Nishimura; Asao
Patent Applications and Registrations
Patent applications and USPTO patent grants for Nishimura; Asao.The latest application filed is for "pb-free solder-connected structure".
Company Profile
0.100.73
- Nishimura; Asao - Kokubunji JP
- Nishimura; Asao - Koganei JP
- Nishimura; Asao - Tokyo JP
- Nishimura; Asao - Kokubunji-shi JP
- Nishimura; Asao - Kokubuji JP
- Nishimura; Asao - Kodaira JP
- Nishimura; Asao - Ushiku JP
- Nishimura; Asao - Koganel JP
- Nishimura, Asao - Ushiku-shi JP
- Nishimura; Asao - Ibaraki JP
Patent Activity
| Patent | Date |
|---|---|
| Pb-free solder-connected structure Grant 8,907,475 - Shimokawa , et al. December 9, 2 | 2014-12-09 |
| Semiconductor integrated circuit device Grant 8,629,481 - Nishimura , et al. January 14, 2 | 2014-01-14 |
| Pb-FREE SOLDER-CONNECTED STRUCTURE App 20130286621 - SHIMOKAWA; Hanae ; et al. | 2013-10-31 |
| Pb-free solder-connected structure and electronic device Grant 8,503,189 - Shimokawa , et al. August 6, 2 | 2013-08-06 |
| Semiconductor Integrated Circuit Device And Manufacture Thereof App 20110140185 - Nishimura; Asao ; et al. | 2011-06-16 |
| Semiconductor integrated circuit device and manufacture thereof Grant 7,910,922 - Nishimura , et al. March 22, 2 | 2011-03-22 |
| Semiconductor integrated circuit device with a fuse circuit Grant 7,910,960 - Nishimura , et al. March 22, 2 | 2011-03-22 |
| Semiconductor Integrated Circuit Device And Manufacture Thereof App 20100301334 - Nishimura; Asao ; et al. | 2010-12-02 |
| Pb-free solder-connected structure and electronic device App 20100214753 - SHIMOKAWA; Hanae ; et al. | 2010-08-26 |
| Pb-free solder-connected structure and electronic device Grant 7,709,746 - Shimokawa , et al. May 4, 2 | 2010-05-04 |
| Semiconductor Integrated Circuit Device And Manufacture Thereof App 20090230448 - Nishimura; Asao ; et al. | 2009-09-17 |
| Semiconductor integrated circuit device and manufacture thereof Grant 7,550,763 - Nishimura , et al. June 23, 2 | 2009-06-23 |
| Semiconductor device and manufacturing method thereof Grant 7,420,284 - Miyazaki , et al. September 2, 2 | 2008-09-02 |
| Multi-chip module Grant 7,388,295 - Kazama , et al. June 17, 2 | 2008-06-17 |
| Semiconductor device and manufacturing method thereof Grant 7,378,333 - Satoh , et al. May 27, 2 | 2008-05-27 |
| Semiconductor integrated circuit device and manufacture thereof App 20070241330 - Nishimura; Asao ; et al. | 2007-10-18 |
| Semiconductor integrated circuit device having particular testing pad arrangement Grant 7,247,879 - Nishimura , et al. July 24, 2 | 2007-07-24 |
| Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Grant 7,217,992 - Ogino , et al. May 15, 2 | 2007-05-15 |
| Semiconductor device and manufacturing method thereof App 20060261494 - Miyazaki; Chuichi ; et al. | 2006-11-23 |
| Semiconductor device Grant 7,138,722 - Miyamoto , et al. November 21, 2 | 2006-11-21 |
| Semiconductor device Grant 7,119,446 - Shimizu , et al. October 10, 2 | 2006-10-10 |
| Memory-Module with an increased density for mounting semiconductor chips Grant 7,102,221 - Miyamoto , et al. September 5, 2 | 2006-09-05 |
| Semiconductor device and manufacturing method thereof Grant 7,091,620 - Miyazaki , et al. August 15, 2 | 2006-08-15 |
| Semiconductor device App 20060125078 - Shimizu; Hiroya ; et al. | 2006-06-15 |
