Ovrutsky; David
Patent Applications and Registrations
Patent applications and USPTO patent grants for Ovrutsky; David.The latest application filed is for "aspect ratio modifying imaging systems and methods".
Company Profile
4.42.34
- Ovrutsky; David - Charlotte CA
- Ovrutsky; David - San Jose CA
- Ovrutsky; David - Ashkelon IL
- Ovrutsky; David - Jerusalem IL
Patent Activity
| Patent | Date |
|---|---|
| Aspect Ratio Modifying Imaging Systems And Methods App 20220221691 - Walters; Michael D. ; et al. | 2022-07-14 |
| Methods for routing electrical interconnections and resultant structures Grant 11,063,159 - Gershtenman-Avsian , et al. July 13, 2 | 2021-07-13 |
| Methods for singulation and packaging Grant 10,818,550 - Ovrutsky , et al. October 27, 2 | 2020-10-27 |
| TIR imaging lens, image capturing system having the same, and associated methods Grant 10,409,041 - Ovrutsky , et al. Sept | 2019-09-10 |
| Methods For Routing Electrical Interconnections And Resultant Structures App 20190221679 - Gershtenman-Avsian; Hagit ; et al. | 2019-07-18 |
| Methods For Singulation And Packaging App 20190148232 - OVRUTSKY; David ; et al. | 2019-05-16 |
| Tir Imaging Lens, Image Capturing System Having The Same, And Associated Methods App 20180292632 - OVRUTSKY; David ; et al. | 2018-10-11 |
| Wafer level optical elements and applications thereof Grant 9,910,239 - Ovrutsky , et al. March 6, 2 | 2018-03-06 |
| Off-chip vias in stacked chips Grant 9,899,353 - Haba , et al. February 20, 2 | 2018-02-20 |
| Packaged semiconductor chips with array Grant 9,548,254 - Grinman , et al. January 17, 2 | 2017-01-17 |
| Packaged Semiconductor Chips With Array App 20150380336 - Grinman; Andrey ; et al. | 2015-12-31 |
| Off-chip Vias In Stacked Chips App 20150333042 - Haba; Belgacem ; et al. | 2015-11-19 |
| Packaged semiconductor chips with array Grant 9,070,678 - Grinman , et al. June 30, 2 | 2015-06-30 |
| Off-chip vias in stacked chips Grant 9,048,234 - Haba , et al. June 2, 2 | 2015-06-02 |
| Wafer level optical elements and applications thereof Grant 9,030,745 - Ovrutsky , et al. May 12, 2 | 2015-05-12 |
| Tir Imaging Lens, Image Capturing System Having The Same, And Associated Methods App 20150109456 - OVRUTSKY; David ; et al. | 2015-04-23 |
| Focus compensation for optical elements and applications thereof Grant 8,885,257 - Ovrutsky , et al. November 11, 2 | 2014-11-11 |
| Reconstituted wafer stack packaging with after-applied pad extensions Grant 8,883,562 - Haba , et al. November 11, 2 | 2014-11-11 |
| Focus compensation for optical elements and applications thereof Grant 8,848,301 - Welch , et al. September 30, 2 | 2014-09-30 |
| Microelectronic assemblies having compliancy and methods therefor Grant 8,759,973 - Oganesian , et al. June 24, 2 | 2014-06-24 |
| Packaged Semiconductor Chips With Array App 20140151881 - Grinman; Andrey ; et al. | 2014-06-05 |
| Packaged semiconductor chips Grant 8,704,347 - Grinman , et al. April 22, 2 | 2014-04-22 |
| Recessed optical surfaces Grant 8,687,294 - Kintz , et al. April 1, 2 | 2014-04-01 |
| Packaged semiconductor chips with array Grant 8,653,644 - Grinman , et al. February 18, 2 | 2014-02-18 |
| Reconstituted Wafer Stack Packaging With After-applied Pad Extensions App 20130344652 - Haba; Belgacem ; et al. | 2013-12-26 |
| Packaged semiconductor chips with array Grant 8,569,876 - Grinman , et al. October 29, 2 | 2013-10-29 |
| Off-chip Vias In Stacked Chips App 20130273693 - Haba; Belgacem ; et al. | 2013-10-17 |
| Wafer Level Optical Elements and Applications Thereof App 20130229719 - Ovrutsky; David ; et al. | 2013-09-05 |
| Off-chip VIAS in stacked chips Grant 8,476,774 - Haba , et al. July 2, 2 | 2013-07-02 |
