Niu; Chengyu

Patent Applications and Registrations

Patent applications and USPTO patent grants for Niu; Chengyu.The latest application filed is for "low resistance ruthenium-containing contacts".

Company Profile

3.13.13

Niu; Chengyu - Niskayuna NY
Niu; Chengyu - Albany NY
Niu; Chengyu - Fishkill NY
Niu; Chengyu - Hopewell Junction NY US
Niu; Chengyu - The Colony TX US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Methods and devices for enhancing mobility of charge carriers Grant 10,553,497 - Zhang , et al. Fe	2020-02-04
Methods of forming metal-gate semiconductor devices with enhanced mobility of charge carriers Grant 10,546,789 - Zhang , et al. Ja	2020-01-28
Methods and devices for enhancing mobility of charge carriers Grant 10,438,856 - Zhang , et al. O	2019-10-08
Low resistance contacts to source or drain region of transistor Grant 10,283,608 - Zhang , et al.	2019-05-07
Low Resistance Ruthenium-containing Contacts App 20180269297 - ZHANG; Xunyuan ; et al.	2018-09-20
Method, apparatus, and system for MOL interconnects without titanium liner Grant 10,026,693 - Kamineni , et al. July 17, 2	2018-07-17
Method, Apparatus, And System For Mol Interconnects Without Titanium Liner App 20170243823 - Kamineni; Vimal ; et al.	2017-08-24
Method, apparatus, and system for MOL interconnects without titanium liner Grant 9,679,807 - Kamineni , et al. June 13, 2	2017-06-13
Method, Apparatus, And System For Mol Interconnects Without Titanium Liner App 20170148669 - Kamineni; Vimal ; et al.	2017-05-25
Methods And Devices For Enhancing Mobility Of Charge Carriers App 20170011971 - ZHANG; John H. ; et al.	2017-01-12
Methods And Devices For Enhancing Mobility Of Charge Carriers App 20160118307 - Zhang; John H. ; et al.	2016-04-28
Copper interconnect with CVD liner and metallic cap Grant 9,111,938 - Baumann , et al. August 18, 2	2015-08-18
Copper Interconnect With Cvd Liner And Metallic Cap App 20150061135 - Baumann; Frieder H. ; et al.	2015-03-05
Methods And Devices For Enhancing Mobility Of Charge Carriers App 20140299938 - Zhang; John H. ; et al.	2014-10-09
Copper Seed Layer For An Interconnect Structure Having A Doping Concentration Level Gradient App 20140138832 - Niu; Chengyu ; et al.	2014-05-22
Sandwiched Diffusion Barrier And Metal Liner For An Interconnect Structure App 20140138837 - Niu; Chengyu ; et al.	2014-05-22
Copper seed layer for an interconnect structure having a doping concentration level gradient Grant 8,729,702 - Niu , et al. May 20, 2	2014-05-20
Dual thin film precision resistance trimming Grant 8,493,171 - Le Neel , et al. July 23, 2	2013-07-23
Via-less thin film resistor with a dielectric cap Grant 8,400,257 - Lim , et al. March 19, 2	2013-03-19
Dual Thin Film Precision Resistance Trimming App 20120266452 - Le Neel; Olivier ; et al.	2012-10-25
Dual thin film precision resistance trimming Grant 8,242,876 - Le Neel , et al. August 14, 2	2012-08-14
Via-less Thin Film Resistor With A Dielectric Cap App 20120049997 - Lim; Ting Fang ; et al.	2012-03-01
Dual Thin Film Precision Resistance Trimming App 20100073122 - Le Neel; Olivier ; et al.	2010-03-25
Hybrid ionized physical vapor deposition of via and trench liners App 20070232060 - Niu; Chengyu	2007-10-04

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