| Multi-chip module App 20060125116 - Kazama; Atsushi ; et al. | 2006-06-15 |
| Semiconductor device and method for producing the same Grant 7,057,283 - Inoue , et al. June 6, 2 | 2006-06-06 |
| Pb-free solder-connected structure and electronic device App 20060115994 - Shimokawa; Hanae ; et al. | 2006-06-01 |
| Multi-chip module Grant 7,038,322 - Kazama , et al. May 2, 2 | 2006-05-02 |
| Wiring tape for semiconductor device including a buffer layer having interconnected foams Grant 7,038,325 - Ogino , et al. May 2, 2 | 2006-05-02 |
| Semiconductor device Grant 7,030,478 - Shimizu , et al. April 18, 2 | 2006-04-18 |
| Method of producing an electronic device having a PB free solder connection Grant 7,013,564 - Shimokawa , et al. March 21, 2 | 2006-03-21 |
| Semiconductor device and manufacturing method thereof App 20050245061 - Satoh, Toshiya ; et al. | 2005-11-03 |
| Pb-free solder-connected structure and electronic device Grant 6,960,396 - Shimokawa , et al. November 1, 2 | 2005-11-01 |
| Semiconductor device and manufacturing metthod thereof App 20050212142 - Miyazaki, Chuichi ; et al. | 2005-09-29 |
| Method of manufacturing a semiconductor integrated circuit device Grant 6,949,416 - Miyamoto , et al. September 27, 2 | 2005-09-27 |
| Semiconductor device and manufacturing method of that Grant 6,946,327 - Miyamoto , et al. September 20, 2 | 2005-09-20 |
| Semiconductor device and manufacturing method thereof Grant 6,946,723 - Satoh , et al. September 20, 2 | 2005-09-20 |
| Semiconductor device and manufacturing method thereof App 20050200019 - Miyazaki, Chuichi ; et al. | 2005-09-15 |
| Semiconductor module and mounting method for same Grant 6,940,162 - Eguchi , et al. September 6, 2 | 2005-09-06 |
| Semiconductor device App 20050184391 - Shimizu, Hiroya ; et al. | 2005-08-25 |
| Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure Grant 6,930,388 - Yamaguchi , et al. August 16, 2 | 2005-08-16 |
| Semiconductor device provided with rewiring layer Grant 6,927,489 - Yaguchi , et al. August 9, 2 | 2005-08-09 |
| Semiconductor device Grant 6,919,622 - Murakami , et al. July 19, 2 | 2005-07-19 |
| Semiconductor device App 20050146008 - Miyamoto, Toshio ; et al. | 2005-07-07 |
| Method Of Manufacturing A Semiconductor Device Having Plural Semiconductor Chips, Wherein Electrodes Of The Semiconductor Chips Are Electrically Connected Together Via Wiring Substrates Of The Semiconductor Chips Grant 6,900,074 - Miyamoto , et al. May 31, 2 | 2005-05-31 |
| Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device Grant 6,888,230 - Ogino , et al. May 3, 2 | 2005-05-03 |
| Semiconductor device Grant 6,882,039 - Shimizu , et al. April 19, 2 | 2005-04-19 |
| Method of forming bumps Grant 6,869,008 - Inoue , et al. March 22, 2 | 2005-03-22 |
| Wafer level chip size package having rerouting layers Grant 6,861,742 - Miyamoto , et al. March 1, 2 | 2005-03-01 |
| Multi-chip module App 20050029674 - Kazama, Atsushi ; et al. | 2005-02-10 |
| Semiconductor device and lead frame therefor Grant 6,844,219 - Kitano , et al. January 18, 2 | 2005-01-18 |
| Semiconductor device App 20050006751 - Shimizu, Hiroya ; et al. | 2005-01-13 |
| Semiconductor module and mounting method for same App 20040251540 - Eguchi, Shuji ; et al. | 2004-12-16 |
