die Shifting During Encapsulation App 20110278717 - Pagaila; Reza A. ; et al.	2011-11-17
Semiconductor Device and Method of Forming Discontinuous ESD Protection Layers Between Semiconductor Die App 20110278703 - Pagaila; Reza A. ; et al.	2011-11-17
Semiconductor Device and Method of Forming Openings in Thermally-Conductive Frame of FO-WLCSP to Dissipate Heat and Reduce Package Height App 20110260303 - Pagaila; Reza A. ; et al.	2011-10-27
Semiconductor Device and Method of Forming Conductive Vias with Trench in Saw Street App 20110254173 - Do; Byung Tai ; et al.	2011-10-20
Semiconductor device and method of dual-molding die formed on opposite sides of build-up interconnect structures Grant 8,039,304 - Pagaila October 18, 2	2011-10-18
Semiconductor device and method of forming vertically offset bond on trace interconnects on different height traces Grant 8,039,384 - Pagaila , et al. October 18, 2	2011-10-18
Semiconductor device and method of conforming conductive vias between insulating layers in saw streets Grant 8,030,136 - Pagaila , et al. October 4, 2	2011-10-04
Method and apparatus for thermally enhanced semiconductor package Grant 8,021,907 - Pagaila , et al. September 20, 2	2011-09-20
Semiconductor device and method of forming dam material around periphery of die to reduce warpage Grant 8,021,930 - Pagaila September 20, 2	2011-09-20
Semiconductor Device And Method Of Forming Vertically Offset Bond On Trace Interconnects On Different Height Traces App 20110221058 - Pagaila; Reza A. ; et al.	2011-09-15
Semiconductor Device and Method of Forming 3D Inductor from Prefabricated Pillar Frame App 20110204472 - Pagaila; Reza A. ; et al.	2011-08-25
Semiconductor Device and Method of Forming TMV and TSV in WLCSP Using Same Carrier App 20110204505 - Pagaila; Reza A. ; et al.	2011-08-25
Semiconductor device and method of forming conductive vias with trench in saw street Grant 7,993,976 - Do , et al. August 9, 2	2011-08-09
Semiconductor Device and Method of Forming Air Gap Adjacent to Stress Sensitive Region of the Die App 20110186973 - Pagaila; Reza A.	2011-08-04
Semiconductor Device and Method of Forming Cavity Adjacent to Sensitive Region of Semiconductor Die Using Wafer-Level Underfill Material App 20110187005 - Pagaila; Reza A. ; et al.	2011-08-04
Semiconductor Device and Method of Forming Adhesive Material to Secure Semiconductor Die to Carrier in WLCSP App 20110074014 - Pagaila; Reza A. ; et al.	2011-03-31
Semiconductor Device and Method of Forming Interposer with Opening to Contain Semiconductor Die App 20110068459 - Pagaila; Reza A. ; et al.	2011-03-24
Semiconductor Device and Method of Forming Dual-Active Sided Semiconductor Die in Fan-Out Wafer Level Chip Scale Package App 20110045634 - Pagaila; Reza A.	2011-02-24
Semiconductor Device and Method of Stacking Die on Leadframe Electrically Connected by Conductive Pillars App 20110042798 - Pagaila; Reza A. ; et al.	2011-02-24
Semiconductor Device and Method of Dual-Molding Die Formed on Opposite Sides of Build-Up Interconnect Structures App 20110037169 - Pagaila; Reza A.	2011-02-17
Semiconductor Device and Method of Forming Dam Material Around Periphery of Die to Reduce Warpage App 20110037155 - Pagaila; Reza A.	2011-02-17
Semiconductor Device and Method of Forming Cavity in Build-Up Interconnect Structure for Short Signal Path Between Die App 20110031634 - Pagaila; Reza A.	2011-02-10
Semiconductor Device and Method of Mounting Die with TSV in Cavity of Substrate for Electrical Interconnect of FI-POP App 20110024888 - Pagaila; Reza A. ; et al.	2011-02-03
Semiconductor Device and Method of Embedding Thermally Conductive Layer in Interconnect Structure for Heat Dissipation App 20110018114 - Pagaila; Reza A. ; et al.	2011-01-27
Semiconductor Device and Method of Forming Conductive TSV in Peripheral Region of Die Prior to Wafer Singulaton App 20110014746 - Do; Byung Tai ; et al.	2011-01-20
Semiconductor Device and Method of Forming a Shielding Layer Over a Semiconductor Die After Forming a Build-Up Interconnect Structure App 20100320577 - Pagaila; Reza A. ; et al.	2010-12-23
Semiconductor Device and Method of Forming Conductive Vias with Trench in Saw Street App 20100317153 - Do; Byung Tai ; et al.	2010-12-16
Semiconductor Device and Method of Forming a 3D Inductor from Prefabricated Pillar Frame App 20100289126 - Pagaila; Reza A. ; et al.	2010-11-18
Semiconductor Device and Method of Forming Conductive Pillars in Recessed Region of Peripheral Area Around the Device for Electrical Interconnection to Other Devices App 20100270656 - Do; Byung Tai ; et al.	2010-10-28
