Paek; Jong Sik

Patent Applications and Registrations

Patent applications and USPTO patent grants for Paek; Jong Sik.The latest application filed is for "stacked semiconductor dies for semiconductor device assemblies".

Company Profile

18.73.75

Paek; Jong Sik - Taichung TW
Paek; Jong Sik - Incheon KR
Paek; Jong Sik - Seongnam-si KR
Paek; Jong Sik - Kyunggi-do KR
Paek; Jong Sik - Gyeonggi-do KR
Paek; Jong Sik - Seoul KR
- Kyunggi-do KR
Paek; Jong Sik - Kwangju-shi KR
Paek; Jong Sik - Kwanglu-shi KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Face-to-face semiconductor device with fan-out porch Grant 11,456,289 - Paek , et al. September 27, 2	2022-09-27
Stacked Semiconductor Dies For Semiconductor Device Assemblies App 20220271013 - Ko; Yeongbeom ; et al.	2022-08-25
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Grant 11,424,180 - Paek , et al. August 23, 2	2022-08-23
Semiconductor Device Assemblies And Systems With One Or More Dies At Least Partially Embedded In A Redistribution Layer (rdl) And Methods For Making The Same App 20220208713 - Paek; Jong Sik ; et al.	2022-06-30
Stacked semiconductor dies for semiconductor device assemblies Grant 11,362,071 - Ko , et al. June 14, 2	2022-06-14
Semiconductor Package And Manufacturing Method Thereof App 20220148987 - Paek; Jong Sik ; et al.	2022-05-12
Semiconductor Device And Manufacturing Method Thereof App 20220148886 - Paek; Jong Sik ; et al.	2022-05-12
Semiconductor Device And Manufacturing Method Thereof App 20220059490 - Paek; Jong Sik ; et al.	2022-02-24
Stacked Semiconductor Dies For Semiconductor Device Assemblies App 20220059500 - Ko; Yeongbeom ; et al.	2022-02-24
Semiconductor package and manufacturing method thereof Grant 11,121,102 - Paek , et al. September 14, 2	2021-09-14
Semiconductor Device And Manufacturing Method Thereof App 20210265174 - Do; Won Chul ; et al.	2021-08-26
Semiconductor device and manufacturing method thereof Grant 11,101,144 - Paek , et al. August 24, 2	2021-08-24
Wafer Level Fan Out Semiconductor Device And Manufacturing Method Thereof App 20210217717 - Jung; Boo Yang ; et al.	2021-07-15
Methods Of Forming Semiconductor Dies With Perimeter Profiles For Stacked Die Packages App 20210202318 - Ko; Yeongbeom ; et al.	2021-07-01
Face-to-face Semiconductor Device With Fan-out Porch App 20210202454 - Paek; Jong Sik ; et al.	2021-07-01
Semiconductor device having upper and lower redistribution layers Grant 11,043,464 - Paek , et al. June 22, 2	2021-06-22
Ground Connection For Semiconductor Device Assembly App 20210175182 - Paek; Jong Sik ; et al.	2021-06-10
Semiconductor Devices With Package-level Compartmental Shielding And Associated Systems And Methods App 20210143073 - Kwon; Youngik ; et al.	2021-05-13
Semiconductor device and manufacturing method thereof Grant 10,985,031 - Do , et al. April 20, 2	2021-04-20
Wafer level fan out semiconductor device and manufacturing method thereof Grant 10,903,181 - Jung , et al. January 26, 2	2021-01-26
Semiconductor Device And Manufacturing Method Thereof App 20210020591 - Paek; Jong Sik ; et al.	2021-01-21
Semiconductor Device With Redistribution Layers On Partial Encapsulation And Non-photosensitive Passivation Layers App 20200365504 - Paek; Jong Sik ; et al.	2020-11-19
Semiconductor Package And Manufacturing Method Thereof App 20200328170 - Paek; Jong Sik ; et al.	2020-10-15
Semiconductor Device And Manufacturing Method Thereof App 20200303212 - Paek; Jong Sik ; et al.	2020-09-24
Semiconductor device having an encapsulated front side and interposer and manufacturing method thereof Grant 10,679,952 - Paek , et al.	2020-06-09
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Grant 10,672,699 - Paek , et al.	2020-06-02
Semiconductor package and manufacturing method thereof Grant 10,535,620 - Paek , et al. Ja	2020-01-14
Semiconductor device and manufacturing method thereof Grant 10,515,825 - Paek , et al. Dec	2019-12-24
