Nishi; Kunihiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nishi; Kunihiko.The latest application filed is for "semiconductor device having a liquid cooling module".

Company Profile

0.70.49

Nishi; Kunihiko - Chiyoda-ku N/A JP
Nishi; Kunihiko - Tokyo JP
Nishi; Kunihiko - Kokubunji JP
Nishi, Kunihiko - Kokubunji-shi JP
Nishi; Kunihiko - Tokyo-to JP
Nishi; Kunihiko - Higashikurume JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device having a liquid cooling module Grant 8,937,390 - Hisano , et al. January 20, 2	2015-01-20
Semiconductor Device Having A Liquid Cooling Module App 20140183730 - HISANO; Nae ; et al.	2014-07-03
Semiconductor device having a liquid cooling module Grant 8,704,352 - Hisano , et al. April 22, 2	2014-04-22
Wafer Or Circuit Board And Joining Structure Of Wafer Or Circuit Board App 20130140067 - Ishino; Masakazu ; et al.	2013-06-06
Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof Grant RE44,148 - Nakamura , et al. April 16, 2	2013-04-16
Wafer of circuit board and joining structure of wafer or circuit board Grant 8,334,465 - Ishino , et al. December 18, 2	2012-12-18
Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes Grant RE43,444 - Nakamura , et al. June 5, 2	2012-06-05
Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof Grant RE42,972 - Nakamura , et al. November 29, 2	2011-11-29
Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof Grant RE41,722 - Nakamura , et al. September 21, 2	2010-09-21
Semiconductor device having an improved connected arrangement between a semiconductor pellet and base substrate electrodes Grant RE41,721 - Nakamura , et al. September 21, 2	2010-09-21
Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof Grant RE41,478 - Nakamura , et al. August 10, 2	2010-08-10
Method for manufacturing a three-dimensional semiconductor device and a wafer used therein Grant 7,754,581 - Ikeda , et al. July 13, 2	2010-07-13
Semiconductor Device Having A Liquid Cooling Module App 20100171213 - HISANO; Nae ; et al.	2010-07-08
Method of manufacturing a semiconductor device Grant 7,678,706 - Miyaki , et al. March 16, 2	2010-03-16
Bonding method of semiconductor and laminated structure fabricated thereby Grant 7,618,847 - Tenmei , et al. November 17, 2	2009-11-17
Semiconductor device and method of manufacturing the same Grant 7,541,667 - Miyaki , et al. June 2, 2	2009-06-02
Semiconductor Apparatus App 20090134498 - IKEDA; Hiroaki ; et al.	2009-05-28
Semiconductor device and method of manufacturing the same Grant 7,528,014 - Miyaki , et al. May 5, 2	2009-05-05
Wafer of circuit board and joining structure of wafer or circuit board App 20090109641 - Ishino; Masakazu ; et al.	2009-04-30
Bonding Method Of Semiconductor And Laminated Structure Fabricated Thereby App 20090072414 - TENMEI; Hiroyuki ; et al.	2009-03-19
Semiconductor device and manufacturing method thereof Grant 7,420,284 - Miyazaki , et al. September 2, 2	2008-09-02
Method For Manufacturing A Three-dimensional Semiconductor Device And A Wafer Used Therein App 20080164575 - Ikeda; Hiroaki ; et al.	2008-07-10
Semiconductor Device App 20080136024 - NAKA; Yasuhiro ; et al.	2008-06-12
Method Of Manufacturing A Semiconductor Device App 20070298545 - MIYAKI; Yoshinori ; et al.	2007-12-27
Method of manufacturing a semiconductor device Grant 7,247,576 - Miyaki , et al. July 24, 2	2007-07-24
Semiconductor device and manufacturing method thereof App 20060261494 - Miyazaki; Chuichi ; et al.	2006-11-23
Semiconductor device and manufacturing method thereof Grant 7,091,620 - Miyazaki , et al. August 15, 2	2006-08-15
Semiconductor device and its manufacturing method App 20060049499 - Miyaki; Yoshinori ; et al.	2006-03-09
Manufacturing method of a semiconductor device Grant 6,989,334 - Miyaki , et al. January 24, 2	2006-01-24
Surface package type semiconductor package and method of producing semiconductor memory Grant 6,981,585 - Kitamura , et al. January 3, 2	2006-01-03
Semiconductor device and method of manufacturing the same App 20050258524 - Miyaki, Yoshinori ; et al.	2005-11-24
Semiconductor device and method of manufacturing the same Grant 6,960,823 - Miyaki , et al. November 1, 2	2005-11-01
Semiconductor device and manufacturing metthod thereof App 20050212142 - Miyazaki, Chuichi ; et al.	2005-09-29
Semiconductor device and manufacturing method thereof App 20050200019 - Miyazaki, Chuichi ; et al.	2005-09-15
Plastic molded type semiconductor device and fabrication process thereof Grant 6,943,456 - Miyaki , et al. September 13, 2	2005-09-13
