loadpatents
name:-0.038381099700928
name:-0.036803007125854
name:-0.0012619495391846
OYAMATSU; Hisato Patent Filings

OYAMATSU; Hisato

Patent Applications and Registrations

Patent applications and USPTO patent grants for OYAMATSU; Hisato.The latest application filed is for "memory device and memory system".

Company Profile
0.32.30
  • OYAMATSU; Hisato - Seoul KR
  • OYAMATSU; Hisato - Yokohama-shi JP
  • Oyamatsu; Hisato - Yokohama JP
  • Oyamatsu; Hisato - Kanagawa-ken JP
  • Oyamatsu; Hisato - Tokyo JP
  • Oyamatsu; Hisato - Kawasaki JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Memory Device And Memory System
App 20170249210 - OYAMATSU; Hisato
2017-08-31
Magnetic Memory Device
App 20150228695 - KOBAYASHI; Shinya ;   et al.
2015-08-13
Magnetic memory device
Grant 9,041,130 - Kobayashi , et al. May 26, 2
2015-05-26
Magnetic Memory Device
App 20150069546 - KOBAYASHI; Shinya ;   et al.
2015-03-12
Manufacturing system for semiconductor device capable of controlling variation in electrical property of element in wafer surface and method for manufacturing the semiconductor device
Grant 8,735,181 - Fujii , et al. May 27, 2
2014-05-27
Semiconductor device having metal silicide layer on source/drain region and gate electrode and method of manufacturing the same
Grant RE42,180 - Oyamatsu , et al. March 1, 2
2011-03-01
Semiconductor device having channel with cooling fluid and manufacturing method thereof
Grant 7,741,159 - Oyamatsu June 22, 2
2010-06-22
Semiconductor Device And Manufacturing Method Thereof
App 20090269904 - OYAMATSU; Hisato
2009-10-29
Cooling semiconductor device and manufacturing method thereof
Grant 7,569,931 - Oyamatsu August 4, 2
2009-08-04
Manufacturing System For Semiconductor Device Capable Of Controlling Variation In Electrical Property Of Element In Wafer Surface And Method For Manufacturing The Semiconductor Device
App 20090114853 - FUJII; Osamu ;   et al.
2009-05-07
Semiconductor device substrate including a single-crystalline layer and method of manufacturing semiconductor device substrate
Grant 7,521,300 - Nagano , et al. April 21, 2
2009-04-21
Semiconductor device using partial SOI substrate and manufacturing method thereof
Grant 7,439,112 - Nagano , et al. October 21, 2
2008-10-21
Semiconductor Integrated Circuit Device
App 20070267680 - Uchino; Yukinori ;   et al.
2007-11-22
Semiconductor device and manufacturing method thereof
App 20070117306 - Oyamatsu; Hisato
2007-05-24
Semiconductor device comprising multiple layers with trenches formed on a semiconductor substrate
Grant 7,187,035 - Nagano , et al. March 6, 2
2007-03-06
Semiconductor device having metal silicide layer on source/drain region and gate electrode and method of manufacturing the same
Grant 7,176,536 - Oyamatsu , et al. February 13, 2
2007-02-13
Semiconductor chip which combines bulk and SOI regions and separates same with plural isolation regions
Grant 7,148,543 - Yamada , et al. December 12, 2
2006-12-12
Semiconductor device using partial SOI substrate and manufacturing method thereof
App 20060273330 - Nagano; Hajime ;   et al.
2006-12-07
Semiconductor device substrate and method of manufacturing semiconductor device substrate
App 20060234478 - Nagano; Hajime ;   et al.
2006-10-19
Semiconductor device using partial SOI substrate and manufacturing method thereof
Grant 7,112,822 - Nagano , et al. September 26, 2
2006-09-26
Semiconductor device having patterned SOI structure and method for fabricating the same
Grant 7,098,146 - Oyamatsu August 29, 2
2006-08-29
Semiconductor chip having multiple functional blocks integrated in a single chip and method for fabricating the same
Grant 7,018,904 - Yamada , et al. March 28, 2
2006-03-28
Semiconductor device having one of patterned SOI and SON structure
Grant 6,906,384 - Yamada , et al. June 14, 2
2005-06-14
Semiconductor device having patterned SOI structure and method for fabricating the same
App 20050121722 - Oyamatsu, Hisato
2005-06-09
Semiconductor device having metal silicide layer on source/drain region and gate electrode and method of manufacturing the same
App 20050106833 - Oyamatsu, Hisato ;   et al.
2005-05-19
Semiconductor device using partial SOI substrate and manufacturing method thereof
App 20050093066 - Nagano, Hajime ;   et al.
2005-05-05
Semiconductor device having patterned SOI structure and method for fabricating the same
Grant 6,861,374 - Oyamatsu March 1, 2
2005-03-01
Semiconductor device using partial SOI substrate and manufacturing method thereof