Semiconductor device and manufacturing method thereof Grant 10,483,222 - Paek , et al. Nov	2019-11-19
Semiconductor Device And Manufacturing Method Thereof App 20190279881 - Do; Won Chul ; et al.	2019-09-12
Semiconductor Device With Redistribution Layers On Partial Encapsulation And Non-photosensitive Passivation Layers App 20190229050 - Paek; Jong Sik ; et al.	2019-07-25
Semiconductor device and manufacturing method thereof Grant 10,297,466 - Do , et al.	2019-05-21
Semiconductor Device And Manufacturing Method Thereof App 20190067035 - Paek; Jong Sik ; et al.	2019-02-28
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Grant 10,199,322 - Paek , et al. Fe	2019-02-05
Semiconductor device and manufacturing method thereof Grant 10,163,855 - Paek , et al. Dec	2018-12-25
Semiconductor Device And Manufacturing Method Thereof App 20180366432 - Paek; Jong Sik ; et al.	2018-12-20
Semiconductor device and manufacturing method thereof Grant 10,128,176 - Paek , et al. November 13, 2	2018-11-13
Semiconductor device and manufacturing method thereof Grant 10,090,185 - Paek , et al. October 2, 2	2018-10-02
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20180269145 - Paek; Jong Sik ; et al.	2018-09-20
Semiconductor device and manufacturing method thereof Grant 10,079,157 - Paek , et al. September 18, 2	2018-09-18
Semiconductor Device And Manufacturing Method Thereof App 20180261468 - Do; Won Chul ; et al.	2018-09-13
Semiconductor Package And Manufacturing Method Thereof App 20180240768 - Paek; Jong Sik ; et al.	2018-08-23
Semiconductor device and manufacturing method thereof Grant 10,032,740 - Paek , et al. July 24, 2	2018-07-24
Semiconductor Device With Redistribution Layers On Partial Encapsulation And Non-photosensitive Passivation Layers App 20180138117 - Paek; Jong Sik ; et al.	2018-05-17
Semiconductor device and manufacturing method thereof Grant 9,966,276 - Do , et al. May 8, 2	2018-05-08
Semiconductor package and manufacturing method thereof Grant 9,929,113 - Paek , et al. March 27, 2	2018-03-27
Semiconductor Device And Manufacturing Method Thereof App 20180076172 - Paek; Jong Sik ; et al.	2018-03-15
Semiconductor package using a contact in a pleated sidewall encapsulant opening Grant 9,871,011 - Kim , et al. January 16, 2	2018-01-16
Semiconductor device and manufacturing method thereof Grant 9,818,721 - Paek , et al. November 14, 2	2017-11-14
Semiconductor device with redistribution layers on partial encapsulation and non-photosensitive passivation layers Grant 9,818,685 - Paek , et al. November 14, 2	2017-11-14
Wafer Level Fan Out Semiconductor Device And Manufacturing Method Thereof App 20170323862 - Jung; Boo Yang ; et al.	2017-11-09
Semiconductor device and manufacturing method thereof Grant 9,793,180 - Ahn , et al. October 17, 2	2017-10-17
Wafer level fan out semiconductor device and manufacturing method thereof Grant 9,748,154 - Jung , et al. August 29, 2	2017-08-29
Semiconductor device and manufacturing method thereof Grant 9,728,514 - Paek , et al. August 8, 2	2017-08-08
Semiconductor Device And Manufacturing Method Thereof App 20170213755 - Paek; Jong Sik ; et al.	2017-07-27
Semiconductor package with semiconductor die directly attached to lead frame and method Grant 9,711,484 - Paek , et al. July 18, 2	2017-07-18
Semiconductor Device And Manufacturing Method Thereof App 20170170107 - Paek; Jong Sik ; et al.	2017-06-15
Semiconductor Device And Manufacturing Method Thereof App 20170154861 - Paek; Jong Sik ; et al.	2017-06-01
Semiconductor Device And Manufacturing Method Thereof App 20170125264 - Do; Won Chul ; et al.	2017-05-04
Semiconductor Device And Manufacturing Method Thereof App 20170062372 - Paek; Jong Sik ; et al.	2017-03-02
Semiconductor Package And Manufacturing Method Thereof App 20170062364 - Paek; Jong Sik ; et al.	2017-03-02
Semiconductor device and manufacturing method thereof Grant 9,536,858 - Do , et al. January 3, 2	2017-01-03