Semiconductor device and method of manufacturing the same App 20050196903 - Miyaki, Yoshinori ; et al.	2005-09-08
Semiconductor device, its fabrication method and electronic device App 20050167808 - Sasaki, Masako ; et al.	2005-08-04
Semiconductor device Grant 6,919,622 - Murakami , et al. July 19, 2	2005-07-19
Semiconductor integrated circuit device and its manufacturing method Grant 6,867,123 - Katagiri , et al. March 15, 2	2005-03-15
Semiconductor devices and methods of making the devices Grant 6,861,294 - Tsunoda , et al. March 1, 2	2005-03-01
Plastic molded type semiconductor device and fabrication process thereof App 20040159922 - Miyaki, Yoshinori ; et al.	2004-08-19
Semiconductor device App 20040155323 - Murakami, Gen ; et al.	2004-08-12
Semiconductor device Grant 6,720,208 - Murakami , et al. April 13, 2	2004-04-13
Semiconductor device and manufacturing method thereof App 20040061220 - Miyazaki, Chuichi ; et al.	2004-04-01
Semiconductor devices and methods of making the devices App 20040063272 - Tsunoda, Shigeharu ; et al.	2004-04-01
Plastic molded type semiconductor device and fabrication process thereof Grant 6,692,989 - Miyaki , et al. February 17, 2	2004-02-17
Semiconductor integrated circuit device and its manufacturing method App 20040023450 - Katagiri, Mitsuaki ; et al.	2004-02-05
Method of manufacturing a semiconductor device a ball grid array package structure using a supporting frame Grant 6,686,226 - Tsunoda , et al. February 3, 2	2004-02-03
Semiconductor device and manufacturing method thereof Grant 6,670,215 - Miyazaki , et al. December 30, 2	2003-12-30
Method of manufacturing a ball grid array type semiconductor package Grant 6,664,135 - Miyazaki , et al. December 16, 2	2003-12-16
Semiconductor device and manufacturing method thereof Grant 6,642,083 - Miyazaki , et al. November 4, 2	2003-11-04
Semiconductor device App 20030127712 - Murakami, Gen ; et al.	2003-07-10
Plastic molded type semiconductor device and fabrication process thereof App 20030124770 - Miyaki, Yoshinori ; et al.	2003-07-03
Surface package type semiconductor package and method of producing semiconductor memory App 20030057113 - Kitamura, Wahei ; et al.	2003-03-27
Semiconductor device and manufacturing method thereof Grant 6,521,981 - Miyazaki , et al. February 18, 2	2003-02-18
Method for mounting a thin semiconductor device App 20030027376 - Usami, Mitsuo ; et al.	2003-02-06
Semiconductor device, its fabrication method and electronic device App 20030017652 - Sakaki, Masako ; et al.	2003-01-23
Surface package type semiconductor package and method of producing semiconductor memory App 20020179460 - Kitamura, Wahei ; et al.	2002-12-05
Surface package type semiconductor package and method of producing semiconductor memory App 20020174627 - Kitamura, Wahei ; et al.	2002-11-28
Semiconductor device and manufacturing method thereof Grant 6,472,727 - Miyazaki , et al. October 29, 2	2002-10-29
Semiconductor device and method of manufacturing the same App 20020146864 - Miyaki, Yoshinori ; et al.	2002-10-10
Semiconductor device and manufacturing method thereof App 20020070461 - Miyazaki, Chuichi ; et al.	2002-06-13
Semiconductor device and manufacturing method thereof App 20020068380 - Miyazaki, Chuichi ; et al.	2002-06-06
Semiconductor device and manufacturing method thereof App 20020066181 - Miyazaki, Chuichi ; et al.	2002-06-06
Semiconductor device and manufacturing method thereof App 20020064901 - Miyazaki, Chuichi ; et al.	2002-05-30
Semiconductor device and manufacturing method thereof Grant 6,355,500 - Miyazaki , et al. March 12, 2	2002-03-12
Semiconductor device and manufacturing method thereof Grant 6,355,975 - Miyazaki , et al. March 12, 2	2002-03-12
Semiconductor Device And Manufacturing Method Thereof App 20010035575 - MIYAZAKI, CHUICHI ; et al.	2001-11-01
Plastic molded type semiconductor device and fabrication process thereof Grant 6,291,273 - Miyaki , et al. September 18, 2	2001-09-18
Surface package type semiconductor package and method of producing semiconductor memory App 20010015327 - Kitamura, Wahei ; et al.	2001-08-23
Plastic molded type semiconductor device and fabrication process thereof App 20010010949 - Miyaki, Yoshinori ; et al.	2001-08-02
Semiconductor device and manufacturing method thereof App 20010008304 - Miyazaki, Chuichi ; et al.	2001-07-19
Semiconductor device App 20010008302 - Murakami, Gen ; et al.	2001-07-19
Semiconductor device and manufacturing method thereof App 20010007781 - Miyazaki, Chuichi ; et al.	2001-07-12
Semiconductor device and manufacturing method thereof App 20010005055 - Miyazaki, Chuichi ; et al.	2001-06-28
