North; Mark T.
Patent Applications and Registrations
Patent applications and USPTO patent grants for North; Mark T..The latest application filed is for "heat pipes having wick structures with variable permeability".
- North; Mark T. - Lancaster PA
| Patent | Date |
|---|---|
| Heat Pipes Having Wick Structures With Variable Permeability App 20210262737 - North; Mark T. | 2021-08-26 |
| Heat Pipe Assembly And Method App 20200370838 - North; Mark T. ; et al. | 2020-11-26 |
| Azeotropic working fluids and thermal management systems utilizing the same Grant 10,648,745 - Gernert , et al. | 2020-05-12 |
| Azeotropic Working Fluids And Thermal Management Systems Utilizing The Same App 20180172359 - Gernert; Nelson J. ; et al. | 2018-06-21 |
| Heat transfer apparatus and method Grant 9,417,017 - Ciulla , et al. August 16, 2 | 2016-08-16 |
| Heat Transfer Apparatus And Method App 20140060783 - Ciulla; Anthony ; et al. | 2014-03-06 |
| Porous media cold plate Grant 8,397,796 - Thayer , et al. March 19, 2 | 2013-03-19 |
| Cooling Element For Electrosurgery App 20110288548 - Bilski; W. John ; et al. | 2011-11-24 |
| Cooling element for electrosurgery Grant 7,914,529 - Bilski , et al. March 29, 2 | 2011-03-29 |
| Porous Media Cold Plate App 20100181056 - Thayer; John G. ; et al. | 2010-07-22 |
| Porous media cold plate Grant 7,690,419 - Thayer , et al. April 6, 2 | 2010-04-06 |
| Porous Media Cold Plate App 20060185823 - THAYER; JOHN G. ; et al. | 2006-08-24 |
| Porous media cold plate Grant 7,044,199 - Thayer , et al. May 16, 2 | 2006-05-16 |
| Cooling Element for electrosurgery App 20060004356 - Bilski; W. John ; et al. | 2006-01-05 |
| Porous media cold plate App 20050082037 - Thayer, John G. ; et al. | 2005-04-21 |
| Heat pipe thermal management of high potential electronic chip packages App 20040159934 - North, Mark T. ; et al. | 2004-08-19 |
| Heat sink with converging device Grant 6,637,502 - North , et al. October 28, 2 | 2003-10-28 |
| Heat Sink With Converging Device App 20030192670 - North, Mark T. ; et al. | 2003-10-16 |
| Heat pipe thermal management of high potential electronic chip packages App 20020185726 - North, Mark T. ; et al. | 2002-12-12 |
| Fluid cooled single phase heat sink Grant 6,131,650 - North , et al. October 17, 2 | 2000-10-17 |
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