Semiconductor Device Having Electrical Devices Mounted to IPD Structure and Method of Shielding Electromagnetic Interference App 20100270661 - Pagaila; Reza A. ; et al.	2010-10-28
Semiconductor Device and Method of Forming a Shielding Layer Between Stacked Semiconductor Die App 20100244208 - Pagaila; Reza A. ; et al.	2010-09-30
Semiconductor Device and Method of Providing Z-Interconnect Conductive Pillars with Inner Polymer Core App 20100237495 - Pagaila; Reza A. ; et al.	2010-09-23
Semiconductor Die and Method of Forming Through Organic Vias Having Varying Width in Peripheral Region of the Die App 20100237471 - Pagaila; Reza A. ; et al.	2010-09-23
Semiconductor Device and Method of Mounting Pre-Fabricated Shielding Frame over Semiconductor Die App 20100237477 - Pagaila; Reza A. ; et al.	2010-09-23
Semiconductor Die and Method of Forming Noise Absorbing Regions Between THVS in Peripheral Region of the Die App 20100230822 - Pagaila; Reza A. ; et al.	2010-09-16
Semiconductor Device and Method of Forming Through Vias with Reflowed Conductive Material App 20100213618 - Pagaila; Reza A. ; et al.	2010-08-26
Semiconductor Device and Method of Forming Through Vias with Reflowed Conductive Material App 20100216281 - Pagaila; Reza A. ; et al.	2010-08-26
Semiconductor Device and Method of Forming Recessed Conductive Vias in Saw Streets App 20100155922 - Pagaila; Reza A. ; et al.	2010-06-24
Semiconductor Device and Method of Forming Conductive Pillars in Recessed Region of Peripheral Area Around the Device for Electrical Interconnection to Other Devices App 20100140795 - Do; Byung Tai ; et al.	2010-06-10
Semiconductor Device and Method of Forming a Shielding Layer over a Semiconductor Die after Forming a Build-Up Interconnect Structure App 20100140759 - Pagaila; Reza A. ; et al.	2010-06-10
Semiconductor Device and Method of Forming Bond Wires and Stud Bumps in Recessed Region of Peripheral Area Around the Device for Electrical Interconnection to Other Devices App 20100140783 - Do; Byung Tai ; et al.	2010-06-10
Semiconductor Device and Method of Forming WLCSP Using Wafer Sections Containing Multiple Die App 20100127360 - Pagaila; Reza A. ; et al.	2010-05-27
Semiconductor Device and Method of Forming Double-Sided Through Vias in Saw Streets App 20100102456 - Pagaila; Reza A. ; et al.	2010-04-29
Semiconductor Device and Method of Forming Stepped-Down RDL and Recessed THV in Peripheral Region of the Device App 20100096731 - Do; Byung Tai ; et al.	2010-04-22
Semiconductor Device and Method of Forming Embedded Passive Circuit Elements Interconnected to Through Hole Vias App 20100072570 - Pagaila; Reza A. ; et al.	2010-03-25
Semiconductor Device and Method of Forming Shielding Along a Profile Disposed in Peripheral Region Around the Device App 20100019359 - Pagaila; Reza A. ; et al.	2010-01-28
Semiconductor Device And Method Of Forming Stepped-down Rdl And Recessed Thv In Peripheral Region Of The Device App 20100007029 - Do; Byung Tai ; et al.	2010-01-14
Semiconductor Device and Method of Shielding Semiconductor Die from Inter-Device Interference App 20090302435 - Pagaila; Reza A. ; et al.	2009-12-10
Method and Apparatus for Thermally Enhanced Semiconductor Package App 20090302445 - Pagaila; Reza A. ; et al.	2009-12-10
Semiconductor device and method of forming recessed conductive vias in saw streets App 20090302478 - Pagaila; Reza A. ; et al.	2009-12-10
Semiconductor Device Having Electrical Devices Mounted to IPD Structure and Method of Shielding Electromagnetic Interference App 20090302439 - Pagaila; Reza A. ; et al.	2009-12-10
Semiconductor Device and Method of Forming Through Vias with Reflowed Conductive Material App 20090294914 - Pagaila; Reza A. ; et al.	2009-12-03
Semiconductor Device And Method Of Forming Embedded Passive Circuit Elements Interconnected To Through Hole Vias App 20090294899 - Pagaila; Reza A. ; et al.	2009-12-03
Semiconductor Device and Method of Forming Double-Sided Through Vias in Saw Streets App 20090294911 - Pagaila; Reza A. ; et al.	2009-12-03
Semiconductor Device and Method of Conforming Conductive Vias Between Insulating Layers in Saw Streets App 20090283870 - Pagaila; Reza A. ; et al.	2009-11-19
Semiconductor Device and Method of Forming Vertical Interconnect Structure Using Stud Bumps App 20090261466 - Pagaila; Reza A. ; et al.	2009-10-22
Through Hole Vias at Saw Streets Including Protrusions or Recesses for Interconnection App 20090243045 - Pagaila; Reza A. ; et al.	2009-10-01