| Semiconductor integrated circuit device having bump electrodes for signal or power only, and testing pads that are not coupled to bump electrodes Grant 6,831,294 - Nishimura , et al. December 14, 2 | 2004-12-14 |
| Semiconductor integrated circuit device and manufacture thereof App 20040232446 - Nishimura, Asao ; et al. | 2004-11-25 |
| Semiconductor apparatus including insulating layer having a protrusive portion Grant 6,822,317 - Inoue , et al. November 23, 2 | 2004-11-23 |
| Semiconductor integrated circuit device and method of manufacturing the same App 20040227254 - Miyamoto, Toshio ; et al. | 2004-11-18 |
| Semiconductor device, semiconductor wafer, semiconductor module, and a method of manufacturing semiconductor device App 20040217453 - Ogino, Masahiko ; et al. | 2004-11-04 |
| Semiconductor device and method for producing the same App 20040195687 - Inoue, Kosuke ; et al. | 2004-10-07 |
| Wiring tape for semiconductor device including a buffer layer having interconnected foams App 20040195702 - Ogino, Masahiko ; et al. | 2004-10-07 |
| Flip chip assembly structure for semiconductor device and method of assembling therefor Grant 6,798,072 - Kajiwara , et al. September 28, 2 | 2004-09-28 |
| Semiconductor module and mounting method for same Grant 6,784,541 - Eguchi , et al. August 31, 2 | 2004-08-31 |
| Semiconductor device and manufacturing method thereof Grant 6,784,554 - Kajiwara , et al. August 31, 2 | 2004-08-31 |
| Semiconductor device Grant 6,784,533 - Shimizu , et al. August 31, 2 | 2004-08-31 |
| Multi-chip module Grant 6,777,816 - Kazama , et al. August 17, 2 | 2004-08-17 |
| Semiconductor device App 20040155323 - Murakami, Gen ; et al. | 2004-08-12 |
| Semiconductor device and manufacturing method of that App 20040155351 - Miyamoto, Toshio ; et al. | 2004-08-12 |
| Method for producing a semiconductor device Grant 6,770,547 - Inoue , et al. August 3, 2 | 2004-08-03 |
| Multi-chip Module App 20040108579 - Kazama, Atsushi ; et al. | 2004-06-10 |
| Semiconductor device Grant 6,720,208 - Murakami , et al. April 13, 2 | 2004-04-13 |
| Semiconductor integrated circuit device Grant 6,720,591 - Miyamoto , et al. April 13, 2 | 2004-04-13 |
| Semiconductor device and manufacturing method thereof App 20040061220 - Miyazaki, Chuichi ; et al. | 2004-04-01 |
| Semiconductor device comprising stress relaxation layers and method for manufacturing the same Grant 6,710,446 - Nagai , et al. March 23, 2 | 2004-03-23 |
| Multi-chip module Grant 6,696,765 - Kazama , et al. February 24, 2 | 2004-02-24 |
| Semiconductor device and manufacturing method thereof Grant 6,670,215 - Miyazaki , et al. December 30, 2 | 2003-12-30 |
| Method of manufacturing a ball grid array type semiconductor package Grant 6,664,135 - Miyazaki , et al. December 16, 2 | 2003-12-16 |
| Semiconductor device App 20030209740 - Miyamoto, Toshio ; et al. | 2003-11-13 |
| Semiconductor device and its manufacturing method App 20030207557 - Akiyama, Yukiharu ; et al. | 2003-11-06 |
| Semiconductor device and manufacturing method thereof Grant 6,642,083 - Miyazaki , et al. November 4, 2 | 2003-11-04 |
| Semiconductor device and its manufacturing method Grant 6,639,323 - Akiyama , et al. October 28, 2 | 2003-10-28 |
| Semiconductor device Grant 6,630,731 - Miyamoto , et al. October 7, 2 | 2003-10-07 |
