Nakajima; Shizuki

Patent Applications and Registrations

Patent applications and USPTO patent grants for Nakajima; Shizuki.The latest application filed is for "semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same".

Company Profile

3.7.6

Nakajima; Shizuki - Kyoto JP
Nakajima; Shizuki - Tokyo N/A JP

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same Grant 11,417,625 - Nakajima August 16, 2	2022-08-16
Semiconductor Device Having An Electrical Connection Between Semiconductor Chips Established By Wire Bonding, And Method For Manufacturing The Same App 20200411465 - Nakajima; Shizuki	2020-12-31
Semiconductor device having an electrical connection between semiconductor chips established by wire bonding, and method for manufacturing the same Grant 10,804,238 - Nakajima October 13, 2	2020-10-13
Power amplifier module Grant 10,476,454 - Ishihara , et al. Nov	2019-11-12
Power Amplifier Module App 20190181816 - ISHIHARA; Shota ; et al.	2019-06-13
Power amplifier module Grant 10,256,778 - Ishihara , et al.	2019-04-09
Power Amplifier Module App 20180302045 - ISHIHARA; Shota ; et al.	2018-10-18
Semiconductor Device And Method For Manufacturing The Same App 20180240771 - Nakajima; Shizuki	2018-08-23
Power amplifier module Grant 10,044,330 - Ishihara , et al. August 7, 2	2018-08-07
Power Amplifier Module App 20180083581 - ISHIHARA; Shota ; et al.	2018-03-22
Semiconductor device and manufacturing method thereof Grant 8,742,499 - Nakajima , et al. June 3, 2	2014-06-03
Semiconductor Device And Manufacturing Method Thereof App 20100109052 - NAKAJIMA; Shizuki ; et al.	2010-05-06

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