| Reconstituted wafer stack packaging with after-applied pad extensions Grant 8,461,672 - Haba , et al. June 11, 2 | 2013-06-11 |
| Wafer level optical elements and applications thereof Grant 8,422,138 - Ovrutsky , et al. April 16, 2 | 2013-04-16 |
| Recessed Optical Surfaces App 20120229908 - Kintz; Gregory J. ; et al. | 2012-09-13 |
| Packaged Semiconductor Chips With Array App 20120153443 - Grinman; Andrey ; et al. | 2012-06-21 |
| Wafer Level Optical Elements And Applications Thereof App 20120133916 - Ovrutsky; David ; et al. | 2012-05-31 |
| Recessed optical surfaces Grant 8,189,277 - Kintz , et al. May 29, 2 | 2012-05-29 |
| Microelectronic Assemblies Having Compliancy And Methods Therefor App 20120091582 - Oganesian; Vage ; et al. | 2012-04-19 |
| Off-chip Vias In Stacked Chips App 20120080807 - Haba; Belgacem ; et al. | 2012-04-05 |
| Microelectronic assemblies having compliancy and methods therefor Grant 8,115,308 - Oganesian , et al. February 14, 2 | 2012-02-14 |
| Focus Compensation For Optical Elements And Applications Thereof App 20110304930 - Welch; William Hudson ; et al. | 2011-12-15 |
| Off-chip vias in stacked chips Grant 8,076,788 - Haba , et al. December 13, 2 | 2011-12-13 |
| Method of forming a wafer level package Grant 8,053,281 - Honer , et al. November 8, 2 | 2011-11-08 |
| Recessed Optical Surfaces App 20110222171 - KINTZ; Gregory J. ; et al. | 2011-09-15 |
| Focus Compensation For Optical Elements And Applications Thereof App 20110181854 - Ovrutsky; David ; et al. | 2011-07-28 |
| Wafer-level fabrication of lidded chips with electrodeposited dielectric coating Grant 7,935,568 - Oganesian , et al. May 3, 2 | 2011-05-03 |
| Wafer level chip packaging Grant 7,936,062 - Humpston , et al. May 3, 2 | 2011-05-03 |
| Reconstituted wafer level stacking Grant 7,901,989 - Haba , et al. March 8, 2 | 2011-03-08 |
| Off-chip Vias In Stacked Chips App 20110049696 - Haba; Belgacem ; et al. | 2011-03-03 |
| Packaged Semiconductor Chips App 20110012259 - Grinman; Andrey ; et al. | 2011-01-20 |
| Reconstituted Wafer Stack Packaging With After-applied Pad Extensions App 20110006432 - Haba; Belgacem ; et al. | 2011-01-13 |
| Wafer Level Optical Elements And Applications Thereof App 20110002053 - Ovrutsky; David ; et al. | 2011-01-06 |
| Wafer-level fabrication of lidded chips with electrodeposited dielectric coating Grant 7,807,508 - Oganesian , et al. October 5, 2 | 2010-10-05 |
| Microelectronic Assemblies Having Compliancy and Methods Therefor App 20100230812 - Oganesian; Vage ; et al. | 2010-09-16 |
| Packaged semiconductor chips Grant 7,791,199 - Grinman , et al. September 7, 2 | 2010-09-07 |
| Microelectronic assemblies having compliancy and methods therefor Grant 7,749,886 - Oganesian , et al. July 6, 2 | 2010-07-06 |
| Method of forming a wafer level package App 20090162975 - Honer; Kenneth Allen ; et al. | 2009-06-25 |
| Reconstituted Wafer Level Stacking App 20090160065 - Haba; Belgacem ; et al. | 2009-06-25 |
| Microelectronic assemblies having compliancy and methods therefor App 20080150121 - Oganesian; Vage ; et al. | 2008-06-26 |
| Packaged semiconductor chips with array App 20080116544 - Grinman; Andrey ; et al. | 2008-05-22 |
| Packaged semiconductor chips App 20080116545 - Grinman; Andrey ; et al. | 2008-05-22 |
| Wafer-level fabrication of lidded chips with electrodeposited dielectric coating App 20080099900 - Oganesian; Vage ; et al. | 2008-05-01 |
| Wafer-level fabrication of lidded chips with electrodeposited dielectric coating App 20080099907 - Oganesian; Vage ; et al. | 2008-05-01 |
| Wafer level chip packaging App 20070190691 - Humpston; Giles ; et al. | 2007-08-16 |
| Wafer level packaging to lidded chips App 20070190747 - Humpston; Giles ; et al. | 2007-08-16 |
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