Grant 6,855,976 - Nagano , et al. February 15, 2
2005-02-15
Semiconductor chip having multiple functional blocks integrated in a single chip and method for fabricating the same
App 20050019999 - Yamada, Takashi ;   et al.
2005-01-27
Semiconductor chip which combines bulk and SOI regions and separates same with plural isolation regions
Grant 6,835,981 - Yamada , et al. December 28, 2
2004-12-28
Semiconductor device with an improved gate electrode pattern and a method of manufacturing the same
Grant 6,833,301 - Oyamatsu December 21, 2
2004-12-21
Method for manufacturing multilayer wiring structure semiconductor device
Grant 6,828,222 - Oyamatsu December 7, 2
2004-12-07
Semiconductor device
App 20040227206 - Oyamatsu, Hisato
2004-11-18
Method of manufacturing a semiconductor device including a plurality of kinds of MOS transistors having different gate widths
Grant 6,815,280 - Oyamatsu November 9, 2
2004-11-09
Semiconductor chip which combines bulk and SOI regions and separates same with plural isolation regions
App 20040195626 - Yamada, Takashi ;   et al.
2004-10-07
Semiconductor device having patterned SOI structure and method for fabricating the same
App 20040169226 - Oyamatsu, Hisato
2004-09-02
Semiconductor device including a plurality of kinds of MOS transistors and method of manufacturing the same
App 20040169235 - Oyamatsu, Hisato
2004-09-02
Semiconductor device
Grant 6,768,182 - Oyamatsu July 27, 2
2004-07-27
Semiconductor device including a plurality of kinds of MOS transistors having different gate widths and method of manufacturing the same
Grant 6,734,506 - Oyamatsu May 11, 2
2004-05-11
Semiconductor device having patterned SOI structure and method for fabricating the same
Grant 6,724,046 - Oyamatsu April 20, 2
2004-04-20
Semiconductor device with an improved gate electrode pattern and a method of manufacturing the same
App 20040029327 - Oyamatsu, Hisato
2004-02-12
Semiconductor device with an improved gate electrode pattern
Grant 6,653,695 - Oyamatsu November 25, 2
2003-11-25
Semiconductor device having one of patterned SOI and SON structure
App 20030201512 - Yamada, Takashi ;   et al.
2003-10-30
Semiconductor device and method for manufacturing same
App 20030197275 - Oyamatsu, Hisato
2003-10-23
Semiconductor device having one of patterned SOI and SON structure
App 20030151112 - Yamada, Takashi ;   et al.
2003-08-14
Semiconductor device and method for manufacturing same
Grant 6,593,654 - Oyamatsu July 15, 2
2003-07-15
Semiconductor device using partial SOI substrate and manufacturing method thereof
App 20030122124 - Nagano, Hajime ;   et al.
2003-07-03
Semiconductor device having patterned SOI structure and method for fabricating the same
App 20030119228 - Oyamatsu, Hisato
2003-06-26
Semiconductor wafer, method of manufacturing the same and semiconductor device
App 20030102530 - Matsumoto, Masahiko ;   et al.
2003-06-05
Semiconductor device including a plurality of kinds of MOS transistors and method of manufacturing the same
App 20030071279 - Oyamatsu, Hisato
2003-04-17
Semiconductor chip having multiple functional blocks integrated in a single chip and method forfabricating the same
App 20030057487 - Yamada, Takashi ;   et al.
2003-03-27
Semiconductor device substrate and method of manufacturing semiconductor device substrate
App 20030057490 - Nagano, Hajime ;   et al.
2003-03-27
Semiconductor Device And Method For Manufacturing Same
App 20020070455 - OYAMATSU, HISATO
2002-06-13
A Semiconductor Device With An Improved Gate Electrode Pattern And A Method Of Manufacturing The Same
App 20020030236 - OYAMATSU, HISATO
2002-03-14
Semiconductor device
App 20020024112 - Oyamatsu, Hisato
2002-02-28
N-channel MOSFET having STI structure and method for manufacturing the same
Grant 6,261,920 - Oyamatsu July 17, 2
2001-07-17
Semiconductor apparatus and manufacturing method therefor
Grant 6,204,539 - Oyamatsu March 20, 2
2001-03-20
Semiconductor device having structure suitable for CMP process
Grant 6,091,130 - Oyamatsu , et al. July 18, 2
2000-07-18
Method for manufacturing a semiconductor device having a limited pocket region
Grant 5,923,969 - Oyamatsu July 13, 1
1999-07-13
Method of fabricating semiconductor device
Grant 5,512,500 - Oyamatsu April 30, 1
1996-04-30
Method for manufacturing MOSFET having an LDD structure
Grant 5,424,229 - Oyamatsu June 13, 1
1995-06-13

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.

© 2024 USPTO.report | Privacy Policy | Resources | RSS Feed of Trademarks | Trademark Filings Twitter Feed