Noveski; Vladimir

Patent Applications and Registrations

Patent applications and USPTO patent grants for Noveski; Vladimir.The latest application filed is for "reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability".

Company Profile

0.13.16

Noveski; Vladimir - Encinitas CA
Noveski; Vladimir - San Diego CA
Noveski; Vladimir - Chandler AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Integrated device package comprising photo sensitive fill between a substrate and a die Grant 10,037,941 - Noveski , et al. July 31, 2	2018-07-31
Reinforced wafer level package comprising a core layer for reducing stress in a solder joint and improving solder joint reliability Grant 9,806,063 - Kim , et al. October 31, 2	2017-10-31
Reinforced Wafer Level Package Comprising A Core Layer For Reducing Stress In A Solder Joint And Improving Solder Joint Reliability App 20160322332 - Kim; Chin-Kwan ; et al.	2016-11-03
Integrated Device Package Comprising Photo Sensitive Fill Between A Substrate And A Die App 20160172299 - Noveski; Vladimir ; et al.	2016-06-16
Integrated Device Package Comprising Heterogeneous Solder Joint Structure App 20160148864 - Fu; Jie ; et al.	2016-05-26
Package substrate and die spacer layers having a ceramic backbone Grant 9,258,880 - Aleksov , et al. February 9, 2	2016-02-09
Deflection Sensor For In-situ Deflection Measurement In Semiconductor Devices App 20140013855 - FARAHANI; Mohammad M. ; et al.	2014-01-16
Package substrate and die spacer layers having a ceramic backbone App 20130341076 - Aleksov; Aleksandar ; et al.	2013-12-26
Package substrate and die spacer layers having a ceramic backbone Grant 8,604,353 - Aleksov , et al. December 10, 2	2013-12-10
Stress sensor for in-situ measurement of package-induced stress in semiconductor devices Grant 8,586,393 - Farahani , et al. November 19, 2	2013-11-19
Dense, shaped articles constructed of a refractory material and methods of preparing such articles Grant 8,414,677 - Schlesser , et al. April 9, 2	2013-04-09
Stress Sensor For In-situ Measurement Of Package-induced Stress In Semiconductor Devices App 20120193734 - Farahani; Mohammad M. ; et al.	2012-08-02
Package substrate and die spacer layers having a ceramic backbone App 20120152601 - Aleksov; Aleksandar ; et al.	2012-06-21
Method for fabricating package substrate and die spacer layers having a ceramic backbone Grant 8,186,051 - Aleksov , et al. May 29, 2	2012-05-29
Stress sensor for in-situ measurement of package-induced stress in semiconductor devices Grant 8,174,084 - Farahani , et al. May 8, 2	2012-05-08
Seeded growth process for preparing aluminum nitride single crystals Grant 7,678,195 - Schlesser , et al. March 16, 2	2010-03-16
Dense, Shaped Articles Constructed Of A Refractory Material And Methods Of Preparing Such Articles App 20090324859 - Schlesser; Raoul ; et al.	2009-12-31
Dense, shaped articles constructed of a refractory material and methods of preparing such articles Grant 7,632,454 - Schlesser , et al. December 15, 2	2009-12-15
Package substrate and die spacer layers having a ceramic backbone App 20090242247 - Aleksov; Aleksandar ; et al.	2009-10-01
Methods Of Forming Highly Oriented Diamond Films And Structures Formed Thereby App 20080237718 - Noveski; Vladimir ; et al.	2008-10-02
Microelectronic package and method of manufacturing same App 20080237844 - Aleksov; Aleksandar ; et al.	2008-10-02
Stress sensor for in-situ measurement of package-induced stress in semiconductor devices App 20080067619 - Farahani; Mohammad M. ; et al.	2008-03-20
Seeded growth process for preparing aluminum nitride single crystals App 20070257333 - Schlesser; Raoul ; et al.	2007-11-08
Dense, shaped articles constructed of a refractory material and methods of preparing such articles App 20060280640 - Schlesser; Raoul ; et al.	2006-12-14

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.