| Semiconductor module and method of mounting Grant 6,627,997 - Eguchi , et al. September 30, 2 | 2003-09-30 |
| Semiconductor device and method for manufacturing the same Grant 6,624,504 - Inoue , et al. September 23, 2 | 2003-09-23 |
| Semiconductor apparatus having stress cushioning layer Grant 6,621,154 - Satoh , et al. September 16, 2 | 2003-09-16 |
| Semiconductor device Grant 6,611,012 - Miyamoto , et al. August 26, 2 | 2003-08-26 |
| Semiconductor device and manufacturing method thereof App 20030127747 - Kajiwara, Ryoichi ; et al. | 2003-07-10 |
| Semiconductor device App 20030127712 - Murakami, Gen ; et al. | 2003-07-10 |
| Memory-module and a method of manufacturing the same App 20030116835 - Miyamoto, Toshio ; et al. | 2003-06-26 |
| Multi-chip module App 20030094702 - Kazama, Atsushi ; et al. | 2003-05-22 |
| Memory-module and a method of manufacturing the same App 20030089978 - Miyamoto, Toshio ; et al. | 2003-05-15 |
| Semiconductor module and mounting method for same App 20030071348 - Eguchi, Shuji ; et al. | 2003-04-17 |
| Semiconductor device and manufacturing method thereof Grant 6,521,981 - Miyazaki , et al. February 18, 2 | 2003-02-18 |
| Semiconductor device with elastic structure and wiring Grant 6,515,371 - Akiyama , et al. February 4, 2 | 2003-02-04 |
| Semiconductor package and flip chip bonding method therein App 20030001286 - Kajiwara, Ryoichi ; et al. | 2003-01-02 |
| Semiconductor device App 20020190336 - Shimizu, Hiroya ; et al. | 2002-12-19 |
| Semiconductor device Grant 6,492,719 - Miyamoto , et al. December 10, 2 | 2002-12-10 |
| Pb-free solder-connected structure and electronic device App 20020163085 - Shimokawa, Hanae ; et al. | 2002-11-07 |
| Semiconductor device and wiring tape for semiconductor device App 20020158343 - Ogino, Masahiko ; et al. | 2002-10-31 |
| Semiconductor device and manufacturing method thereof Grant 6,472,727 - Miyazaki , et al. October 29, 2 | 2002-10-29 |
| Semiconductor integrated circuit device and method of manufacturing the same App 20020153539 - Miyamoto, Toshio ; et al. | 2002-10-24 |
| Semiconductor device and lead frame therefor App 20020135051 - Nishimura, Asao ; et al. | 2002-09-26 |
| Semiconductor device and method of manufacture thereof App 20020130412 - Nagai, Akira ; et al. | 2002-09-19 |
| Semiconductor device App 20020117742 - Miyamoto, Toshio ; et al. | 2002-08-29 |
| Semiconductor device and manufacturing method of that App 20020093082 - Miyamoto, Toshio ; et al. | 2002-07-18 |
| Semiconductor device App 20020089051 - Miyamoto, Toshio ; et al. | 2002-07-11 |
| Semiconductor device and manufacturing method thereof App 20020070461 - Miyazaki, Chuichi ; et al. | 2002-06-13 |
| Method of forming bumps Grant 6,402,014 - Inoue , et al. June 11, 2 | 2002-06-11 |
| Semiconductor device and manufacturing method thereof App 20020066181 - Miyazaki, Chuichi ; et al. | 2002-06-06 |
| Semiconductor device and manufacturing method thereof App 20020068380 - Miyazaki, Chuichi ; et al. | 2002-06-06 |
| Semiconductor device and manufacturing method thereof App 20020064901 - Miyazaki, Chuichi ; et al. | 2002-05-30 |
| Semiconductor device and method for manufacturing the same and semiconductor device-mounted structure App 20020063332 - Yamaguchi, Yoshihide ; et al. | 2002-05-30 |
