| Patent | Date |
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Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,607,825 - Canaperi , et al. March 28, 2 | 2017-03-28 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,558,935 - Canaperi , et al. January 31, 2 | 2017-01-31 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,558,934 - Canaperi , et al. January 31, 2 | 2017-01-31 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,536,733 - Canaperi , et al. January 3, 2 | 2017-01-03 |
Method of forming an interconnect structure
Grant 9,502,288 - Nguyen , et al. November 22, 2 | 2016-11-22 |
Hydrogen-free silicon-based deposited dielectric films for nano device fabrication
Grant 9,449,812 - Canaperi , et al. September 20, 2 | 2016-09-20 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20160064509 - Canaperi; Donald Francis ; et al. | 2016-03-03 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20160064218 - Canaperi; Donald Francis ; et al. | 2016-03-03 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20160056111 - Canaperi; Donald Francis ; et al. | 2016-02-25 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20160047038 - Canaperi; Donald Francis ; et al. | 2016-02-18 |
Hydrogen-free Silicon-based Deposited Dielectric Films For Nano Device Fabrication
App 20150287593 - Canaperi; Donald Francis ; et al. | 2015-10-08 |
Through-silicon Via Structure And Method For Improving Beol Dielectric Performance
App 20150097274 - Collins; Christopher ; et al. | 2015-04-09 |
Through-silicon Via Structure And Method For Improving Beol Dielectric Performance
App 20150069608 - Collins; Christopher ; et al. | 2015-03-12 |
ADHESION LAYER AND MULTIPHASE ULTRA-LOW k DIELECTRIC MATERIAL
App 20140203336 - GRILL; ALFRED ; et al. | 2014-07-24 |
Interlevel dielectric stack for interconnect structures
Grant 8,779,600 - Nguyen , et al. July 15, 2 | 2014-07-15 |
C-rich carbon boron nitride dielectric films for use in electronic devices
Grant 8,652,950 - Nguyen , et al. February 18, 2 | 2014-02-18 |
Process to form an adhesion layer and multiphase ultra-low k dielectric material using PECVD
Grant 8,637,412 - Grill , et al. January 28, 2 | 2014-01-28 |
Methods of modifying interlayer adhesion
Grant 8,569,166 - Schmitt , et al. October 29, 2 | 2013-10-29 |
Interlevel Dielectric Stack for Interconnect Structures
App 20130175697 - Nguyen; Son Van ; et al. | 2013-07-11 |
C-rich Carbon Boron Nitride Dielectric Films For Use In Electronic Devices
App 20130171839 - Nguyen; Son Van ; et al. | 2013-07-04 |
C-rich carbon boron nitride dielectric films for use in electronic devices
Grant 8,476,743 - Nguyen , et al. July 2, 2 | 2013-07-02 |
C-rich Carbon Boron Nitride Dielectric Films For Use In Electronic Devices
App 20130062753 - Nguyen; Son Van ; et al. | 2013-03-14 |
Multi component dielectric layer
Grant 8,357,608 - Gates , et al. January 22, 2 | 2013-01-22 |
Self-aligned composite M-MOx/dielectric cap for Cu interconnect structures
Grant 8,299,365 - Nguyen , et al. October 30, 2 | 2012-10-30 |
SELF-ALIGNED COMPOSITE M-MOx/DIELECTRIC CAP FOR Cu INTERCONNECT STRUCTURES
App 20120175023 - Nguyen; Son Van ; et al. | 2012-07-12 |
Method of fabricating a SiCOH dielectric material with improved toughness and improved Si-C bonding
Grant 8,101,236 - Edelstein , et al. January 24, 2 | 2012-01-24 |
Ultra low .kappa. plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality
Grant 8,097,932 - Nguyen , et al. January 17, 2 | 2012-01-17 |
Methods Of Modifying Interlayer Adhesion
App 20110237085 - SCHMITT; FRANCIMAR CAMPANA ; et al. | 2011-09-29 |
Enhanced Bonding Interfaces On Carbon-based Materials For Nanoelectronic Devices
App 20110233513 - Dimitrakopoulos; Christos D. ; et al. | 2011-09-29 |
