Nitta; Satyanarayana Venkata

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nitta; Satyanarayana Venkata.The latest application filed is for "facilitating vocabulary expansion".

Company Profile

3.10.11

Nitta; Satyanarayana Venkata - Yorktown Heights NY
Nitta; Satyanarayana Venkata - Westchester NY
Nitta; Satyanarayana Venkata - Poughquag NY
Nitta; Satyanarayana Venkata - Fishkill NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Learning with smart blocks Grant 10,847,046 - Bellamy , et al. November 24, 2	2020-11-24
Facilitating Vocabulary Expansion App 20190080626 - Dey; Prasenjit ; et al.	2019-03-14
Facilitating Vocabulary Expansion App 20190080627 - Dey; Prasenjit ; et al.	2019-03-14
Learning With Smart Blocks App 20180211550 - Bellamy; Rachel Katherine Emma ; et al.	2018-07-26
Multi component dielectric layer Grant 8,357,608 - Gates , et al. January 22, 2	2013-01-22
Method To Generate Airgaps With A Template First Scheme And A Self Aligned Blockout Mask And Structure App 20110163446 - Nitta; Satyanarayana Venkata ; et al.	2011-07-07
Electronics structures using a sacrificial multi-layer hardmask scheme Grant 7,947,907 - Colburn , et al. May 24, 2	2011-05-24
Forming interconnects with air gaps Grant 7,790,601 - Choi , et al. September 7, 2	2010-09-07
Electronics Structures Using a Sacrificial Multi-Layer Hardmask Scheme App 20080251284 - Colburn; Matthew Earl ; et al.	2008-10-16
Fabrication of Interconnect Structures App 20080166870 - Huang; Elbert Emin ; et al.	2008-07-10
Method to generate airgaps with a template first scheme and a self aligned blockout mask App 20080122106 - Nitta; Satyanarayana Venkata ; et al.	2008-05-29
Process for preparing electronics structures using a sacrificial multilayer hardmask scheme Grant 7,371,684 - Colburn , et al. May 13, 2	2008-05-13
Line level air gaps App 20060264036 - Chen; Shyng-Tsong ; et al.	2006-11-23
Process for preparing electronics structures using a sacrificial multilayer hardmask scheme App 20060258159 - Colburn; Matthew Earl ; et al.	2006-11-16
Line level air gaps Grant 7,084,479 - Chen , et al. August 1, 2	2006-08-01
Line level air gaps App 20050127514 - Chen, Shyng-Tsong ; et al.	2005-06-16
Multilevel interconnect structure containing air gaps and method for making Grant 6,737,725 - Grill , et al. May 18, 2	2004-05-18
Multilevel interconnect structure containing air gaps and method for making App 20020127844 - Grill, Alfred ; et al.	2002-09-12
Method of forming multilevel interconnect structure containing air gaps including utilizing both sacrificial and placeholder material Grant 6,413,852 - Grill , et al. July 2, 2	2002-07-02
Method for selective extraction of sacrificial place-holding material used in fabrication of air gap-containing interconnect structures Grant 6,346,484 - Cotte , et al. February 12, 2	2002-02-12

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