| Patent | Date |
|---|
Substrate Thinning For A Backside Power Distribution Network
App 20220301878 - Xie; Ruilong ; et al. | 2022-09-22 |
Laser machine
Grant 11,400,547 - Nogami August 2, 2 | 2022-08-02 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration
Grant 11,348,872 - Briggs , et al. May 31, 2 | 2022-05-31 |
Topological Semi-metal Interconnects
App 20220157733 - Chen; Ching-Tzu ; et al. | 2022-05-19 |
Laser machining system
Grant 11,318,559 - Nogami May 3, 2 | 2022-05-03 |
Copper Interconnect Structure With Manganese Barrier Layer
App 20220115269 - Edelstein; Daniel C. ; et al. | 2022-04-14 |
Interconnects including dual-metal vias
Grant 11,302,637 - Pranatharthi Haran , et al. April 12, 2 | 2022-04-12 |
Interconnects Including Dual-metal Vias
App 20220051976 - Pranatharthi Haran; Balasubramanian S. ; et al. | 2022-02-17 |
Copper interconnect structure with manganese barrier layer
Grant 11,232,983 - Edelstein , et al. January 25, 2 | 2022-01-25 |
Subtractive RIE interconnect
Grant 11,189,528 - Arnold , et al. November 30, 2 | 2021-11-30 |
Ultrathin multilayer metal alloy liner for nano Cu interconnects
Grant 11,177,167 - Edelstein , et al. November 16, 2 | 2021-11-16 |
Metallic interconnect structure
Grant 11,164,776 - Nguyen , et al. November 2, 2 | 2021-11-02 |
Subtractive Rie Interconnect
App 20210335665 - Arnold; John Christopher ; et al. | 2021-10-28 |
Interconnect with self-forming wrap-all-around barrier layer
Grant 10,978,342 - Huang , et al. April 13, 2 | 2021-04-13 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration
Grant 10,978,393 - Briggs , et al. April 13, 2 | 2021-04-13 |
Metallic Interconnect Structure
App 20210098292 - Nguyen; Son ; et al. | 2021-04-01 |
Semiconductor Interconnect Structure With Double Conductors
App 20210043563 - Briggs; Benjamin D. ; et al. | 2021-02-11 |
Interconnect Structure
App 20200402848 - Edelstein; Daniel C. ; et al. | 2020-12-24 |
Self-forming Barrier For Use In Air Gap Formation
App 20200402849 - Briggs; Benjamin D. ; et al. | 2020-12-24 |
Semiconductor interconnect structure with double conductors
Grant 10,804,193 - Briggs , et al. October 13, 2 | 2020-10-13 |
Interconnect structure
Grant 10,770,347 - Edelstein , et al. Sep | 2020-09-08 |
Self-forming barrier for use in air gap formation
Grant 10,763,166 - Briggs , et al. Sep | 2020-09-01 |
Laser Machine
App 20200269349 - NOGAMI; Takeshi | 2020-08-27 |
Interconnect with Self-Forming Wrap-All-Around Barrier Layer
App 20200243383 - Huang; Huai ; et al. | 2020-07-30 |
Lithographic alignment of a conductive line to a via
Grant 10,685,879 - Arnold , et al. | 2020-06-16 |
Laser machining apparatus
Grant 10,668,562 - Nogami | 2020-06-02 |
Ultrathin multilayer metal alloy liner for nano Cu interconnects
Grant 10,643,890 - Edelstein , et al. | 2020-05-05 |
Laser Machining System
App 20200114467 - NOGAMI; Takeshi | 2020-04-16 |
Hybrid Dielectric Scheme For Varying Liner Thickness And Manganese Concentration
App 20200091079 - Briggs; Benjamin D. ; et al. | 2020-03-19 |
Interconnect structure
Grant 10,593,591 - Edelstein , et al. | 2020-03-17 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition
Grant 10,580,740 - Briggs , et al. | 2020-03-03 |
Laser machining device
Grant 10,576,583 - Hatada , et al. | 2020-03-03 |
Interconnect Structure
App 20200051854 - EDELSTEIN; Daniel C. ; et al. | 2020-02-13 |
Controller
App 20200030908 - Nogami; Takeshi | 2020-01-30 |
Copper interconnect with filled void
Grant 10,529,663 - Nogami , et al. J | 2020-01-07 |
Self-forming barrier for cobalt interconnects
Grant 10,446,496 - Briggs , et al. Oc | 2019-10-15 |
Self-forming barrier for cobalt interconnects
Grant 10,431,544 - Briggs , et al. O | 2019-10-01 |
Air gap and air spacer pinch off
Grant 10,366,940 - Bonilla , et al. July 30, 2 | 2019-07-30 |
Enhancing barrier in air gap technology
Grant 10,332,837 - Lin , et al. | 2019-06-25 |
Copper interconnect structure with manganese oxide barrier layer
Grant 10,325,806 - Edelstein , et al. | 2019-06-18 |
Self-forming Barrier For Use In Air Gap Formation
App 20190157146 - Briggs; Benjamin D. ; et al. | 2019-05-23 |
Low-Temperature Diffusion Doping of Copper Interconnects Independent of Seed Layer Composition
App 20190148303 - Briggs; Benjamin D. ; et al. | 2019-05-16 |
Air gap and air spacer pinch off
Grant 10,256,171 - Bonilla , et al. | 2019-04-09 |
Hybrid dielectric scheme for varying liner thickness and manganese concentration
Grant 10,256,191 - Briggs , et al. | 2019-04-09 |
Air gap and air spacer pinch off
Grant 10,242,933 - Bonilla , et al. | 2019-03-26 |
Self-forming barrier for use in air gap formation
Grant 10,229,851 - Briggs , et al. | 2019-03-12 |
Composite manganese nitride / low-k dielectric cap
Grant 10,224,283 - Canaperi , et al. | 2019-03-05 |
Copper interconnect structure with manganese oxide barrier layer
Grant 10,224,241 - Edelstein , et al. | 2019-03-05 |