SELF-ALIGNED COMPOSITE M-MOx/DIELECTRIC CAP FOR Cu INTERCONNECT STRUCTURES
App 20110162874 - Nguyen; Son Van ; et al. | 2011-07-07 |
Method of modifying interlayer adhesion
Grant 7,960,294 - Schmitt , et al. June 14, 2 | 2011-06-14 |
SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C BONDING, SEMICONDUCTOR DEVICE CONTAINING THE SAME, AND METHOD TO MAKE THE SAME
App 20110101489 - Edelstein; Daniel C. ; et al. | 2011-05-05 |
SiCOH dielectric material with improved toughness and improved Si-C bonding
Grant 7,892,648 - Edelstein , et al. February 22, 2 | 2011-02-22 |
Enclosed nanotube structure and method for forming
Grant 7,781,267 - Gambino , et al. August 24, 2 | 2010-08-24 |
Enclosed Nanotube Structure And Method For Forming
App 20100187502 - Gambino; Jeffrey Peter ; et al. | 2010-07-29 |
Advanced multilayer dielectric cap with improved mechanical and electrical properties
Grant 7,737,052 - Bhatia , et al. June 15, 2 | 2010-06-15 |
Ultralow Dielectric Constant Layer With Controlled Biaxial Stress
App 20090304951 - Dimitrakopoulos; Christos Dimitrios ; et al. | 2009-12-10 |
Method Of Modifying Interlayer Adhesion
App 20090305514 - Schmitt; Francimar Campana ; et al. | 2009-12-10 |
Advanced Multilayer Dielectric Cap With Improved Mechanical And Electrical Properties
App 20090224374 - Bhatia; Ritwik ; et al. | 2009-09-10 |
Methods of modifying interlayer adhesion
Grant 7,563,728 - Schmitt , et al. July 21, 2 | 2009-07-21 |
SiCOH DIELECTRIC MATERIAL WITH IMPROVED TOUGHNESS AND IMPROVED Si-C BONDING, SEMICONDUCTOR DEVICE CONTAINING THE SAME, AND METHOD TO MAKE THE SAME
App 20090181178 - Edelstein; Daniel C. ; et al. | 2009-07-16 |
ULTRA LOW k PLASMA ENHANCED CHEMICAL VAPOR DEPOSITION PROCESSES USING A SINGLE BIFUNCTIONAL PRECURSOR CONTAINING BOTH A SiCOH MATRIX FUNCTIONALITY AND ORGANIC POROGEN FUNCTIONALITY
App 20090146265 - Nguyen; Son Van ; et al. | 2009-06-11 |
Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality
Grant 7,491,658 - Nguyen , et al. February 17, 2 | 2009-02-17 |
Hardmask for improved reliability of silicon based dielectrics
Grant 7,485,582 - Nguyen , et al. February 3, 2 | 2009-02-03 |
Ultralow Dielectric Constant Layer With Controlled Biaxial Stress
App 20080286494 - Dimitrakopoulos; Christos Dimitrios ; et al. | 2008-11-20 |
Dielectric Cap Having Material With Optical Band Gap To Substantially Block Uv Radiation During Curing Treatment, And Related Methods
App 20080173985 - Belyansky; Michael P. ; et al. | 2008-07-24 |
Fuse Element Using Low-K Dielectric
App 20080157268 - Kim; Deok-kee ; et al. | 2008-07-03 |
Metal to Metal Low-K Antifuse
App 20080157270 - Kim; Deok-kee ; et al. | 2008-07-03 |
Hardmask For Improved Reliability Of Silicon Based Dielectrics
App 20080132055 - Nguyen; Son Van ; et al. | 2008-06-05 |
Method for reducing film stress for SiCOH low-k dielectric materials
Grant 7,381,659 - Nguyen , et al. June 3, 2 | 2008-06-03 |
Method For Post Cap Ild/imd Repair With Uv Irradiation
App 20080124815 - Malone; Kelly ; et al. | 2008-05-29 |
Hardmask For Improved Reliability Of Silicon Based Dielectrics
App 20080118717 - Nguyen; Son Van ; et al. | 2008-05-22 |
Magnetoresistive/inductive write head assembly formed with seed layers having a uniform thickness
Grant 7,362,543 - Hsiao , et al. April 22, 2 | 2008-04-22 |
Ultralow dielectric constant layer with controlled biaxial stress
Grant 7,357,977 - Dimitrakopoulos , et al. April 15, 2 | 2008-04-15 |
Hardmask for reliability of silicon based dielectrics
Grant 7,335,980 - Nguyen , et al. February 26, 2 | 2008-02-26 |
Ultralow Dielectric Constant Layer With Controlled Biaxial Stress
App 20080044668 - Dimitrakopoulos; Christos Dimitrios ; et al. | 2008-02-21 |
