| Patent | Date |
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Barrier Synchronization Circuit, Barrier Synchronization Method, And Parallel Information Processing Apparatus
App 20210073048 - Nakagawa; Kanae ; et al. | 2021-03-11 |
Barrier Synchronization System And Parallel Information Processing Apparatus
App 20210073049 - Nakagawa; Kanae ; et al. | 2021-03-11 |
Thermoelectric conversion module, sensor module, and information processing system
Grant 10,777,726 - Nakagawa , et al. Sept | 2020-09-15 |
Heat dissipating component, manufacturing method for heat dissipating component, electronic device, manufacturing method for electronic device, integrated module, and information processing system
Grant 10,537,044 - Suzuki , et al. Ja | 2020-01-14 |
Thermoelectric Conversion Module, Sensor Module, And Information Processing System
App 20190148616 - Nakagawa; Kanae ; et al. | 2019-05-16 |
Thermoelectric Conversion Module, Sensor Module, And Information Processing System
App 20170338393 - Nakagawa; Kanae ; et al. | 2017-11-23 |
Heat Dissipating Component, Manufacturing Method For Heat Dissipating Component, Electronic Device, Manufacturing Method For Electronic Device, Integrated Module, And Information Processing System
App 20170110386 - Suzuki; Takashi ; et al. | 2017-04-20 |
Heat Dissipating Component, Manufacturing Method For Heat Dissipating Component, Electronic Device, Manufacturing Method For Electronic Device, Integrated Module, And Information Processing System
App 20160338228 - Suzuki; Takashi ; et al. | 2016-11-17 |
Method For Forming Bumps, Semiconductor Device And Method For Manufacturing Same, Substrate Processing Apparatus, And Semiconductor Manufacturing Apparatus
App 20150132865 - Mizukoshi; Masataka ; et al. | 2015-05-14 |
Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
Grant 8,962,470 - Mizukoshi , et al. February 24, 2 | 2015-02-24 |
Method for manufacturing interposer
Grant 8,479,386 - Shioga , et al. July 9, 2 | 2013-07-09 |
Resin layer formation method and semiconductor device fabrication method
Grant 8,318,599 - Nakagawa , et al. November 27, 2 | 2012-11-27 |
Plating method, semiconductor device fabrication method and circuit board fabrication method
Grant 8,058,110 - Mizukoshi , et al. November 15, 2 | 2011-11-15 |
Plating Method, Semiconductor Device Fabrication Method And Circuit Board Fabrication Method
App 20110168564 - Mizukoshi; Masataka ; et al. | 2011-07-14 |
Plating method, semiconductor device fabrication method and circuit board fabrication method
Grant 7,927,998 - Mizukoshi , et al. April 19, 2 | 2011-04-19 |
Interposer and method for manufacturing the same
App 20110056068 - Shioga; Takeshi ; et al. | 2011-03-10 |
Interposer and method for manufacturing the same
Grant 7,863,524 - Shioga , et al. January 4, 2 | 2011-01-04 |
Plating Method, Semiconductor Device Fabrication Method And Circuit Board Fabrication Method
App 20100112775 - Mizukoshi; Masataka ; et al. | 2010-05-06 |
Semiconductor device, wiring substrate forming method, and substrate processing apparatus
Grant 7,704,856 - Nakagawa , et al. April 27, 2 | 2010-04-27 |
Plating method, semiconductor device fabrication method and circuit board fabrication method
Grant 7,670,940 - Mizukoshi , et al. March 2, 2 | 2010-03-02 |
Semiconductor device, wiring substrate forming method, and substrate processing apparatus
Grant 7,648,907 - Nakagawa , et al. January 19, 2 | 2010-01-19 |
Method For Fabricating Electronic Device Having First Substrate With First Resin Layer And Second Substrate With Second Resin Layer Adhered To The First Resin Layer
App 20090291525 - NAKAGAWA; Kanae ; et al. | 2009-11-26 |
Method for fabricating an interposer
Grant 7,614,142 - Shioga , et al. November 10, 2 | 2009-11-10 |
Method For Forming Bumps, Semiconductor Device And Method For Manufacturing Same, Substrate Processing Apparatus, And Semiconductor Manufacturing Apparatus
App 20090186425 - MIZUKOSHI; Masataka ; et al. | 2009-07-23 |
Semiconductor device, wiring substrate forming method, and substrate processing apparatus
Grant 7,485,962 - Nakagawa , et al. February 3, 2 | 2009-02-03 |
Interposer and method for fabricating the same
App 20080134499 - Shioga; Takeshi ; et al. | 2008-06-12 |
Interposer and method for fabricating the same
Grant 7,355,290 - Shioga , et al. April 8, 2 | 2008-04-08 |
Interposer and method for manufacturing the same
App 20080073110 - Shioga; Takeshi ; et al. | 2008-03-27 |
Semiconductor device, wiring substrate forming method, and substrate processing apparatus
App 20070287282 - Nakagawa; Kanae ; et al. | 2007-12-13 |
Resin layer formation method, semiconductor device and semiconductor device fabrication method
App 20070194412 - Nakagawa; Kanae ; et al. | 2007-08-23 |
Semiconductor device, wiring substrate forming method, and substrate processing apparatus
App 20070184646 - Nakagawa; Kanae ; et al. | 2007-08-09 |
Manufacturing method of wiring substrate
Grant 7,247,524 - Nakagawa July 24, 2 | 2007-07-24 |
Interposer and method for fabricating the same
App 20070090546 - Shioga; Takeshi ; et al. | 2007-04-26 |
Electronic device and method for fabricating the same
App 20060220220 - Nakagawa; Kanae ; et al. | 2006-10-05 |
Manufacturing method of wiring substrate
App 20060216861 - Nakagawa; Kanae | 2006-09-28 |
Surface conductive resin, process for forming the same and wiring board
Grant 7,081,304 - Nakagawa July 25, 2 | 2006-07-25 |
Plating method, semiconductor device fabrication method and circuit board fabrication method
App 20060084251 - Nakagawa; Kanae ; et al. | 2006-04-20 |
Plating method, semiconductor device fabrication method and circuit board fabrication method
App 20060084253 - Mizukoshi; Masataka ; et al. | 2006-04-20 |
Semiconductor device, wiring substrate forming method, and substrate processing apparatus
App 20050170640 - Nakagawa, Kanae ; et al. | 2005-08-04 |
Method for forming bumps, semiconductor device and method for manufacturing same, substrate processing apparatus, and semiconductor manufacturing apparatus
App 20050161814 - Mizukoshi, Masataka ; et al. | 2005-07-28 |
Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same
Grant 6,893,681 - Cooray , et al. May 17, 2 | 2005-05-17 |
Surface conductive resin, process for forming the same and wiring board
App 20030143411 - Nakagawa, Kanae | 2003-07-31 |
Surface conductive resin, a coaxial cable, a wiring board, and process for manufacturing the same
App 20030090345 - Cooray, Nawalage Florence ; et al. | 2003-05-15 |
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