Low-resistivity metallic interconnect structures with self-forming diffusion barrier layers
Grant 10,204,829 - Amanapu , et al. Feb | 2019-02-12 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition
Grant 10,192,829 - Briggs , et al. Ja | 2019-01-29 |
Hybrid Dielectric Scheme For Varying Liner Thickness And Manganese Concentration
App 20190013278 - Briggs; Benjamin D. ; et al. | 2019-01-10 |
Air gap and air spacer pinch off
Grant 10,177,076 - Bonilla , et al. J | 2019-01-08 |
Interconnect Structure
App 20180374748 - EDELSTEIN; Daniel C. ; et al. | 2018-12-27 |
Laser Machining Apparatus
App 20180354070 - NOGAMI; Takeshi | 2018-12-13 |
Laser Machining Device
App 20180333808 - HATADA; Masanobu ; et al. | 2018-11-22 |
Hybrid Dielectric Scheme For Varying Liner Thickness And Manganese Concentration
App 20180211920 - Briggs; Benjamin D. ; et al. | 2018-07-26 |
Barrier Planarization For Interconnect Metallization
App 20180114719 - Briggs; Benjamin D. ; et al. | 2018-04-26 |
Barrier Planarization For Interconnect Metallization
App 20180114718 - Briggs; Benjamin D. ; et al. | 2018-04-26 |
Air Gap And Air Spacer Pinch Off
App 20180108596 - Bonilla; Griselda ; et al. | 2018-04-19 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,947,622 - Canaperi , et al. April 17, 2 | 2018-04-17 |
Method of forming a copper based interconnect structure
Grant 9,947,581 - Edelstein , et al. April 17, 2 | 2018-04-17 |
Copper interconnect structure with manganese oxide barrier layer
Grant 9,947,579 - Edelstein , et al. April 17, 2 | 2018-04-17 |
Air Gap And Air Spacer Pinch Off
App 20180090588 - Bonilla; Griselda ; et al. | 2018-03-29 |
Interconnect Structure
App 20180090371 - EDELSTEIN; Daniel C. ; et al. | 2018-03-29 |
Air Gap And Air Spacer Pinch Off
App 20180090418 - Bonilla; Griselda ; et al. | 2018-03-29 |
Air Gap And Air Spacer Pinch Off
App 20180090587 - Bonilla; Griselda ; et al. | 2018-03-29 |
Interconnect Structure
App 20180082894 - EDELSTEIN; Daniel C. ; et al. | 2018-03-22 |
Enhancing Barrier In Air Gap Technology
App 20180068953 - Lin; Wei ; et al. | 2018-03-08 |
Enhancing Barrier In Air Gap Technology
App 20180068954 - Lin; Wei ; et al. | 2018-03-08 |
Self-forming Barrier For Use In Air Gap Formation
App 20180061708 - Briggs; Benjamin D. ; et al. | 2018-03-01 |
Barrier planarization for interconnect metallization
Grant 9,881,833 - Briggs , et al. January 30, 2 | 2018-01-30 |
Enhancing barrier in air gap technology
Grant 9,847,295 - Lin , et al. December 19, 2 | 2017-12-19 |
Low-Temperature Diffusion Doping of Copper Interconnects Independent of Seed Layer Composition
App 20170358533 - Briggs; Benjamin D. ; et al. | 2017-12-14 |
Semiconductor interconnect structure with double conductors
Grant 9,837,350 - Briggs , et al. December 5, 2 | 2017-12-05 |
Composite Manganese Nitride / Low-k Dielectric Cap
App 20170317032 - Canaperi; Donald F. ; et al. | 2017-11-02 |
Air gap and air spacer pinch off
Grant 9,793,193 - Bonilla , et al. October 17, 2 | 2017-10-17 |
Semiconductor Interconnect Structure With Double Conductors
App 20170294382 - BRIGGS; BENJAMIN D. ; et al. | 2017-10-12 |
Semiconductor Interconnect Structure With Double Conductors
App 20170294381 - BRIGGS; BENJAMIN D. ; et al. | 2017-10-12 |
Air gap and air spacer pinch off
Grant 9,786,760 - Bonilla , et al. October 10, 2 | 2017-10-10 |
Low-temperature diffusion doping of copper interconnects independent of seed layer composition
Grant 9,754,891 - Briggs , et al. September 5, 2 | 2017-09-05 |
Self-forming Barrier For Cobalt Interconnects
App 20170236781 - Briggs; Benjamin D. ; et al. | 2017-08-17 |
Self-forming Barrier For Cobalt Interconnects
App 20170236749 - Briggs; Benjamin D. ; et al. | 2017-08-17 |
Via bottom structure and methods of forming
Grant 9,716,065 - Kelly , et al. July 25, 2 | 2017-07-25 |
Composite manganese nitride/low-K dielectric cap
Grant 9,711,456 - Canaperi , et al. July 18, 2 | 2017-07-18 |
Self-forming embedded diffusion barriers
Grant 9,691,656 - Cabral, Jr. , et al. June 27, 2 | 2017-06-27 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,691,705 - Canaperi , et al. June 27, 2 | 2017-06-27 |
Composite Manganese Nitride / Low-k Dielectric Cap
App 20170179034 - Canaperi; Donald F. ; et al. | 2017-06-22 |
Method and structure to reduce the electric field in semiconductor wiring interconnects
Grant 9,666,529 - Huang , et al. May 30, 2 | 2017-05-30 |
Interconnect Structure
App 20170140981 - EDELSTEIN; Daniel C. ; et al. | 2017-05-18 |
Low-Temperature Diffusion Doping of Copper Interconnects Independent of Seed Layer Composition
App 20170084540 - Briggs; Benjamin D. ; et al. | 2017-03-23 |
Interconnect structure with barrier layer
Grant 9,601,371 - Edelstein , et al. March 21, 2 | 2017-03-21 |
Via Bottom Structure And Methods Of Forming
App 20170077037 - Kelly; James J. ; et al. | 2017-03-16 |
Copper interconnect structure and its formation