Method for manufacturing a magnetic head coil structure and/or pole tip structure
Grant 7,313,858 - Hsiao , et al. January 1, 2 | 2008-01-01 |
Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made
Grant 7,312,524 - Gates , et al. December 25, 2 | 2007-12-25 |
Magnetic head coil structure and method for manufacturing the same
Grant 7,304,821 - Hsiao , et al. December 4, 2 | 2007-12-04 |
Low K and ultra low K SiCOH dielectric films and methods to form the same
Grant 7,282,458 - Gates , et al. October 16, 2 | 2007-10-16 |
High aspect ratio co-planar structure fabrication consisting of different materials
Grant 7,280,313 - Lille , et al. October 9, 2 | 2007-10-09 |
Planarized perpendicular pole tip system and method for manufacturing the same
Grant 7,248,434 - Dill , et al. July 24, 2 | 2007-07-24 |
Methods Of Modifying Interlayer Adhesion
App 20070141855 - Schmitt; Francimar Campana ; et al. | 2007-06-21 |
Method of modifying interlayer adhesion
Grant 7,226,876 - Schmitt , et al. June 5, 2 | 2007-06-05 |
Method For Reducing Film Stress For Sicoh Low-k Dielectric Materials
App 20070117408 - Nguyen; Son Van ; et al. | 2007-05-24 |
Apparatus For Providing An Aligned Coil For An Inductive Head Structure Using A Patterned Seed Layer
App 20070002493 - Dinan; Thomas Edward ; et al. | 2007-01-04 |
Method and apparatus using a pre-patterned seed layer for providing an aligned coil for an inductive head structure
Grant 7,117,583 - Dinan , et al. October 10, 2 | 2006-10-10 |
Dielectric materials to prevent photoresist poisoning
Grant 7,115,534 - Nguyen , et al. October 3, 2 | 2006-10-03 |
SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same
App 20060165891 - Edelstein; Daniel C. ; et al. | 2006-07-27 |
Magnetic transducer with a write head having a multi-layer coil
Grant 7,079,355 - Hsiao , et al. July 18, 2 | 2006-07-18 |
Apparatus for patterning a self-aligned coil using a damascene process
Grant 7,075,750 - Bedell , et al. July 11, 2 | 2006-07-11 |
Method of forming low dielectric constant porous films
Grant 7,060,638 - Nguyen , et al. June 13, 2 | 2006-06-13 |
Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made
App 20060110937 - Gates; Stephen M. ; et al. | 2006-05-25 |
Method of making a perpendicular recording magnetic head pole tip with an etchable adhesion CMP stop layer
App 20060109588 - Le; Quang ; et al. | 2006-05-25 |
Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made
Grant 7,049,247 - Gates , et al. May 23, 2 | 2006-05-23 |
Method of manufacturing a current-perpendicular-to-plane magnetoresistive device with oxidized free layer side regions
Grant 7,043,823 - Childress , et al. May 16, 2 | 2006-05-16 |
Hardmask for improved reliability of silicon based dielectrics
App 20060091559 - Nguyen; Son Van ; et al. | 2006-05-04 |
Perpendicular recording magnetic head with a write shield magnetically coupled to a first pole piece
Grant 7,031,121 - Khera , et al. April 18, 2 | 2006-04-18 |
Low k and ultra low k SiCOH dielectric films and methods to form the same
Grant 7,030,468 - Gates , et al. April 18, 2 | 2006-04-18 |
Ultra low k plasma enhanced chemical vapor deposition processes using a single bifunctional precursor containing both a SiCOH matrix functionality and organic porogen functionality
App 20060079099 - Nguyen; Son Van ; et al. | 2006-04-13 |
Method of making a perpendicular recording magnetic head pole tip with an etchable adhesion CMP stop layer
Grant 7,024,756 - Le , et al. April 11, 2 | 2006-04-11 |
Method for patterning a self-aligned coil using a damascene process
Grant 7,022,248 - Bedell , et al. April 4, 2 | 2006-04-04 |
Low K and ultra low K SiCOH dielectric films and methods to form the same
