Okuda; Ryoji
Patent Applications and Registrations
Patent applications and USPTO patent grants for Okuda; Ryoji.The latest application filed is for "resin composition".
- Okuda; Ryoji - Otsu JP
- OKUDA; Ryoji - Otsu-shi JP
- Okuda; Ryoji - Shiga JP
- Okuda; Ryoji - Kusatsu JP
- Okuda, Ryoji - Kusatsu-shi JP
| Patent | Date |
|---|---|
| Resin composition Grant 11,347,146 - Masuda , et al. May 31, 2 | 2022-05-31 |
| Resin and photosensitive resin composition Grant 11,174,350 - Masuda , et al. November 16, 2 | 2021-11-16 |
| Resin composition Grant 10,990,008 - Masuda , et al. April 27, 2 | 2021-04-27 |
| Cured film and method for producing same Grant 10,908,500 - Shoji , et al. February 2, 2 | 2021-02-02 |
| Resin Composition App 20200362113 - KIUCHI; Yohei ; et al. | 2020-11-19 |
| Photosensitive resin composition Grant 10,584,205 - Shoji , et al. | 2020-03-10 |
| Cured film formed by curing photosensitive resin composition and method for manufacturing same Grant 10,545,406 - Shoji , et al. Ja | 2020-01-28 |
| Di-amine Compound, And Heat-resistant Resin And Resin Composition Using The Same App 20190256655 - MASUDA; Yuki ; et al. | 2019-08-22 |
| Resin Composition App 20190250511 - MASUDA; Yuki ; et al. | 2019-08-15 |
| Photosensitive resin composition, method for manufacturing cured resin film, and semiconductor device Grant 10,365,559 - Arimoto , et al. July 30, 2 | 2019-07-30 |
| Resin Composition App 20190086800 - MASUDA; Yuki ; et al. | 2019-03-21 |
| Resin And Photosensitive Resin Composition App 20190081258 - MASUDA; Yuki ; et al. | 2019-03-14 |
| Resin and photosensitive resin composition Grant 10,197,915 - Masuda , et al. Fe | 2019-02-05 |
| Resin Composition, Cured Relief Pattern Thereof, And Method For Manufacturing Semiconductor Electronic Component Or Semiconductor Equipment Using The Same App 20190033714 - BABA; Osamu ; et al. | 2019-01-31 |
| Cured Film And Method For Producing Same App 20190004423 - SHOJI; Yu ; et al. | 2019-01-03 |
| Cured Film And Method For Manufacturing Same App 20180203353 - SHOJI; Yu ; et al. | 2018-07-19 |
| Photosensitive Resin Composition App 20180066107 - SHOJI; Yu ; et al. | 2018-03-08 |
| Photosensitive Resin Composition And Electronic Component App 20180051136 - KOYAMA; Yutaro ; et al. | 2018-02-22 |
| Photosensitive Resin Composition, Method For Manufacturing Cured Resin Film, And Semiconductor Device App 20180031970 - ARIMOTO; Yukari ; et al. | 2018-02-01 |
| Resin And Photosensitive Resin Composition App 20170327644 - MASUDA; Yuki ; et al. | 2017-11-16 |
| Polishing pad Grant 9,114,501 - Takeuchi , et al. August 25, 2 | 2015-08-25 |
| Polishing Pad App 20140378035 - Noro; Yohei ; et al. | 2014-12-25 |
| Polishing Pad App 20140342646 - Honda; Tomoyuki ; et al. | 2014-11-20 |
| Polishing Pad App 20140170943 - Takeuchi; Nana ; et al. | 2014-06-19 |
| Polishing Pad App 20140154962 - Takeuchi; Nana ; et al. | 2014-06-05 |
| Polishing Pad App 20140141704 - Takeuchi; Nana ; et al. | 2014-05-22 |
| Photosensitive resin composition and process for producing heat-resistant resin film Grant 7,214,455 - Miyoshi , et al. May 8, 2 | 2007-05-08 |
| Photosensitive resin composition and method for preparing heat-resistant resin film App 20050202337 - Miyoshi, Kazuto ; et al. | 2005-09-15 |
| Positive-type photosensitive resin composition Grant 6,929,890 - Miyoshi , et al. August 16, 2 | 2005-08-16 |
| Positive-type photosensitive resin composition App 20040197703 - Miyoshi, Kazuto ; et al. | 2004-10-07 |
| Positive-working photosensitive resin precursor composition App 20040170914 - Tomikawa, Masao ; et al. | 2004-09-02 |
| Positive-working photosensitive resin precursor composition Grant 6,723,484 - Tomikawa , et al. April 20, 2 | 2004-04-20 |
| Display device having a polyimide insulating layer Grant 6,696,112 - Okuda , et al. February 24, 2 | 2004-02-24 |
| Display App 20020162998 - Okuda, Ryoji ; et al. | 2002-11-07 |
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