Grant 9,589,894 - Edelstein , et al. March 7, 2 | 2017-03-07 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20170005040 - Canaperi; Donald F. ; et al. | 2017-01-05 |
Single damascene interconnect structure
Grant 9,508,647 - Chen , et al. November 29, 2 | 2016-11-29 |
Interconnect Structure
App 20160329279 - EDELSTEIN; Daniel C. ; et al. | 2016-11-10 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,472,503 - Canaperi , et al. October 18, 2 | 2016-10-18 |
Interconnect structure with capping layer and barrier layer
Grant 9,455,182 - Edelstein , et al. September 27, 2 | 2016-09-27 |
Ultrathin Multilayer Metal Alloy Liner For Nano Cu Interconnects
App 20160276280 - EDELSTEIN; DANIEL ; et al. | 2016-09-22 |
Ultrathin Multilayer Metal Alloy Liner For Nano Cu Interconnects
App 20160276216 - EDELSTEIN; DANIEL ; et al. | 2016-09-22 |
Ultrathin Multilayer Metal Alloy Liner For Nano Cu Interconnects
App 20160268160 - EDELSTEIN; DANIEL ; et al. | 2016-09-15 |
Method and structure to reduce the electric field in semiconductor wiring interconnects
Grant 9,379,057 - Huang , et al. June 28, 2 | 2016-06-28 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20160133576 - Canaperi; Donald F. ; et al. | 2016-05-12 |
Microelectronic structure including air gap
Grant 9,332,628 - Edelstein , et al. May 3, 2 | 2016-05-03 |
Interconnect structure containing a porous low k interconnect dielectric/dielectric cap
Grant 9,312,224 - Canaperi , et al. April 12, 2 | 2016-04-12 |
Single Damascene Interconnect Structure
App 20160071802 - Chen; Shyng-Tsong ; et al. | 2016-03-10 |
Method And Structure To Reduce The Electric Field In Semiconductor Wiring Interconnects
App 20160064321 - Huang; Elbert Emin ; et al. | 2016-03-03 |
Method And Structure To Reduce The Electric Field In Semiconductor Wiring Interconnects
App 20160064330 - Huang; Elbert Emin ; et al. | 2016-03-03 |
Ultrathin superlattice of MnO/Mn/MnN and other metal oxide/metal/metal nitride liners and caps for copper low dielectric constant interconnects
Grant 9,275,952 - Canaperi , et al. March 1, 2 | 2016-03-01 |
Interconnect Structure
App 20160056112 - EDELSTEIN; Daniel C. ; et al. | 2016-02-25 |
Interconnect Structure
App 20160056076 - EDELSTEIN; Daniel C. ; et al. | 2016-02-25 |
Enhancing barrier in air gap technology
Grant 9,263,389 - Lin , et al. February 16, 2 | 2016-02-16 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20160035618 - Canaperi; Donald F. ; et al. | 2016-02-04 |
Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application
Grant 9,245,794 - Yang , et al. January 26, 2 | 2016-01-26 |
Single damascene interconnect structure
Grant 9,224,686 - Chen , et al. December 29, 2 | 2015-12-29 |
Enhancing Barrier In Air Gap Technology
App 20150371954 - Lin; Wei ; et al. | 2015-12-24 |
Ultrathin Multilayer Metal Alloy Liner for Nano Cu Interconnects
App 20150357236 - Edelstein; Daniel ; et al. | 2015-12-10 |
Self-forming Embedded Diffusion Barriers
App 20150340323 - Cabral, JR.; Cyril ; et al. | 2015-11-26 |
Enhancing Barrier In Air Gap Technology
App 20150333009 - Lin; Wei ; et al. | 2015-11-19 |
Self-forming embedded diffusion barriers
Grant 9,190,321 - Cabral, Jr. , et al. November 17, 2 | 2015-11-17 |
Microelectronic Structure Including Air Gap
App 20150289361 - Edelstein; Daniel C. ; et al. | 2015-10-08 |
Microelectronic structure including air gap
Grant 9,105,693 - Edelstein , et al. August 11, 2 | 2015-08-11 |
ULTRATHIN SUPERLATTICE OF MnO/Mn/MnN AND OTHER METAL OXIDE/METAL/METAL NITRIDE LINERS AND CAPS FOR COPPER LOW DIELECTRIC CONSTANT INTERCONNECTS
App 20150214157 - Canaperi; Donald F. ; et al. | 2015-07-30 |
Interconnect with titanium--oxide diffusion barrier
Grant 9,064,874 - Edelstein , et al. June 23, 2 | 2015-06-23 |
Microelectronic structure including air gap
Grant 9,059,251 - Edelstein , et al. June 16, 2 | 2015-06-16 |
Copper interconnect structure and its formation
Grant 8,969,197 - Edelstein , et al. March 3, 2 | 2015-03-03 |
Interconnect structures and methods of manufacturing of interconnect structures
Grant 8,927,421 - Edelstein , et al. January 6, 2 | 2015-01-06 |
Creation of vias and trenches with different depths
Grant 8,907,458 - Ponoth , et al. December 9, 2 | 2014-12-09 |
Self-forming Embedded Diffusion Barriers
App 20140299988 - Cabral, JR.; Cyril ; et al. | 2014-10-09 |
Semiconductor interconnect structure having enhanced performance and reliability
Grant 8,841,770 - Cabral, Jr. , et al. September 23, 2 | 2014-09-23 |
Method of making a copper interconnect having a barrier liner of multiple metal layers
Grant 8,841,212 - Nogami , et al. September 23, 2 | 2014-09-23 |
Microstructure modification in copper interconnect structures
Grant 8,828,870 - Cabral, Jr. , et al. September 9, 2 | 2014-09-09 |
Copper Interconnect Structure And Its Formation
App 20140210089 - Edelstein; Daniel ; et al. | 2014-07-31 |
Interconnect structure employing a Mn-group VIIIB alloy liner