| Semiconductor device and method for manufacturing the same technical field Grant 6,396,145 - Nagai , et al. May 28, 2 | 2002-05-28 |
| Flip chip assembly structure for semiconductor device and method of assembling therefor App 20020056906 - Kajiwara, Ryoichi ; et al. | 2002-05-16 |
| Lead frame and semiconductor device Grant RE37,690 - Kitano , et al. May 7, 2 | 2002-05-07 |
| Semiconductor device and its manufacturing method App 20020050636 - Akiyama, Yukiharu ; et al. | 2002-05-02 |
| Semiconductor device and its manufacturing method App 20020047215 - Akiyama, Yukiharu ; et al. | 2002-04-25 |
| Semiconductor device App 20020047179 - Shimizu, Hiroya ; et al. | 2002-04-25 |
| Semiconductor device App 20020038907 - Miyamoto, Toshio ; et al. | 2002-04-04 |
| Semiconductor device and manufacturing method thereof Grant 6,355,500 - Miyazaki , et al. March 12, 2 | 2002-03-12 |
| Semiconductor device and manufacturing method thereof Grant 6,355,975 - Miyazaki , et al. March 12, 2 | 2002-03-12 |
| Semiconductor device and manufacturing method thereof App 20020025655 - Satoh, Toshiya ; et al. | 2002-02-28 |
| Semiconductor device and production thereof App 20020019146 - Miura, Hideo ; et al. | 2002-02-14 |
| Pb-free solder-connected structure and electronic device App 20020019077 - Shimokawa, Hanae ; et al. | 2002-02-14 |
| Semiconductor device and production thereof App 20020013038 - Miura, Hideo ; et al. | 2002-01-31 |
| Technical field App 20020009610 - Shimokawa, Hanae ; et al. | 2002-01-24 |
| Semiconductor device Grant 6,335,565 - Miyamoto , et al. January 1, 2 | 2002-01-01 |
| Semiconductor Device And Manufacturing Method Thereof App 20010035575 - MIYAZAKI, CHUICHI ; et al. | 2001-11-01 |
| Semiconductor device and method for manufacturing the same Grant 6,297,544 - Nakamura , et al. October 2, 2 | 2001-10-02 |
| Semiconductor device and manufacturing method thereof App 20010008304 - Miyazaki, Chuichi ; et al. | 2001-07-19 |
| Semiconductor device App 20010008302 - Murakami, Gen ; et al. | 2001-07-19 |
| Semiconductor device and manufacturing method thereof App 20010007781 - Miyazaki, Chuichi ; et al. | 2001-07-12 |
| Semiconductor device and manufacturing method thereof App 20010005055 - Miyazaki, Chuichi ; et al. | 2001-06-28 |
| Semiconductor device and manufacturing method thereof App 20010004127 - Miyazaki, Chuichi ; et al. | 2001-06-21 |
| Semiconductor device and manufacturing method thereof App 20010003048 - Miyazaki, Chuichi ; et al. | 2001-06-07 |
| Semiconductor device and manufacturing method thereof App 20010002730 - Miyazaki, Chuichi ; et al. | 2001-06-07 |
| Semiconductor device and manufacturing method thereof App 20010003059 - Miyazaki, Chuichi ; et al. | 2001-06-07 |
| Semiconductor device and manufacturing method thereof App 20010002724 - Miyazaki, Chuichi ; et al. | 2001-06-07 |
| Semiconductor device and manufacturing method thereof App 20010002069 - Miyazaki, Chuichi ; et al. | 2001-05-31 |
| Semiconductor device and manufacturing method thereof App 20010002064 - Miyazaki, Chuichi ; et al. | 2001-05-31 |
| Method of forming bumps Grant 6,213,386 - Inoue , et al. April 10, 2 | 2001-04-10 |
| Semiconductor device App 20010000116 - Shimizu, Hiroya ; et al. | 2001-04-05 |
