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Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures
App 20220157799 - MORTENSEN; Russell K. ; et al. | 2022-05-19 |
Thermally coupled package-on-package semiconductor packages
Grant 11,222,877 - Karhade , et al. January 11, 2 | 2022-01-11 |
Package on package thermal transfer systems and methods
Grant 11,056,466 - Karhade , et al. July 6, 2 | 2021-07-06 |
Laser Ablation-based Surface Property Modification And Contamination Removal
App 20210066273A1 - | 2021-03-04 |
Microelectronics Package Comprising A Package-on-package (pop) Architecture With Inkjet Barrier Material For Controlling Bondline Thickness And Pop Adhesive Keep Out Zone
App 20210066155 - NOFEN; Elizabeth ; et al. | 2021-03-04 |
Through Mold Interconnect Drill Feature
App 20210066167 - NICKERSON; Robert M. ; et al. | 2021-03-04 |
Offset interposers for large-bottom packages and large-die package-on-package structures
Grant 10,607,976 - Mortensen , et al. | 2020-03-31 |
Package On Package Thermal Transfer Systems And Methods
App 20190385983 - KARHADE; OMKAR ; et al. | 2019-12-19 |
Offset interposers for large-bottom packages and large-die package-on-package structures
Grant 10,446,530 - Mortensen , et al. Oc | 2019-10-15 |
Package on package thermal transfer systems and methods
Grant 10,438,930 - Karhade , et al. O | 2019-10-08 |
Thermally Coupled Package-on-package Semiconductor
App 20190103385 - KARHADE; OMKAR ; et al. | 2019-04-04 |
Package On Package Thermal Transfer Systems And Methods
App 20190006319 - KARHADE; OMKAR ; et al. | 2019-01-03 |
Interconnect structures with polymer core
Grant 10,128,225 - Razdan , et al. November 13, 2 | 2018-11-13 |
Architecture material and process to improve thermal performance of the embedded die package
Grant 10,121,722 - Jha , et al. November 6, 2 | 2018-11-06 |
Interconnect Structures With Polymer Core
App 20170229438 - Razdan; Sandeep ; et al. | 2017-08-10 |
BBUL top side substrate layer enabling dual sided silicon interconnect and stacking flexibility
Grant 9,691,728 - Nickerson , et al. June 27, 2 | 2017-06-27 |
Pad-less interconnect for electrical coreless substrate
Grant 9,691,727 - Soto Gonzalez , et al. June 27, 2 | 2017-06-27 |
Interconnect structures with polymer core
Grant 9,613,934 - Razdan , et al. April 4, 2 | 2017-04-04 |
Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures
App 20160218093 - Mortensen; Russell K. ; et al. | 2016-07-28 |
Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures
App 20160133557 - Mortensen; Russell K. ; et al. | 2016-05-12 |
Processes Of Making Pad-less Interconnect For Electrical Coreless Substrate
App 20150221608 - SOTO GONZALEZ; Javier ; et al. | 2015-08-06 |
Bbul Top Side Substrate Layer Enabling Dual Sided Silicon Interconnect And Stacking Flexibility
App 20150171044 - NICKERSON; Robert M. ; et al. | 2015-06-18 |
Interconnect Structures With Polymer Core
App 20150162313 - Razdan; Sandeep ; et al. | 2015-06-11 |
Interconnect structures with polymer core
Grant 8,987,918 - Razdan , et al. March 24, 2 | 2015-03-24 |
Interconnect Structures With Polymer Core
App 20140264910 - Razdan; Sandeep ; et al. | 2014-09-18 |
Bbul Top Side Substrate Layer Enabling Dual Sided Silicon Interconnect And Stacking Flexibility
App 20140159250 - Nickerson; Robert M. | 2014-06-12 |
Microelectronic package and method of manufacturing same
Grant 8,674,519 - Arana , et al. March 18, 2 | 2014-03-18 |
Package-on-package Interconnect Stiffener
App 20130292838 - Ganesan; Sanka ; et al. | 2013-11-07 |
Offset Interposers For Large-bottom Packages And Large-die Package-on-package Structures
App 20130271907 - Mortensen; Russell K. ; et al. | 2013-10-17 |
Package-on-package interconnect stiffener
Grant 8,513,792 - Ganesan , et al. August 20, 2 | 2013-08-20 |
Microelectronic Package And Method Of Manufacturing Same
App 20120153504 - Arana; Leonel R. ; et al. | 2012-06-21 |
Use of die backside films to modulate EOL coplanarity of thin packages while providing thermal capability and laser markability of packages
App 20110156283 - Ganapathysubramanian; Shankar ; et al. | 2011-06-30 |
Integrated circuit device mounting with folded substrate and interposer
Grant 7,818,878 - Nickerson , et al. October 26, 2 | 2010-10-26 |
Package-on-package interconnect stiffener
App 20100258927 - Ganesan; Sanka ; et al. | 2010-10-14 |
High Thermal Conductivity Molding Compound For Flip-chip Packages
App 20090004317 - Hu; Xuejiao ; et al. | 2009-01-01 |
Folded Substrate With Interposer Package For Integrated Circuit Devices
App 20080148559 - NICKERSON; Robert M. ; et al. | 2008-06-26 |
Folded substrate with interposer package for integrated circuit devices
Grant 7,358,444 - Nickerson , et al. April 15, 2 | 2008-04-15 |
Power distribution within a folded flex package method and apparatus
Grant 7,304,373 - Taggart , et al. December 4, 2 | 2007-12-04 |
Packaging logic and memory integrated circuits
App 20060289981 - Nickerson; Robert M. ; et al. | 2006-12-28 |
Power distribution within a folded flex package method and apparatus
App 20060091508 - Taggart; Brian ; et al. | 2006-05-04 |
Folded substrate with interposer package for integrated circuit devices
App 20060077644 - Nickerson; Robert M. ; et al. | 2006-04-13 |
Microelectronic assembly having a redistribution conductor over a microelectronic die
App 20050230850 - Taggart, Brian C. ; et al. | 2005-10-20 |
Lower profile flexible substrate package for electronic components
App 20050214978 - Taggart, Brian ; et al. | 2005-09-29 |
Integrated circuit interconnect
Grant 6,794,760 - Jaeck , et al. September 21, 2 | 2004-09-21 |
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