Grant 8,772,942 - Edelstein , et al. July 8, 2 | 2014-07-08 |
Formation of air gap with protection of metal lines
Grant 8,754,520 - Nogami , et al. June 17, 2 | 2014-06-17 |
Interconnect With Titanium-oxide Diffusion Barrier
App 20140124934 - Edelstein; Daniel C. ; et al. | 2014-05-08 |
Microstructure Modification In Copper Interconnect Structures
App 20140127899 - Cabral, JR.; Cyril ; et al. | 2014-05-08 |
Interconnect structure employing a Mn-group VIIIB alloy liner
Grant 8,716,134 - Edelstein , et al. May 6, 2 | 2014-05-06 |
Creation of vias and trenches with different depths
Grant 8,703,604 - Ponoth , et al. April 22, 2 | 2014-04-22 |
Semiconductor Interconnect Structure Having Enhanced Performance And Reliability
App 20140070418 - Cabral, JR.; Cyril ; et al. | 2014-03-13 |
Semiconductor interconnect structure with multi-layered seed layer providing enhanced reliability and minimizing electromigration
Grant 8,658,533 - Edelstein , et al. February 25, 2 | 2014-02-25 |
Semiconductor interconnect structure having enhanced performance and reliability
Grant 8,648,465 - Cabral, Jr. , et al. February 11, 2 | 2014-02-11 |
Interconnect With Titanium-oxide Diffusion Barrier
App 20130307153 - Edelstein; Daniel C. ; et al. | 2013-11-21 |
Copper Interconnect Structure And Its Formation
App 20130307150 - Edelstein; Daniel C. ; et al. | 2013-11-21 |
Integrated circuit chip stack employing carbon nanotube interconnects
Grant 8,586,468 - Nogami , et al. November 19, 2 | 2013-11-19 |
Microstructure Modification In Copper Interconnect Structures
App 20130285245 - Cabral, Jr.; Cyril ; et al. | 2013-10-31 |
Integrated circuit line with electromigration barriers
Grant 8,558,284 - Horak , et al. October 15, 2 | 2013-10-15 |
Interconnect Structures And Methods Of Manufacturing Of Interconnect Structures
App 20130244424 - EDELSTEIN; Daniel C. ; et al. | 2013-09-19 |
Semiconductor structure having a wetting layer
Grant 8,525,232 - Nogami , et al. September 3, 2 | 2013-09-03 |
Interconnect Structures And Methods Of Manufacturing Of Interconnect Structures
App 20130214414 - EDELSTEIN; Daniel C. ; et al. | 2013-08-22 |
Interconnect Structures And Methods Of Manufacturing Of Interconnect Structures
App 20130214416 - EDELSTEIN; Daniel C. ; et al. | 2013-08-22 |
Interconnect structures and methods of manufacturing of interconnect structures
Grant 8,497,202 - Edelstein , et al. July 30, 2 | 2013-07-30 |
Microstructure modification in copper interconnect structures
Grant 8,492,897 - Cabral, Jr. , et al. July 23, 2 | 2013-07-23 |
Pad bonding employing a self-aligned plated liner for adhesion enhancement
Grant 8,492,265 - Yang , et al. July 23, 2 | 2013-07-23 |
Barrier layer formation for metal interconnects through enhanced impurity diffusion
Grant 8,492,289 - Edelstein , et al. July 23, 2 | 2013-07-23 |
INTERCONNECT STRUCTURE EMPLOYING A Mn-GROUP VIIIB ALLOY LINER
App 20130178058 - Edelstein; Daniel C. ; et al. | 2013-07-11 |
Pad bonding employing a self-aligned plated liner for adhesion enhancement
Grant 8,482,132 - Yang , et al. July 9, 2 | 2013-07-09 |
Formation Of Air Gap With Protection Of Metal Lines
App 20130134590 - Nogami; Takeshi ; et al. | 2013-05-30 |
Copper interconnect formation
Grant 8,435,887 - Kelly , et al. May 7, 2 | 2013-05-07 |
Semiconductor Interconnect Structure Having Enhanced Performance And Reliability
App 20130075908 - Cabral, JR.; Cyril ; et al. | 2013-03-28 |
Structure and method for manufacturing interconnect structures having self-aligned dielectric caps
Grant 8,404,582 - Horak , et al. March 26, 2 | 2013-03-26 |
Formation of air gap with protection of metal lines
Grant 8,399,350 - Nogami , et al. March 19, 2 | 2013-03-19 |
Microstructure Modification in Copper Interconnect Structures
App 20130062769 - Cabral, JR.; Cyril ; et al. | 2013-03-14 |
Semiconductor Structure Having A Wetting Layer
App 20130037865 - Nogami; Takeshi ; et al. | 2013-02-14 |
Microelectronic Structure Including Air Gap
App 20130009282 - Edelstein; Daniel C. ; et al. | 2013-01-10 |
Microelectronic Structure Including Air Gap
App 20130012017 - Edelstein; Daniel C. ; et al. | 2013-01-10 |
Barrier Sequence For Use In Copper Interconnect Metallization
App 20130005137 - Nogami; Takeshi ; et al. | 2013-01-03 |
Formation Of Alloy Liner By Reaction Of Diffusion Barrier And Seed Layer For Interconnect Application
App 20130000962 - Yang; Chih-Chao ; et al. | 2013-01-03 |
Formation of alloy liner by reaction of diffusion barrier and seed layer for interconnect application
Grant 8,336,204 - Yang , et al. December 25, 2 | 2012-12-25 |
Copper Interconnect Formation
App 20120309190 - Kelly; James J. ; et al. | 2012-12-06 |
Microelectronic structure including air gap
Grant 8,288,268 - Edelstein , et al. October 16, 2 | 2012-10-16 |
Semiconductor Interconnect Structure With Multi-layered Seed Layer Providing Enhanced Reliability And Minimizing Electromigration
App 20120228771 - Edelstein; Daniel C. ; et al. | 2012-09-13 |