| Semiconductor device Grant 6,211,576 - Shimizu , et al. April 3, 2 | 2001-04-03 |
| Semiconductor device having all outer leads extending from one side of a resin member Grant 6,100,580 - Murakami , et al. August 8, 2 | 2000-08-08 |
| Resin sealed semiconductor devices and a process for manufacturing the same Grant 6,097,100 - Eguchi , et al. August 1, 2 | 2000-08-01 |
| Semiconductor device Grant 6,081,023 - Murakami , et al. June 27, 2 | 2000-06-27 |
| Semiconductor device chip on lead and lead on chip manufacturing Grant 6,069,029 - Murakami , et al. May 30, 2 | 2000-05-30 |
| Semiconductor device Grant 6,049,128 - Kitano , et al. April 11, 2 | 2000-04-11 |
| Semiconductor device Grant 5,895,965 - Tanaka , et al. April 20, 1 | 1999-04-20 |
| Process for producing a bipolar device Grant 5,643,805 - Ohta , et al. July 1, 1 | 1997-07-01 |
| Bipolar device and production thereof Grant 5,619,069 - Ohta , et al. April 8, 1 | 1997-04-08 |
| Semiconductor device Grant 5,612,569 - Murakami , et al. March 18, 1 | 1997-03-18 |
| Encapsulated semiconductor device package having holes for electrically conductive material Grant 5,608,265 - Kitano , et al. March 4, 1 | 1997-03-04 |
| Method for measuring adhesion strength of resin material Grant 5,537,884 - Nishimura , et al. July 23, 1 | 1996-07-23 |
| Plastic-molded-type semiconductor device Grant 5,539,250 - Kitano , et al. July 23, 1 | 1996-07-23 |
| Semiconductor device Grant 5,530,286 - Murakami , et al. June 25, 1 | 1996-06-25 |
| Semiconductor leadframe and its production method and plastic encapsulated semiconductor device Grant 5,437,915 - Nishimura , et al. August 1, 1 | 1995-08-01 |
| Semiconductor device Grant 5,358,904 - Murakami , et al. * October 25, 1 | 1994-10-25 |
| Plastic encapsulated semiconductor device and lead frame Grant 5,357,139 - Yaguchi , et al. October 18, 1 | 1994-10-18 |
| Plastic sealed type semiconductor apparatus Grant 5,299,092 - Yaguchi , et al. March 29, 1 | 1994-03-29 |
| Semiconductor device with a plurality of face to face chips Grant 5,296,737 - Nishimura , et al. March 22, 1 | 1994-03-22 |
| Semiconductor device Grant 5,293,068 - Kohno , et al. * March 8, 1 | 1994-03-08 |
| Product specification complex analysis system Grant 5,287,284 - Sugino , et al. February 15, 1 | 1994-02-15 |
| Plastic encapsulated semiconductor device Grant 5,256,903 - Obata , et al. October 26, 1 | 1993-10-26 |
| Semiconductor device having a particular chip pad structure Grant 5,159,434 - Kohno , et al. October 27, 1 | 1992-10-27 |
| Water quality inspection method and apparatus therefor Grant 5,110,537 - Miura , et al. May 5, 1 | 1992-05-05 |
| Semiconductor device Grant 5,068,712 - Murakami , et al. November 26, 1 | 1991-11-26 |
| Semiconductor device with heat transfer cap Grant 5,047,837 - Kitano , et al. September 10, 1 | 1991-09-10 |
| Lead frame and semiconductor device using the same Grant 5,041,901 - Kitano , et al. August 20, 1 | 1991-08-20 |
| Semiconductor device and method of manufacturing the same Grant 4,987,474 - Yasuhara , et al. January 22, 1 | 1991-01-22 |
| Lead frame and semiconductor device Grant 4,942,452 - Kitano , et al. July 17, 1 | 1990-07-17 |
| Piezoresistive strain sensing device Grant 4,739,381 - Miura , et al. April 19, 1 | 1988-04-19 |
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