Semiconductor device and manufacturing method thereof App 20010004127 - Miyazaki, Chuichi ; et al.	2001-06-21
Semiconductor device and manufacturing method thereof App 20010002724 - Miyazaki, Chuichi ; et al.	2001-06-07
Semiconductor device and manufacturing method thereof App 20010003059 - Miyazaki, Chuichi ; et al.	2001-06-07
Semiconductor device and manufacturing method thereof App 20010003048 - Miyazaki, Chuichi ; et al.	2001-06-07
Semiconductor device and manufacturing method thereof App 20010002730 - Miyazaki, Chuichi ; et al.	2001-06-07
Semiconductor device and manufacturing method thereof App 20010002069 - Miyazaki, Chuichi ; et al.	2001-05-31
Semiconductor device and manufacturing method thereof App 20010002064 - Miyazaki, Chuichi ; et al.	2001-05-31
Semiconductor device and method for making same App 20010000079 - Usami, Mitsuo ; et al.	2001-03-29
Semiconductor device Grant 6,169,325 - Azuma , et al. January 2, 2	2001-01-02
Semiconductor integrated circuit card assembly Grant 6,166,911 - Usami , et al. December 26, 2	2000-12-26
Method of manufacturing a semiconductor device having a ball grid array package structure using a supporting frame Grant 6,114,192 - Tsunoda , et al. September 5, 2	2000-09-05
Semiconductor device having all outer leads extending from one side of a resin member Grant 6,100,580 - Murakami , et al. August 8, 2	2000-08-08
Semiconductor device Grant 6,081,023 - Murakami , et al. June 27, 2	2000-06-27
Semiconductor device chip on lead and lead on chip manufacturing Grant 6,069,029 - Murakami , et al. May 30, 2	2000-05-30
Semiconductor device having an improved connection arrangement between a semiconductor pellet and base substrate electrodes and a method of manufacture thereof Grant 5,777,391 - Nakamura , et al. July 7, 1	1998-07-07
Semiconductor device Grant 5,714,405 - Tsubosaki , et al. February 3, 1	1998-02-03
Semiconductor device Grant 5,612,569 - Murakami , et al. March 18, 1	1997-03-18
Surface package type semiconductor package and method of producing semiconductor memory Grant 5,607,059 - Kitamura , et al. March 4, 1	1997-03-04
Semiconductor device with lead structure within the planar area of the device Grant 5,583,375 - Tsubosaki , et al. December 10, 1	1996-12-10
Method and apparatus for cooperated design Grant 5,572,430 - Akasaka , et al. November 5, 1	1996-11-05
Semiconductor device Grant 5,530,286 - Murakami , et al. June 25, 1	1996-06-25
Method of uniformly encapsulating a semiconductor device in resin Grant 5,371,044 - Yoshida , et al. December 6, 1	1994-12-06
Semiconductor device Grant 5,358,904 - Murakami , et al. * October 25, 1	1994-10-25
Stacked semiconductor memory device and semiconductor memory module containing the same Grant 5,334,875 - Sugano , et al. * August 2, 1	1994-08-02
Method of producing semiconductor memory Grant 5,295,297 - Kitamura , et al. March 22, 1	1994-03-22
Product specification complex analysis system Grant 5,287,284 - Sugino , et al. February 15, 1	1994-02-15
Method of producing surface package type semiconductor package Grant 5,274,914 - Kitamura , et al. January 4, 1	1994-01-04
Semiconductor device and an electronic device with the semiconductor devices mounted thereon Grant 5,266,834 - Nishi , et al. November 30, 1	1993-11-30
Semiconductor device, its fabrication method and molding apparatus used therefor Grant 5,200,366 - Yamada , et al. April 6, 1	1993-04-06
Semiconductor stacked device Grant 5,198,888 - Sugano , et al. * March 30, 1	1993-03-30
Semiconductor device Grant 5,184,208 - Sakuta , et al. February 2, 1	1993-02-02
Resin-encapsulated semiconductor device having a particular mounting structure Grant 5,150,193 - Yasuhara , et al. September 22, 1	1992-09-22
Method of producing semiconductor memory packages Grant 5,095,626 - Kitamura , et al. March 17, 1	1992-03-17
Semiconductor device Grant 5,068,712 - Murakami , et al. November 26, 1	1991-11-26
Semiconductor device and semiconductor module with a plurality of stacked semiconductor devices Grant 5,028,986 - Sugano , et al. July 2, 1	1991-07-02
Method for synthesizing analysis model and flow analysis system Grant 4,989,166 - Akasaka , et al. January 29, 1	1991-01-29
Surface package type semiconductor package Grant 4,971,196 - Kitamura , et al. November 20, 1	1990-11-20
Method of producing semiconductor devices Grant 4,946,633 - Saeki , et al. August 7, 1	1990-08-07
Resin encapsulated electronic devices Grant 4,933,744 - Segawa , et al. June 12, 1	1990-06-12
Method and apparatus for encapsulating semi-conductors Grant 4,900,501 - Saeki , et al. February 13, 1	1990-02-13