Norkus; Eugenijus

Patent Applications and Registrations

Patent applications and USPTO patent grants for Norkus; Eugenijus.The latest application filed is for "method for electroless nickel deposition onto copper without activation with palladium".

Company Profile

1.11.12

Norkus; Eugenijus - Vilnius LT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method for electroless nickel deposition onto copper without activation with palladium App 20220064801 - Jagminiene; Aldona ; et al.	2022-03-03
Method for formation of electro-conductive traces on polymeric article surface Grant 10,982,328 - Ratautas , et al. April 20, 2	2021-04-20
METHOD FOR FORMATION of ELECTRO-CONDUCTIVE TRACES ON POLYMERIC ARTICLE SURFACE App 20190360104 - RATAUTAS; Karolis ; et al.	2019-11-28
Electroless deposition of continuous platinum layer using complexed Co.sup.2+ metal ion reducing agent Grant 9,499,913 - Norkus , et al. November 22, 2	2016-11-22
Electroless deposition of continuous platinum layer Grant 9,469,902 - Norkus , et al. October 18, 2	2016-10-18
Electroless deposition of continuous cobalt layer using complexed Ti.sup.3+ metal ions as reducing agents Grant 9,428,836 - Norkus , et al. August 30, 2	2016-08-30
ELECTROLESS DEPOSITION OF CONTINUOUS NICKEL LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS App 20150307994 - NORKUS; Eugenijus ; et al.	2015-10-29
ELECTROLESS DEPOSITION OF CONTINUOUS COBALT LAYER USING COMPLEXED Ti3+ METAL IONS AS REDUCING AGENTS App 20150307993 - NORKUS; Eugenijus ; et al.	2015-10-29
ELECTROLESS DEPOSITION OF CONTINUOUS PALLADIUM LAYER USING COMPLEXED Co2+ METAL IONS OR Ti3+ METAL IONS AS REDUCING AGENTS App 20150307995 - NORKUS; Eugenijus ; et al.	2015-10-29
ELECTROLESS DEPOSITION OF CONTINUOUS PLATINUM LAYER USING COMPLEXED Co2+ METAL ION REDUCING AGENT App 20150284857 - NORKUS; Eugenijus ; et al.	2015-10-08
Electroless Deposition Of Continuous Platinum Layer App 20150232995 - NORKUS; Eugenijus ; et al.	2015-08-20
Electroless deposition from non-aqueous solutions Grant 8,298,325 - Norkus , et al. October 30, 2	2012-10-30
Electroless Deposition from Non-Aqueous Solutions App 20120152147 - Norkus; Eugenijus ; et al.	2012-06-21
Electroless deposition of cobalt alloys Grant 7,988,774 - Vaskelis , et al. August 2, 2	2011-08-02
Electroless Deposition Of Cobalt Alloys App 20100304562 - Vaskelis; Algirdas ; et al.	2010-12-02
Electroless deposition of cobalt alloys Grant 7,794,530 - Vaskelis , et al. September 14, 2	2010-09-14
Electroless deposition from non-aqueous solutions Grant 7,686,875 - Norkus , et al. March 30, 2	2010-03-30
Plating solutions for electroless deposition of ruthenium Grant 7,682,431 - Zieliene , et al. March 23, 2	2010-03-23
Electroless Deposition From Non-aqueous Solutions App 20090095198 - Norkus; Eugenijus ; et al.	2009-04-16
Electroless deposition of cobalt alloys App 20080152822 - Vaskelis; Algirdas ; et al.	2008-06-26
Plating solution for electroless deposition of copper Grant 7,306,662 - Vaskelis , et al. December 11, 2	2007-12-11
Plating solutions for electroless deposition of copper Grant 7,297,190 - Dordi , et al. November 20, 2	2007-11-20
Plating Solution For Electroless Deposition Of Copper App 20070261594 - Vaskelis; Algirdas ; et al.	2007-11-15

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