NEPES CORPORATION

Patent Applications and Registrations

Patent applications and USPTO patent grants for NEPES CORPORATION.The latest application filed is for "semiconductor chip package, semiconductor module, and method for manufacturing same".

Company Profile

1.9.14

NEPES CORPORATION - Chungcheongbuk-do DE KR
Nepes Corporation - Chungcheonbuk-Do KR
Nepes Corporation - KR KR
NEPES Corporation - Chungbuk KR
Nepes Corporation - Gak-Ri Ochang-Myun KR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Composition For Manufacturing Passivation Layer And Passivation Layer Using The Same App 20200239724A1 -	2020-07-30
Semiconductor chip package having via hole and semiconductor module thereof Grant 9,006,872 - Kwon April 14, 2	2015-04-14
Semiconductor Chip Package, Semiconductor Module, And Method For Manufacturing Same App 20130241042 - Kwon; Yong-Tae	2013-09-19
Wafer level semiconductor package and fabrication method thereof Grant 8,421,211 - Kang , et al. April 16, 2	2013-04-16
Semiconductor Package With Interposer Block Therein App 20120286419 - Kwon; Yong Tae ; et al.	2012-11-15
Bump structure and fabrication method thereof Grant 8,237,276 - Song , et al. August 7, 2	2012-08-07
Semiconductor Package And Fabrication Method Thereof App 20120146216 - KANG; In Soo ; et al.	2012-06-14
Flip chip semiconductor package and fabrication method thereof Grant 8,093,721 - Kang , et al. January 10, 2	2012-01-10
Bump Structure And Fabrication Method Thereof App 20110285015 - Song; Chi Jung ; et al.	2011-11-24
Wafer Level Semiconductor Package And Fabrication Method Thereof App 20110260336 - KANG; In Soo ; et al.	2011-10-27
Bump with multiple vias for semiconductor package and fabrication method thereof, and semiconductor package utilizing the same Grant 7,977,789 - Park July 12, 2	2011-07-12
Semiconductor package and fabrication method thereof Grant 7,952,210 - Jung , et al. May 31, 2	2011-05-31
Semiconductor package having a crack-propagation preventing unit Grant 7,919,833 - Park April 5, 2	2011-04-05
Wafer level system in package and fabrication method thereof Grant 7,906,842 - Park March 15, 2	2011-03-15
Ultra slim semiconductor package and method of fabricating the same Grant 7,808,095 - Jung October 5, 2	2010-10-05
Bump Structure Foe Semiconductor Device App 20100032831 - Park; Byung-Jin	2010-02-11
Bump With Multiple Vias For Semiconductor Package And Fabrication Method Thereof, And Semiconductor Package Utilizing The Same App 20090283903 - Park; Yun Mook	2009-11-19
System In Package And Fabrication Method Thereof App 20090146281 - JUNG; Gi Jo	2009-06-11
Crack Resistant Semiconductor Package And Method Of Fabricating The Same App 20090091001 - PARK; Yun Mook	2009-04-09
Semiconductor Chip With Solder Bump And Method Of Fabricating The Same App 20090032942 - Choi; Joon Young	2009-02-05
Semiconductor Chip With Solder Bump Suppressing Growth Of Inter-metallic Compound And Method Of Fabricating The Same App 20090020871 - Kang; In Soo ; et al.	2009-01-22
Ultra Slim Semiconductor Package And Method Of Fabricating The Same App 20090008762 - Jung; Gi Jo	2009-01-08
Wafer Level System In Package And Fabrication Method Thereof App 20080290496 - PARK; Yun Mook	2008-11-27
Semiconductor Package And Fabrication Method Thereof App 20080203583 - Jung; Gi-Jo ; et al.	2008-08-28

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