Semiconductor Device And Manufacturing Method Thereof App 20160379915 - Lee; Wang Gu ; et al.	2016-12-29
Semiconductor device and manufacturing method thereof Grant 9,524,906 - Paek , et al. December 20, 2	2016-12-20
Semiconductor device with plated pillars and leads Grant 9,502,375 - Paek , et al. November 22, 2	2016-11-22
Semiconductor Device And Manufacturing Method Thereof App 20160322317 - Paek; Jong Sik ; et al.	2016-11-03
Semiconductor device and manufacturing method thereof Grant 9,484,331 - Paek , et al. November 1, 2	2016-11-01
Electronic device package structure and method of fabricating the same Grant 9,478,517 - Paek , et al. October 25, 2	2016-10-25
Semiconductor Device And Manufacturing Method Thereof App 20160276309 - Paek; Jong Sik ; et al.	2016-09-22
Semiconductor device and manufacturing method thereof Grant 9,449,946 - Sung , et al. September 20, 2	2016-09-20
Semiconductor device with reduced thickness Grant 9,418,922 - Paek , et al. August 16, 2	2016-08-16
Semiconductor Package Using A Contact In A Pleated Sidewall Encapsulant Opening App 20160233187 - Kim; Jae Yun ; et al.	2016-08-11
Semiconductor device and manufacturing method thereof Grant 9,406,638 - Paek , et al. August 2, 2	2016-08-02
Semiconductor device and manufacturing method thereof Grant 9,391,043 - Paek , et al. July 12, 2	2016-07-12
Semiconductor Device With Redistribution Layers On Partial Encapsulation And Non-photosensitive Passivation Layers App 20160197032 - Paek; Jong Sik ; et al.	2016-07-07
Semiconductor Device And Manufacturing Method Thereof App 20160189980 - Paek; Jong Sik ; et al.	2016-06-30
Semiconductor Package And Manufacturing Method Thereof App 20160163662 - Paek; Jong Sik ; et al.	2016-06-09
Semiconductor Package With Semiconductor Die Directly Attached To Lead Frame And Method App 20160141229 - Paek; Jong Sik ; et al.	2016-05-19
Semiconductor Device And Manufacturing Method Thereof App 20160111391 - Paek; Jong Sik ; et al.	2016-04-21
Semiconductor device and manufacturing method thereof Grant 9,219,042 - Paek , et al. December 22, 2	2015-12-22
Semiconductor device Grant 9,196,601 - Park , et al. November 24, 2	2015-11-24
Semiconductor device utilizing redistribution layers to couple stacked die Grant 9,190,370 - Paek , et al. November 17, 2	2015-11-17
Semiconductor Device Utilizing Redistribution Layers To Couple Stacked Die App 20150262945 - Paek; Jong Sik ; et al.	2015-09-17
Semiconductor Device And Manufacturing Method Thereof App 20150255422 - Paek; Jong Sik ; et al.	2015-09-10
Semiconductor device and manufacturing method thereof Grant 9,123,543 - Jin , et al. September 1, 2	2015-09-01
Semiconductor Device With Reduced Thickness App 20150221586 - Paek; Jong Sik ; et al.	2015-08-06
Semiconductor Device And Manufacturing Method Thereof App 20150221573 - Paek; Jong Sik ; et al.	2015-08-06
Semiconductor Device And Manufacturing Method Thereof App 20150206807 - Ahn; Seo Yeon ; et al.	2015-07-23
Semiconductor Device And Manufacturing Method Thereof App 20150200179 - Do; Won Chul ; et al.	2015-07-16
Semiconductor device utilzing redistribution layers to couple stacked die Grant 9,048,241 - Paek , et al. June 2, 2	2015-06-02
Semiconductor device and manufacturing method thereof Grant 9,048,125 - Paek , et al. June 2, 2	2015-06-02
Semiconductor device and manufacturing method thereof Grant 9,000,586 - Do , et al. April 7, 2	2015-04-07
Electronic Device Package Structure And Method Fabricating The Same App 20150049421 - Paek; Jong Sik ; et al.	2015-02-19
Semiconductor Package with Reduced Thickness App 20150041980 - Ahn; Seo Yeon ; et al.	2015-02-12
Semiconductor Device With Plated Conductive Pillar Coupling App 20150021767 - Park; Doo Hyun ; et al.	2015-01-22
Semiconductor Device App 20150021791 - Park; Doo Hyun ; et al.	2015-01-22
Semiconductor Device With Plated Pillars And Leads App 20150021751 - Paek; Jong Sik ; et al.	2015-01-22
Semiconductor Device Utilzing Redistribution Layers To Couple Stacked Die App 20150014830 - Paek; Jong Sik ; et al.	2015-01-15
