Okudo; Takafumi
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okudo; Takafumi.The latest application filed is for "capacitor".
- Okudo; Takafumi - Osaka JP
- Okudo; Takafumi - Nara JP
- Okudo; Takafumi - Nara-shi JP
| Patent | Date |
|---|---|
| Component sensor Grant 11,320,372 - Okudo , et al. May 3, 2 | 2022-05-03 |
| Capacitor App 20210313112 - NISHIMURA; Koichi ; et al. | 2021-10-07 |
| Infrared sensor chip, and infrared sensor employing same Grant 10,989,603 - Kakimoto , et al. April 27, 2 | 2021-04-27 |
| Component Sensor App 20200232917 - OKUDO; TAKAFUMI ; et al. | 2020-07-23 |
| Infrared Sensor Chip, And Infrared Sensor Employing Same App 20190383666 - KAKIMOTO; Katsumi ; et al. | 2019-12-19 |
| Infrared Sensor App 20180351006 - HAGIHARA; YOSUKE ; et al. | 2018-12-06 |
| Infrared sensor having improved sensitivity and reduced heat generation Grant 10,119,865 - Kakimoto , et al. November 6, 2 | 2018-11-06 |
| Infrared sensor Grant 10,078,007 - Okudo , et al. September 18, 2 | 2018-09-18 |
| Infrared Sensor App 20170122799 - OKUDO; Takafumi ; et al. | 2017-05-04 |
| Infrared sensor Grant 9,587,978 - Okudo , et al. March 7, 2 | 2017-03-07 |
| Infrared Sensor App 20160153837 - KAKIMOTO; KATSUMI ; et al. | 2016-06-02 |
| Infrared Sensor App 20140291527 - OKUDO; Takafumi ; et al. | 2014-10-02 |
| Wafer level package structure and production method therefor Grant 8,080,869 - Okudo , et al. December 20, 2 | 2011-12-20 |
| Wafer level package structure, and sensor device obtained from the same package structure Grant 8,067,769 - Okudo , et al. November 29, 2 | 2011-11-29 |
| Sensor device and production method therefor Grant 8,026,594 - Okudo , et al. September 27, 2 | 2011-09-27 |
| Sensor device and production method therefor Grant 7,674,638 - Okudo , et al. March 9, 2 | 2010-03-09 |
| Wafer Level Package Structure, And Sensor Device Obtained From The Same Package Structure App 20090267165 - Okudo; Takafumi ; et al. | 2009-10-29 |
| Sensor Device And Production Method Therefor App 20090236678 - Okudo; Takafumi ; et al. | 2009-09-24 |
| Wafer Level Package Structure And Production Method Therefor App 20090159997 - Okudo; Takafumi ; et al. | 2009-06-25 |
| Sensor Device And Production Method Therefor App 20090152656 - Okudo; Takafumi ; et al. | 2009-06-18 |
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