Okamoto; Keishiro

Patent Applications and Registrations

Patent applications and USPTO patent grants for Okamoto; Keishiro.The latest application filed is for "semiconductor apparatus, method for manufacturing the same and electric device".

Company Profile

0.20.21

Okamoto; Keishiro - Ebina JP
Okamoto; Keishiro - Kawasaki JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Electronic device and method of manufacturing electronic device Grant 9,462,693 - Okamoto , et al. October 4, 2	2016-10-04
Method for manufacturing semiconductor apparatus Grant 9,177,938 - Tani , et al. November 3, 2	2015-11-03
Semiconductor device and power source device Grant 9,082,756 - Shimizu , et al. July 14, 2	2015-07-14
Semiconductor Apparatus, Method For Manufacturing The Same And Electric Device App 20150171053 - TANI; Motoaki ; et al.	2015-06-18
Method For Forming Bumps, Semiconductor Device And Method For Manufacturing Same, Substrate Processing Apparatus, And Semiconductor Manufacturing Apparatus App 20150132865 - Mizukoshi; Masataka ; et al.	2015-05-14
Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus Grant 8,962,470 - Mizukoshi , et al. February 24, 2	2015-02-24
Electronic Device And Method Of Manufacturing Electronic Device App 20150049450 - Okamoto; Keishiro ; et al.	2015-02-19
Semiconductor apparatus, method for manufacturing the same and electric device Grant 8,866,312 - Tani , et al. October 21, 2	2014-10-21
Semiconductor Device And Power Source Device App 20140203444 - SHIMIZU; KOZO ; et al.	2014-07-24
Semiconductor device, manufacturing method of semiconductor device, and power source device Grant 8,728,867 - Shimizu , et al. May 20, 2	2014-05-20
Semiconductor device, method for manufacturing the same, and power supply unit Grant 8,674,520 - Imaizumi , et al. March 18, 2	2014-03-18
Semiconductor device and method for producing the same, and power supply Grant 8,492,784 - Okamoto , et al. July 23, 2	2013-07-23
Multilevel interconnection board and method of fabricating the same Grant 8,257,542 - Okamoto , et al. September 4, 2	2012-09-04
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20120217626 - SAKAI; Taiji ; et al.	2012-08-30
Semiconductor Apparatus, Method For Manufacturing The Same And Electric Device App 20120217660 - TANI; Motoaki ; et al.	2012-08-30
Semiconductor Device, Method Of Manufacturing Semiconductor Device And Electronic Circuit App 20120211762 - IMADA; Tadahiro ; et al.	2012-08-23
Semiconductor Device, Manufacturing Method Of Semiconductor Device, And Power Source Device App 20120211901 - SHIMIZU; Kozo ; et al.	2012-08-23
Semiconductor Device And Method For Manufacturing Semiconductor Device App 20120211764 - OKAMOTO; Keishiro ; et al.	2012-08-23
Semiconductor Device, Method For Manufacturing The Same, And Power Supply Unit App 20120211899 - IMAIZUMI; Nobuhiro ; et al.	2012-08-23
Semiconductor Device And Method For Producing The Same, And Power Supply App 20120199991 - OKAMOTO; Keishiro ; et al.	2012-08-09
Multilevel Interconnection Board And Method Of Fabricating The Same App 20100024963 - OKAMOTO; Keishiro ; et al.	2010-02-04
Multilevel interconnection board and method of fabricating the same Grant 7,622,184 - Okamoto , et al. November 24, 2	2009-11-24
Method For Forming Bumps, Semiconductor Device And Method For Manufacturing Same, Substrate Processing Apparatus, And Semiconductor Manufacturing Apparatus App 20090186425 - MIZUKOSHI; Masataka ; et al.	2009-07-23
Semiconductor system-in-package Grant 7,557,014 - Okamoto , et al. July 7, 2	2009-07-07
Wiring board and method for fabricating the same App 20070240901 - Okamoto; Keishiro ; et al.	2007-10-18
Wiring board and method for fabricating the same Grant 7,246,435 - Okamoto , et al. July 24, 2	2007-07-24
Multilevel interconnection board and method of fabricating the same App 20070077391 - Okamoto; Keishiro ; et al.	2007-04-05
Semiconductor system-in-package App 20070065981 - Okamoto; Keishiro ; et al.	2007-03-22
Semiconductor system-in-package Grant 7,176,556 - Okamoto , et al. February 13, 2	2007-02-13
Wiring board and method for fabricating the same App 20060175084 - Okamoto; Keishiro ; et al.	2006-08-10
Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus App 20050161814 - Mizukoshi, Masataka ; et al.	2005-07-28
Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure Grant 6,806,118 - Okamoto , et al. October 19, 2	2004-10-19
Piezoelectric actuator, method of manufacturing the same, ink-jet head using the same, and ink-jet printer Grant 6,781,290 - Kurihara , et al. August 24, 2	2004-08-24
Electrode connection method, electrode surface activation apparatus, electrode connection apparatus, connection method of electronic components and connected structure App 20030148593 - Okamoto, Keishiro ; et al.	2003-08-07
Piezoelectric actuator, method of manufacturing the same, ink-jet head using the same, and ink-jet printer App 20030117041 - Kurihara, Kazuaki ; et al.	2003-06-26
Semiconductor system-in-package App 20030080400 - Okamoto, Keishiro ; et al.	2003-05-01

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