Pad Bonding Employing A Self-aligned Plated Liner For Adhesion Enhancement
App 20120190187 - Yang; Chih-Chao ; et al. | 2012-07-26 |
Creation of vias and trenches with different depths
Grant 8,227,339 - Ponoth , et al. July 24, 2 | 2012-07-24 |
Integrated Circuit Line With Electromigration Barriers
App 20120175775 - Horak; David V. ; et al. | 2012-07-12 |
Creation Of Vias And Trenches With Different Depths
App 20120171859 - Ponoth; Shom ; et al. | 2012-07-05 |
Integrated circuit line with electromigration barriers
Grant 8,211,776 - Horak , et al. July 3, 2 | 2012-07-03 |
Creation Of Vias And Trenches With Different Depths
App 20120153503 - Ponoth; Shom ; et al. | 2012-06-21 |
Barrier Layer Formation For Metal Interconnects Through Enhanced Impurity Diffusion
App 20120061838 - Edelstein; Daniel C. ; et al. | 2012-03-15 |
Structure And Method For Manufacturing Interconnect Structures Having Self-aligned Dielectric Caps
App 20110272812 - HORAK; DAVID V. ; et al. | 2011-11-10 |
Microelectronic Structure Including Air Gap
App 20110266682 - Edelstein; Daniel C. ; et al. | 2011-11-03 |
Structure and method for back end of the line integration
Grant 8,021,974 - Yang , et al. September 20, 2 | 2011-09-20 |
Programmable anti-fuse structure with DLC dielectric layer
Grant 8,008,669 - Yang , et al. August 30, 2 | 2011-08-30 |
Air gap structure having protective metal silicide pads on a metal feature
Grant 8,003,520 - Bonilla , et al. August 23, 2 | 2011-08-23 |
Formation Of Air Gap With Protection Of Metal Lines
App 20110193230 - Nogami; Takeshi ; et al. | 2011-08-11 |
INTERCONNECT STRUCTURE EMPLOYING A Mn-GROUP VIIIB ALLOY LINER
App 20110180309 - Edelstein; Daniel C. ; et al. | 2011-07-28 |
Integrated Circuit Line With Electromigration Barriers
App 20110163450 - Horak; David V. ; et al. | 2011-07-07 |
Large grain size conductive structure for narrow interconnect openings
Grant 7,956,463 - Yang , et al. June 7, 2 | 2011-06-07 |
Copper interconnect structure with amorphous tantalum iridium diffusion barrier
Grant 7,951,708 - DeHaven , et al. May 31, 2 | 2011-05-31 |
Creation Of Vias And Trenches With Different Depths
App 20110101538 - Ponoth; Shom ; et al. | 2011-05-05 |
Air Gap Structure Having Protective Metal Silicide Pads On A Metal Feature
App 20110092067 - Bonilla; Griselda ; et al. | 2011-04-21 |
Interconnect structure
Grant 7,928,570 - Ponoth , et al. April 19, 2 | 2011-04-19 |
Pad Bonding Employing A Self-aligned Plated Liner For Adhesion Enhancement
App 20110084403 - Yang; Chih-Chao ; et al. | 2011-04-14 |
Large Grain Size Conductive Structure For Narrow Interconnect Openings
App 20110062587 - Yang; Chih-Chao ; et al. | 2011-03-17 |
Via gouging methods and related semiconductor structure
Grant 7,892,968 - Chen , et al. February 22, 2 | 2011-02-22 |
Air gap structure having protective metal silicide pads on a metal feature
Grant 7,884,477 - Bonilla , et al. February 8, 2 | 2011-02-08 |
Formation Of Alloy Liner By Reaction Of Diffusion Barrier And Seed Layer For Interconnect Application
App 20110017499 - Yang; Chih-Chao ; et al. | 2011-01-27 |
Programmable Anti-fuse Structure With Dlc Dielectric Layer
App 20110018093 - Yang; Chih-Chao ; et al. | 2011-01-27 |
Structure including via having refractory metal collar at copper wire and dielectric layer liner-less interface and related method
Grant 7,859,113 - Edelstein , et al. December 28, 2 | 2010-12-28 |
Copper Interconnect Structure With Amorphous Tantalum Iridium Diffusion Barrier
App 20100311236 - DeHaven; Patrick W. ; et al. | 2010-12-09 |
Interconnect Structure
App 20100264543 - Ponoth; Shom ; et al. | 2010-10-21 |
Structure And Method For Back End Of The Line Integration
App 20100176512 - Yang; Chih-Chao ; et al. | 2010-07-15 |
Interconnect structure with a mushroom-shaped oxide capping layer and method for fabricating same
Grant 7,687,877 - Yang , et al. March 30, 2 | 2010-03-30 |
Interconnect Structure With A Mushroom-shaped Oxide Capping Layer And Method For Fabricating Same
App 20090278258 - Yang; Chih-Chao ; et al. | 2009-11-12 |
Crack stop trenches in multi-layered low-k semiconductor devices
Grant 7,572,738 - Nogami August 11, 2 | 2009-08-11 |
Via Gouging Methods And Related Semiconductor Structure
App 20090184400 - Chen; Shyng-Tsong ; et al. | 2009-07-23 |
Barrier Sequence For Use In Copper Interconnect Metallization
App 20090179328 - Nogami; Takeshi ; et al. | 2009-07-16 |
Air Gap Structure Having Protective Metal Silicide Pads On A Metal Feature
App 20090140428 - Bonilla; Griselda ; et al. | 2009-06-04 |
Interconnect Structure And Method Of Making Same
App 20090127711 - Bonilla; Griselda ; et al. | 2009-05-21 |
Advanced low dielectric constant organosilicon plasma chemical vapor deposition films
Grant 7,494,938 - Nguyen , et al. February 24, 2 | 2009-02-24 |
Method of forming a catalyst layer on the barrier layer of a conductive interconnect of a semiconductor device
