NI; CHING-YU
Patent Applications and Registrations
Patent applications and USPTO patent grants for NI; CHING-YU.The latest application filed is for "packaging structure and method for manufacturing packaging structure".
Company Profile
7.25.29
- NI; CHING-YU - New Taipei TW
- Ni; Ching-Yu - Hsinchu TW
- NI; Ching-Yu - Hsinchu City TW
- Ni; Ching-Yu - Shinchu TW
- Ni; Ching-Yu - Shinchu City TW
Patent Activity
| Patent | Date |
|---|---|
| Packaging Structure And Method For Manufacturing Packaging Structure App 20220122951 - NI; CHING-YU ; et al. | 2022-04-21 |
| Package Structure And Manufacturing Method Thereof App 20220122917 - HUANG; CHI-TING ; et al. | 2022-04-21 |
| Biochip Structure And Method For Making Same App 20220032292 - LU; HSIANG-HUA ; et al. | 2022-02-03 |
| Fingerprint Identification Chip Package And Method For Making Same App 20210313244 - LU; HSIANG-HUA ; et al. | 2021-10-07 |
| Chip packaging structure Grant 11,056,411 - Ni , et al. July 6, 2 | 2021-07-06 |
| Biochip Packaging Structure App 20210154666 - LU; HSIANG-HUA ; et al. | 2021-05-27 |
| Package Structure With Integrated Antenna, Package Structure Array, And Manufacturing Method Thereof App 20210151395 - NI; CHING-YU ; et al. | 2021-05-20 |
| Fan-out Packaging Structure And Method Of Making Same App 20210134732 - PAN; YING-CHIEH ; et al. | 2021-05-06 |
| Packaging Structure For Image Sensor, Lens Module, And Electronic Device Using The Same App 20200343285 - NI; CHING-YU ; et al. | 2020-10-29 |
| Semiconductor Packaging Structure And Method Of Fabricating Same App 20200294959 - NI; CHING-YU ; et al. | 2020-09-17 |
| Chip Packaging Structure And Method For Manufacturing The Same App 20200279786 - NI; CHING-YU ; et al. | 2020-09-03 |
| Chip package and manufacturing method thereof Grant 9,799,588 - Ni , et al. October 24, 2 | 2017-10-24 |
| Chip Package And Manufacturing Method Thereof App 20140332985 - NI; Ching-Yu ; et al. | 2014-11-13 |
| Chip package and fabrication method thereof Grant 8,822,325 - Ni , et al. September 2, 2 | 2014-09-02 |
| Electronic device containing passive components and fabrication method thereof Grant 8,766,400 - Ni July 1, 2 | 2014-07-01 |
| Power MOSFET package Grant 8,766,431 - Perng , et al. July 1, 2 | 2014-07-01 |
| Chip package and fabrication method thereof Grant 8,716,109 - Ni , et al. May 6, 2 | 2014-05-06 |
| Electronic device package and method for forming the same Grant 8,643,198 - Chien , et al. February 4, 2 | 2014-02-04 |
| Chip Package And Fabrication Method Thereof App 20140017854 - NI; Ching-Yu ; et al. | 2014-01-16 |
| Chip Package And Fabrication Method Thereof App 20130316499 - NI; Ching-Yu ; et al. | 2013-11-28 |
| Chip package and fabrication method thereof Grant 8,564,123 - Ni , et al. October 22, 2 | 2013-10-22 |
| Electronic device package and method for forming the same Grant 8,552,547 - Chien , et al. October 8, 2 | 2013-10-08 |
| Electronic device package and method for fabricating the same Grant 8,541,877 - Tsai , et al. September 24, 2 | 2013-09-24 |
| Power Mosfet Package App 20130193520 - PERNG; Baw-Ching ; et al. | 2013-08-01 |
| Electronic Device Package And Method For Forming The Same App 20130127022 - CHIEN; Wen-Cheng ; et al. | 2013-05-23 |
| Electronic Device Package And Method For Forming The Same App 20130126086 - CHIEN; Wen-Cheng ; et al. | 2013-05-23 |
| Light emitting device package structure and fabricating method thereof Grant 8,431,950 - Tsai , et al. April 30, 2 | 2013-04-30 |
| Power MOSFET package Grant 8,410,599 - Perng , et al. April 2, 2 | 2013-04-02 |
| Semiconductor device and manufacturing method thereof Grant 8,384,222 - Tsai , et al. February 26, 2 | 2013-02-26 |
| Electronic device package and method for forming the same Grant 8,367,477 - Chien , et al. February 5, 2 | 2013-02-05 |
| Chip Package And Fabrication Method Thereof App 20110175221 - NI; Ching-Yu ; et al. | 2011-07-21 |
| Semiconductor device and manufacturing method thereof Grant 7,968,448 - Tsai , et al. June 28, 2 | 2011-06-28 |
| Electronic Device Package And Method For Fabricating The Same App 20110140267 - TSAI; Chia-Lun ; et al. | 2011-06-16 |
| Semiconductor Device And Manufacturing Method Thereof App 20110140248 - TSAI; Chia-Lun ; et al. | 2011-06-16 |
| Chip Package And Fabrication Method Thereof App 20110127681 - NI; Ching-Yu ; et al. | 2011-06-02 |
| Electronic Device And Fabrication Method Thereof App 20110042783 - Ni; Ching-Yu | 2011-02-24 |
| Power Mosfet Package App 20100289092 - PERNG; Baw-Ching ; et al. | 2010-11-18 |
| Electronic Device Package And Method For Forming The Same App 20100230803 - CHIEN; Wen-Cheng ; et al. | 2010-09-16 |
| Light Emitting Device Package Structure And Fabricating Method Thereof App 20090289273 - Tsai; Chia-Lun ; et al. | 2009-11-26 |
| Semiconductor Device And Manufacturing Method Thereof App 20090283877 - Tsai; Chia-Lun ; et al. | 2009-11-19 |
| Semiconductor packages and methods of manufacturing thereof Grant 7,348,218 - Ni , et al. March 25, 2 | 2008-03-25 |
| Constraint stiffener design Grant 7,271,480 - Chang , et al. September 18, 2 | 2007-09-18 |
| Novel constraint stiffener design App 20070069366 - Chang; Kuo-Chin ; et al. | 2007-03-29 |
| Semiconductor packages and methods of manufacturing thereof App 20060286719 - Ni; Ching-Yu ; et al. | 2006-12-21 |
| Sealing membrane for thermal interface material App 20060261469 - Ni; Ching-Yu ; et al. | 2006-11-23 |
| Semiconductor packages and methods of manufacturing thereof Grant 7,135,769 - Ni , et al. November 14, 2 | 2006-11-14 |
| Semiconductor Packages And Methods Of Manufacturing Thereof App 20060220225 - Ni; Ching-Yu ; et al. | 2006-10-05 |
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