Semiconductor Device And Manufacturing Method Thereof App 20140284785 - Sung; Pil Je ; et al.	2014-09-25
Semiconductor Device And Manufacturing Method Thereof App 20140138817 - Paek; Jong Sik ; et al.	2014-05-22
Semiconductor Device And Manufacturing Method Thereof App 20140131886 - Paek; Jong Sik ; et al.	2014-05-15
Semiconductor Device And Manufacturing Method Thereof App 20140131856 - Do; Won Chul ; et al.	2014-05-15
Semiconductor Device And Method Of Manufacturing Semiconductor Device App 20140124949 - Paek; Jong Sik ; et al.	2014-05-08
Semiconductor device and fabricating method thereof Grant 8,618,658 - Paek , et al. December 31, 2	2013-12-31
Semiconductor device and fabricating method thereof Grant 08618658 -	2013-12-31
Stackable wafer level package and fabricating method thereof Grant 8,446,017 - Paek , et al. May 21, 2	2013-05-21
Semiconductor device and manufacturing method thereof Grant 8,362,612 - Paek , et al. January 29, 2	2013-01-29
Semiconductor device having redistribution layer Grant 8,058,726 - Jin , et al. November 15, 2	2011-11-15
Stackable Wafer Level Package And Fabricating Method Thereof App 20110068427 - PAEK; Jong Sik ; et al.	2011-03-24
Semiconductor package and fabricating method thereof Grant 7,808,105 - Paek October 5, 2	2010-10-05
Wafer level chip scale package and manufacturing method for the same Grant 7,446,422 - Paek , et al. November 4, 2	2008-11-04
Image sensor package and its manufacturing method Grant 7,359,579 - Paek , et al. April 15, 2	2008-04-15
Wafer level chip scale package Grant 7,335,986 - Paek , et al. February 26, 2	2008-02-26
Semiconductor package and manufacturing method thereof App 20060261458 - Paek; Jong Sik ; et al.	2006-11-23
Semiconductor package including flip chip Grant 7,045,882 - Paek May 16, 2	2006-05-16
Semiconductor package and method for manufacturing the same Grant 7,045,893 - Paek , et al. May 16, 2	2006-05-16
Wafer-level chip-scale package Grant 6,987,319 - Paek , et al. January 17, 2	2006-01-17
Semiconductor package Grant 6,953,988 - Seo , et al. October 11, 2	2005-10-11
Reduced size semiconductor package with stacked dies Grant 6,927,478 - Paek August 9, 2	2005-08-09
Reduced size semiconductor package with stacked dies App 20050156292 - Paek, Jong Sik	2005-07-21
Semiconductor package App 20050062148 - Seo, Seong Min ; et al.	2005-03-24
Semiconductor package Grant 6,858,919 - Seo , et al. February 22, 2	2005-02-22
Semiconductor package including flip chip App 20050029636 - Paek, Jong Sik	2005-02-10
Semiconductor package and method for manufacturing the same Grant 6,846,704 - Paek January 25, 2	2005-01-25
Wafer-level chip-scale package Grant 6,841,874 - Paek , et al. January 11, 2	2005-01-11
Semiconductor package including flip chip Grant 6,803,645 - Paek October 12, 2	2004-10-12
Semiconductor package including stacked chips with aligned input/output pads Grant 6,759,737 - Seo , et al. July 6, 2	2004-07-06
Optical device packages having improved conductor efficiency, optical coupling and thermal transfer Grant 6,740,950 - Paek May 25, 2	2004-05-25
Semiconductor package and method for manufacturing the same App 20040065905 - Paek, Jong Sik	2004-04-08
Semiconductor package and method for manufacturing the same Grant 6,700,187 - Paek March 2, 2	2004-03-02
Semiconductor package and method for manufactruing the same App 20020140065 - Paek, Jong Sik	2002-10-03
Optical device packages having improved conductor efficiency, optical coupling and thermal transfer App 20020093078 - Paek, Jong Sik	2002-07-18
Semiconductor package with stacked dies App 20020093087 - Paek, Jong Sik	2002-07-18
Semiconductor package with stacked dies App 20020093093 - Paek, Jong Sik	2002-07-18
Semiconductor package including flip chip App 20020084534 - Paek, Jong Sik	2002-07-04
Semiconductor package App 20020020907 - Seo, Seong Min ; et al.	2002-02-21

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