OYA; Daisuke
Patent Applications and Registrations
Patent applications and USPTO patent grants for OYA; Daisuke.The latest application filed is for "semiconductor device and power converter".
- OYA; Daisuke - Tokyo JP
- Oya; Daisuke - Chiyoda-ku JP
| Patent | Date |
|---|---|
| Semiconductor Device And Power Converter App 20220165631 - OYA; Daisuke | 2022-05-26 |
| Semiconductor module and power conversion apparatus Grant 11,271,043 - Morisaki , et al. March 8, 2 | 2022-03-08 |
| Aluminum/ceramic Bonding Substrate And Method For Producing Same App 20220033317 - Kobayashi; Koji ; et al. | 2022-02-03 |
| Semiconductor Device App 20210217675 - OYA; Daisuke ; et al. | 2021-07-15 |
| Semiconductor-mounting Heat Dissipation Base Plate And Production Method Therefor App 20210121943 - Tanaka; Keisuke ; et al. | 2021-04-29 |
| Semiconductor-mounting heat dissipation base plate and production method therefor Grant 10,898,946 - Tanaka , et al. January 26, 2 | 2021-01-26 |
| Semiconductor Module And Power Conversion Apparatus App 20200266240 - MORISAKI; Shota ; et al. | 2020-08-20 |
| Semiconductor device Grant 10,748,830 - Hayashida , et al. A | 2020-08-18 |
| Semiconductor device manufacturing method including forming a wide portion spreading over a looped portion Grant 10,651,121 - Oya , et al. | 2020-05-12 |
| Semiconductor module Grant 10,483,176 - Oya Nov | 2019-11-19 |
| Metal-ceramic Bonded Substrate, And Manufacturing Method Thereof App 20190350078 - WAKABAYASHI; Yuki ; et al. | 2019-11-14 |
| Semiconductor Device And Semiconductor Device Manufacturing Method App 20190244889 - OYA; Daisuke ; et al. | 2019-08-08 |
| Semiconductor Device App 20190206757 - HAYASHIDA; Yukimasa ; et al. | 2019-07-04 |
| Semiconductor device including a cylindrical electrode inserted into a looped portion of an electrode Grant 10,340,217 - Oya , et al. | 2019-07-02 |
| Semiconductor-mounting Heat Dissipation Base Plate And Production Method Therefor App 20190111467 - Tanaka; Keisuke ; et al. | 2019-04-18 |
| Semiconductor Module App 20180286771 - OYA; Daisuke | 2018-10-04 |
| Power semiconductor device Grant D827,590 - Hayashida , et al. September 4, 2 | 2018-09-04 |
| Semiconductor Device And Semiconductor Device Manufacturing Method App 20180247888 - OYA; Daisuke ; et al. | 2018-08-30 |
| Power semiconductor device Grant D798,832 - Hayashida , et al. October 3, 2 | 2017-10-03 |
| Power semiconductor device Grant D790,491 - Hayashida , et al. June 27, 2 | 2017-06-27 |
| Semiconductor Device App 20160113112 - OYA; Daisuke ; et al. | 2016-04-21 |
| Semiconductor device Grant 8,698,195 - Oya , et al. April 15, 2 | 2014-04-15 |
| Semiconductor Device App 20120267680 - Oya; Daisuke ; et al. | 2012-10-25 |
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