Grant 7,465,652 - Nogami December 16, 2 | 2008-12-16 |
Composite inter-level dielectric structure for an integrated circuit
Grant 7,422,975 - Nogami , et al. September 9, 2 | 2008-09-09 |
Structure Including Via Having Refractory Metal Collar At Copper Wire And Dielectric Layer Liner-less Interface And Related Method
App 20080203570 - Edelstein; Daniel C. ; et al. | 2008-08-28 |
Cobalt tungsten phosphate used to fill voids arising in a copper metallization process
Grant 7,317,253 - Nogami January 8, 2 | 2008-01-08 |
Damascene interconnection having porous low k layer with a hard mask reduced in thickness
Grant 7,300,868 - Fukasawa , et al. November 27, 2 | 2007-11-27 |
Damage recovery method for low K layer in a damascene interconnection
App 20070232047 - Fukasawa; Masanaga ; et al. | 2007-10-04 |
Damascene interconnection having porous low k layer with a hard mask reduced in thickness
App 20070231993 - Fukasawa; Masanaga ; et al. | 2007-10-04 |
Damascene interconnection having porous low K layer with improved mechanical properties
App 20070232046 - Miyata; Koji ; et al. | 2007-10-04 |
Damascene interconnection having porous low k layer followed by a nonporous low k layer
App 20070232062 - Nogami; Takeshi | 2007-10-04 |
Polishing method and electropolishing apparatus
Grant 7,255,784 - Sato , et al. August 14, 2 | 2007-08-14 |
Metal interconnect structure for integrated circuits and a design rule therefor
Grant 7,251,799 - Nogami , et al. July 31, 2 | 2007-07-31 |
Method for producing semiconductor device, polishing apparatus, and polishing method
Grant 7,232,760 - Nogami , et al. June 19, 2 | 2007-06-19 |
Advanced Low Dielectric Constant Organosilicon Plasma Chemical Vapor Deposition Films
App 20070128882 - Nguyen; Son V. ; et al. | 2007-06-07 |
Advanced low dielectric constant organosilicon plasma chemical vapor deposition films
Grant 7,202,564 - Nguyen , et al. April 10, 2 | 2007-04-10 |
Polishing method, polishing apparatus, plating method, and plating apparatus
App 20070051632 - Sato; Shuzo ; et al. | 2007-03-08 |
Electropolishing liquid, electropolishing method, and method for fabricating semiconductor device
App 20070051638 - Sato; Shuzo ; et al. | 2007-03-08 |
Methods of producing and polishing semiconductor device and polishing apparatus
Grant 7,186,322 - Sato , et al. March 6, 2 | 2007-03-06 |
Metal interconnect structure for integrated circuits and a design rule therefor
App 20070045850 - Nogami; Takeshi ; et al. | 2007-03-01 |
Integrated circuit chip stack employing carbon nanotube interconnects
App 20070045762 - Nogami; Takeshi ; et al. | 2007-03-01 |
Composite inter-level dielectric structure for an integrated circuit
App 20070042589 - Nogami; Takeshi ; et al. | 2007-02-22 |
Method of forming a catalyst layer on the barrier layer of a conductive interconnect of a semiconductor device
App 20070042587 - Nogami; Takeshi | 2007-02-22 |
Polishing method and electropolishing apparatus
Grant 7,156,975 - Sato , et al. January 2, 2 | 2007-01-02 |
Polishing method, polishing apparatus, and method of manufacturing semiconductor device
Grant 7,141,501 - Horikoshi , et al. November 28, 2 | 2006-11-28 |
Crack stop trenches in multi-layered low-k semiconductor devices
App 20060264035 - Nogami; Takeshi | 2006-11-23 |
Cobalt tungsten phosphate used to fill voids arising in a copper metallization process
App 20060237853 - Nogami; Takeshi | 2006-10-26 |
Advanced Low Dielectric Constant Organosilicon Plasma Chemical Vapor Deposition Films
App 20060183345 - Nguyen; Son ; et al. | 2006-08-17 |
Method of producing a semiconductor device having copper wiring
Grant 6,979,645 - Horikoshi , et al. December 27, 2 | 2005-12-27 |
Polishing method, polishing apparatus, and method of manufacturing semiconductor device
App 20050239283 - Horikoshi, Hiroshi ; et al. | 2005-10-27 |
Polishing system and polishing method
App 20050224368 - Sato, Shuzo ; et al. | 2005-10-13 |
Polishing method, polishing device, and method of manufacturing semiconductor equipment
App 20050178672 - Sato, Shuzo ; et al. | 2005-08-18 |
Method of producing metallic film
Grant 6,911,396 - Sato , et al. June 28, 2 | 2005-06-28 |
Electropolishing apparatus, electropolishing method, and method of manufacturing semiconductor device
App 20050121335 - Nogami, Takeshi ; et al. | 2005-06-09 |
Electro-chemical machining apparatus
App 20050082165 - Sato, Shuzo ; et al. | 2005-04-21 |
Semiconductor device having a conductive layer with a cobalt tungsten phosphorus coating and a manufacturing method thereof
Grant 6,878,632 - Nogami , et al. April 12, 2 | 2005-04-12 |
Polishing method and polishing apparatus
Grant 6,855,634 - Sato , et al. February 15, 2 | 2005-02-15 |
Method for producing semiconductor device, polishing apparatus, and polishing method
App 20050016960 - Nogami, Takeshi ; et al. | 2005-01-27 |
Electro-chemical machining appartus