App 20060055004 - Gates; Stephen M. ; et al. | 2006-03-16 |
Modulated/composited CVD low-k films with improved mechanical and electrical properties for nanoelectronic devices
Grant 7,011,890 - Nguyen , et al. March 14, 2 | 2006-03-14 |
Ultra low k plasma CVD nanotube/spin-on dielectrics with improved properties for advanced nanoelectronic device fabrication
Grant 6,984,579 - Nguyen , et al. January 10, 2 | 2006-01-10 |
Advanced low dielectric constant barrier layers
App 20050277302 - Nguyen, Son Van ; et al. | 2005-12-15 |
Method for fabricating an ultralow dielectric constant material as an intralevel or interlevel dielectric in a semiconductor device and electronic device made
App 20050245096 - Gates, Stephen M. ; et al. | 2005-11-03 |
High aspect ratio co-planar structure fabrication consisting of different materials
App 20050243465 - Lille, Jeffrey S. ; et al. | 2005-11-03 |
Low dielectric constant porous films
App 20050215065 - Nguyen, Son Van ; et al. | 2005-09-29 |
Method of depositing material into high aspect ratio features
Grant 6,948,231 - Hsiao , et al. September 27, 2 | 2005-09-27 |
Method of modifying interlayer adhesion
App 20050208759 - Campana Schmitt, Francimar ; et al. | 2005-09-22 |
Planarized perpendicular pole tip system and method for manufacturing the same
App 20050201011 - Dill, Frederick Hayes ; et al. | 2005-09-15 |
SiCOH dielectric material with improved toughness and improved Si-C bonding, semiconductor device containing the same, and method to make the same
App 20050194619 - Edelstein, Daniel C. ; et al. | 2005-09-08 |
Structures and methods for intergration of ultralow-k dielectrics with improved reliability
App 20050184397 - Gates, Stephen McConnell ; et al. | 2005-08-25 |
Method of depositing material into high aspect ratio features
App 20050185334 - Hsiao, Richard ; et al. | 2005-08-25 |
Low k and ultra low k SiCOH dielectric films and methods to form the same
App 20050156285 - Gates, Stephen M. ; et al. | 2005-07-21 |
Method of removing magnetoresistive sensor cap by reactive ion etching
Grant 6,919,280 - Hsiao , et al. July 19, 2 | 2005-07-19 |
Method of modifying interlayer adhesion
Grant 6,913,992 - Schmitt , et al. July 5, 2 | 2005-07-05 |
Process for manufacturing a magnetic head coil structure
Grant 6,901,653 - Hsiao , et al. June 7, 2 | 2005-06-07 |
Side wall passivation films for damascene cu/low k electronic devices
Grant 6,878,620 - Nguyen , et al. April 12, 2 | 2005-04-12 |
Apparatus for patterning a self-aligned coil using a damascene process
App 20050047014 - Bedell, Daniel Wayne ; et al. | 2005-03-03 |
Method for patterning a self-aligned coil using a damascene process
App 20050045848 - Bedell, Daniel Wayne ; et al. | 2005-03-03 |
Method of making a perpendicular recording magnetic head pole tip with an etchable adhesion CMP stop layer
App 20050024779 - Le, Quang ; et al. | 2005-02-03 |
Perpendicular recording magnetic head with a write shield magnetically coupled to a first pole piece
App 20050024766 - Khera, Gautam ; et al. | 2005-02-03 |
Dielectric materials to prevent photoresist poisoning
App 20050014361 - Nguyen, Son Van ; et al. | 2005-01-20 |
Current-perpendicular-to-plane magnetoresistive device with oxidized free layer side regions and method for its fabrication
App 20040223267 - Childress, Jeffrey R. ; et al. | 2004-11-11 |
Method of improving the reliability of magnetic head sensors by ion milling smoothing
Grant 6,804,878 - Campbell , et al. October 19, 2 | 2004-10-19 |
Method of fabricating a magnetic transducer with a write head having a multi-layer coil
Grant 6,804,879 - Hsiao , et al. October 19, 2 | 2004-10-19 |
Magnetic transducer with a write head having a multi-layer coil