Grant 6,846,227 - Sato , et al. January 25, 2 | 2005-01-25 |
Semiconductor device manufacturing method
App 20050014359 - Segawa, Yuji ; et al. | 2005-01-20 |
Method of producing semiconductor device
App 20050003654 - Horikoshi, Hiroshi ; et al. | 2005-01-06 |
Electrochemical thin film polishing method and polishing apparatus
Grant 6,835,292 - Sato , et al. December 28, 2 | 2004-12-28 |
Polishing method polishing system and method for fabricating semiconductor device
App 20040259365 - Komai, Naoki ; et al. | 2004-12-23 |
Semiconductor production device and production method for semiconductor device
Grant 6,809,029 - Nogami , et al. October 26, 2 | 2004-10-26 |
Electrolytic polishing method
Grant 6,808,617 - Sato , et al. October 26, 2 | 2004-10-26 |
Electro-chemical machining apparatus
App 20040188244 - Sato, Shuzo ; et al. | 2004-09-30 |
Electrolytic polishing apparatus, electrolytic polishing method, and wafer subject to polishing
App 20040188273 - Nogami, Takeshi ; et al. | 2004-09-30 |
Methods of producing and polishing semiconductor device and polishing apparatus
Grant 6,797,623 - Sato , et al. September 28, 2 | 2004-09-28 |
Polishing method, polishing apparatus, plating method, and plating apparatus
App 20040182720 - Sato, Shuzo ; et al. | 2004-09-23 |
Semiconductor manufacturing apparatus and method for manufacturing semiconductor devices
App 20040159553 - Nogami, Takeshi ; et al. | 2004-08-19 |
Electrolytic polishing liquid, electrolytic polishing method and method for fabricating semiconductor device
App 20040159557 - Sato, Shuzo ; et al. | 2004-08-19 |
Method of forming buried wiring
Grant 6,777,321 - Nogami , et al. August 17, 2 | 2004-08-17 |
Device and method for electroless plating
App 20040137161 - Segawa, Yuji ; et al. | 2004-07-15 |
Polishing method and electropolishing apparatus
App 20040104128 - Sato, Shuzo ; et al. | 2004-06-03 |
Method of producing metal film
App 20040097070 - Sato, Shuzo ; et al. | 2004-05-20 |
Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing
Grant 6,736,699 - Nogami , et al. May 18, 2 | 2004-05-18 |
Polishing method and polishing apparatus
App 20040092110 - Sato, Shuzo ; et al. | 2004-05-13 |
Self-aligned semiconductor interconnect barrier and manufacturing method therefor
Grant 6,734,559 - Yang , et al. May 11, 2 | 2004-05-11 |
Method of manufacturing a semiconductor device
Grant 6,709,979 - Komai , et al. March 23, 2 | 2004-03-23 |
Integrated circuit chip with high-aspect ratio vias
Grant 6,710,447 - Nogami March 23, 2 | 2004-03-23 |
Method for producing semiconductor device polishing apparatus, and polishing method
Grant 6,693,036 - Nogami , et al. February 17, 2 | 2004-02-17 |
Method of forming reliable capped copper interconnects
Grant 6,660,634 - Ngo , et al. December 9, 2 | 2003-12-09 |
Method for fabricating semiconductor devices
Grant 6,602,787 - Komai , et al. August 5, 2 | 2003-08-05 |
Semiconductor device and production method therefor
App 20030119317 - Nogami, Takeshi ; et al. | 2003-06-26 |
Methods of producing and polishing semiconductor device and polishing apparatus
App 20030114004 - Sato, Shuzo ; et al. | 2003-06-19 |
Semiconductor production device and production method for semiconductor device
App 20030113996 - Nogami, Takeshi ; et al. | 2003-06-19 |
Polishing method and electropolishing apparatus
App 20030104762 - Sato, Shuzo ; et al. | 2003-06-05 |
Method of forming buried wiring, and apparatus for processing substratum
App 20030072888 - Nogami, Takeshi ; et al. | 2003-04-17 |
Process for fabricating a semiconductor device
Grant 6,479,384 - Komai , et al. November 12, 2 | 2002-11-12 |
Electro-chemical machining apparatus
App 20020160698 - Sato, Shuzo ; et al. | 2002-10-31 |
Semiconductor device comprising copper interconnects with reduced in-line copper diffusion
Grant 6,472,755 - Ngo , et al. October 29, 2 | 2002-10-29 |
Prevention of inter-channel current leakage in semiconductors
Grant 6,465,345 - Nogami , et al. October 15, 2 | 2002-10-15 |
Electrolytic polishing apparatus, electrolytic polishing method and wafer subject to polishing
App 20020090884 - Nogami, Takeshi ; et al. | 2002-07-11 |
Single grain copper interconnect with bamboo structure in a trench
Grant 6,417,571 - Nogami , et al. July 9, 2 | 2002-07-09 |
Semiconductor device and manufacturing method thereof
App 20020074664 - Nogami, Takeshi ; et al. | 2002-06-20 |
Polishing method, polishing apparatus, plating method, and plating apparatus
App 20020070126 - Sato, Shuzo ; et al. | 2002-06-13 |
Polishing method and polishing apparatus
App 20020072309 - Sato, Shuzo ; et al. | 2002-06-13 |
Method for fabricating semiconductor devices
App 20020068438 - Komai, Naoki ; et al. | 2002-06-06 |
Semiconductor device a burried wiring structure and process for fabricating the same
Grant 6,395,627 - Hoshino , et al. May 28, 2 | 2002-05-28 |
Semiconductor interconnect barrier and manufacturing method thereof
Grant 6,380,625 - Pramanick , et al. April 30, 2 | 2002-04-30 |
Graded compound seed layers for semiconductors
Grant 6,368,961 - Lopatin , et al. April 9, 2 | 2002-04-09 |
Method of manufactuing a semiconductor device
App 20020016064 - Komai, Naoki ; et al. | 2002-02-07 |
Pad structure for copper interconnection and its formation
App 20020005582 - Nogami, Takeshi ; et al. | 2002-01-17 |
Method of reducing in-line copper diffusion
Grant 6,335,283 - Ngo , et al. January 1, 2 | 2002-01-01 |
Semiconductor Interconnect Barrier And Manufacturing Method Thereof
App 20010042917 - PRAMANICK, SHEKHAR ; et al. | 2001-11-22 |
Method And System For Copper Interconnect Formation
App 20010041447 - NOGAMI, TAKESHI | 2001-11-15 |
Methods of producing and polishing semiconductor device and polishing apparatus
App 20010036746 - Sato, Shuzo ; et al. | 2001-11-01 |
Copper interconnect with improved electromigration resistance
Grant 6,303,505 - Ngo , et al. October 16, 2 | 2001-10-16 |
Process for fabricating a semiconductor device
App 20010019892 - Komai, Naoki ; et al. | 2001-09-06 |
Damascene metal interconnects using highly directional deposition of barrier and/or seed layers including (III) filling metal
Grant 6,281,121 - Brown , et al. August 28, 2 | 2001-08-28 |
Method for forming semiconductor seed layers by high bias deposition
Grant 6,261,946 - Iacoponi , et al. July 17, 2 | 2001-07-17 |
Method of forming copper/copper alloy interconnection with reduced electromigration
Grant 6,242,349 - Nogami , et al. June 5, 2 | 2001-06-05 |
Tungsten plug formation
Grant 6,235,632 - Nogami , et al. May 22, 2 | 2001-05-22 |
Method for forming semiconductor seed layers by inert gas sputter etching
Grant 6,228,754 - Iacoponi , et al. May 8, 2 | 2001-05-08 |
Copper metalization with improved electromigration resistance
Grant 6,214,731 - Nogami , et al. April 10, 2 | 2001-04-10 |
Method of forming reliable copper interconnects
Grant 6,211,084 - Ngo , et al. April 3, 2 | 2001-04-03 |
Graded compound seed layers for semiconductors
Grant 6,174,799 - Lopatin , et al. January 16, 2 | 2001-01-16 |
Method of reliably capping copper interconnects
Grant 6,165,894 - Pramanick , et al. December 26, 2 | 2000-12-26 |
Method of making a semiconductor device comprising copper interconnects with reduced in-line copper diffusion
Grant 6,146,988 - Ngo , et al. November 14, 2 | 2000-11-14 |
Method for forming low dielectric passivation of copper interconnects
Grant 6,147,000 - You , et al. November 14, 2 | 2000-11-14 |
Pad structure for copper interconnection and its formation
Grant 6,117,769 - Nogami , et al. September 12, 2 | 2000-09-12 |
Apparatus for forming a copper interconnect
Grant 6,106,680 - Nogami , et al. August 22, 2 | 2000-08-22 |
Method of improving Cu damascene interconnect reliability by laser anneal before barrier polish
Grant 6,103,624 - Nogami , et al. August 15, 2 | 2000-08-15 |
Copper/low dielectric interconnect formation with reduced electromigration
Grant 6,096,648 - Lopatin , et al. August 1, 2 | 2000-08-01 |
Semiconductor interconnect interface processing by high pressure deposition
Grant 6,080,669 - Iacoponi , et al. June 27, 2 | 2000-06-27 |
Method and system for electrical coupling to copper interconnects
Grant 6,071,813 - Nogami June 6, 2 | 2000-06-06 |
Method for fabricating protected copper metallization
Grant 6,066,557 - Lukanc , et al. May 23, 2 | 2000-05-23 |
Method for making multilayered coaxial interconnect structure
Grant 6,060,383 - Nogami , et al. May 9, 2 | 2000-05-09 |
Method for fabricating dual layer protective barrier copper metallization
Grant 6,059,940 - Nogami , et al. May 9, 2 | 2000-05-09 |
Method for reducing electromigration in a copper interconnect
Grant 6,043,153 - Nogami , et al. March 28, 2 | 2000-03-28 |
Process for reducing copper oxide during integrated circuit fabrication
Grant 6,033,584 - Ngo , et al. March 7, 2 | 2000-03-07 |
Copper interconnect methodology for enhanced electromigration resistance
Grant 6,022,808 - Nogami , et al. February 8, 2 | 2000-02-08 |
Method of metal/polysilicon gate formation in a field effect transistor
Grant 6,015,747 - Lopatin , et al. January 18, 2 | 2000-01-18 |
Method and system for providing an interconnect having reduced failure rates due to voids
Grant 6,010,960 - Nogami January 4, 2 | 2000-01-04 |
Via with barrier layer for impeding diffusion of conductive material from via into insulator
Grant 6,001,415 - Nogami , et al. December 14, 1 | 1999-12-14 |
Method of electroplating a copper or copper alloy interconnect
Grant 5,968,333 - Nogami , et al. October 19, 1 | 1999-10-19 |
Method for reducing oxidation of electroplating chamber contacts and improving uniform electroplating of a substrate
Grant 5,882,498 - Dubin , et al. March 16, 1 | 1999-03-16 |
Method of manufacturing Schottky barrier gate FET
Grant 5,187,111 - Nogami , et al. February 16, 1 | 1993-02-16 |
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