App 20040190196 - Hsiao, Richard D. ; et al. | 2004-09-30 |
Magnetic head coil structure and method for manufacturing the same
App 20040177493 - Hsiao, Richard ; et al. | 2004-09-16 |
Method of improving interlayer adhesion
App 20040175929 - Schmitt, Francimar Campana ; et al. | 2004-09-09 |
Modulated/composited CVD low-k films with improved mechanical and electrical properties for nanoelectronic devices
App 20040175581 - Nguyen, Son Van ; et al. | 2004-09-09 |
Ultra low k plasma CVD nanotube/spin-on dielectrics with improved properties for advanced nanoelectronic device fabrication
App 20040169281 - Nguyen, Son Van ; et al. | 2004-09-02 |
Chemical mechanical polishing thickness control in magnetic head fabrication
Grant 6,776,917 - Hsiao , et al. August 17, 2 | 2004-08-17 |
Side wall passivation films for damascene cu/low k electronic devices
App 20040092095 - Nguyen, Son Van ; et al. | 2004-05-13 |
Magnetic transducer with a write head having a multi-layer coil
App 20040080866 - Hsiao, Richard D. ; et al. | 2004-04-29 |
Magnetic head coil structure and method for manufacturing the same
App 20040075938 - Hsiao, Richard ; et al. | 2004-04-22 |
Method of removing magnetoresistive sensor cap by reactive ion etching
App 20040069746 - Hsiao, Richard ; et al. | 2004-04-15 |
Current-perpendicular-to-plane magnetoresistive device with oxidized free layer side regions and method for its fabrication
App 20030231437 - Childress, Jeffrey R. ; et al. | 2003-12-18 |
Method of manufacturing high aspect ratio photolithographic features
Grant 6,664,026 - Nguyen , et al. December 16, 2 | 2003-12-16 |
Method of depositing material into high aspect ratio features
App 20030218835 - Hsiao, Richard ; et al. | 2003-11-27 |
Reacting an organosilicon compound with an oxidizing gas to form an ultra low k dielectric
App 20030211244 - Li, Lihua ; et al. | 2003-11-13 |
Magnetic head coil structure and method for manufacturing the same
App 20030184912 - Hsiao, Richard ; et al. | 2003-10-02 |
Method and apparatus for providing an aligned coil for an inductive head structure using a patterned seed layer
App 20030174435 - Dinan, Thomas Edward ; et al. | 2003-09-18 |
Semiconductor device structure with hydrogen-rich layer for facilitating passivation of surface states
Grant 6,483,172 - Cote , et al. November 19, 2 | 2002-11-19 |
Storage system slider having trailing edge pad and method for making the same
Grant 6,466,408 - Baumgart , et al. October 15, 2 | 2002-10-15 |
Method of manufacturing high aspect ratio photolithographic features
App 20020136990 - Nguyen, Son Van ; et al. | 2002-09-26 |
Storage system slider having trailing edge pad and method for making the same
App 20020089788 - Baumgart, Peter M. ; et al. | 2002-07-11 |
Chemical mechanical polishing thickness control in magnetic head fabrication
App 20020084243 - Hsiao, Richard ; et al. | 2002-07-04 |
Method and apparatus for in-situ monitoring of ion energy distribution for endpoint detection via capacitance measurement
Grant 6,326,794 - Lundquist , et al. December 4, 2 | 2001-12-04 |
Advanced damascene planar stack capacitor fabrication method
Grant 6,027,968 - Nguyen , et al. February 22, 2 | 2000-02-22 |
Reactive ion etching of alumina/TiC substrates
Grant 6,001,268 - Nguyen , et al. December 14, 1 | 1999-12-14 |
Flowable spin-on insulator
Grant 5,855,962 - Cote , et al. January 5, 1 | 1999-01-05 |
Method for forming semiconductor structure using modulation doped silicate glasses
Grant 5,770,469 - Uram , et al. June 23, 1 | 1998-06-23 |
Advanced damascene planar stack capacitor fabrication method
Grant 5,753,948 - Nguyen , et al. May 19, 1 | 1998-05-19 |
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