Naik; Mehul

Patent Applications and Registrations

Patent applications and USPTO patent grants for Naik; Mehul.The latest application filed is for "multi-step pre-clean for selective metal gap fill".

Company Profile

13.45.60

Naik; Mehul - San Jose CA
Naik; Mehul - Sunnyvale CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Multi-step Pre-clean For Selective Metal Gap Fill App 20220270871 - Cen; Xi ; et al.	2022-08-25
Fully aligned subtractive processes and electronic devices therefrom Grant 11,410,885 - Ren , et al. August 9, 2	2022-08-09
Multi-step pre-clean for selective metal gap fill Grant 11,380,536 - Cen , et al. July 5, 2	2022-07-05
Reverse Selective Etch Stop Layer App 20220181204 - Kashefi; Kevin ; et al.	2022-06-09
Methods And Devices For Subtractive Self-alignment App 20220130676 - Ren; He ; et al.	2022-04-28
Damage free metal conductor formation Grant 11,289,342 - Ren , et al. March 29, 2	2022-03-29
Methods and devices for subtractive self-alignment Grant 11,257,677 - Ren , et al. February 22, 2	2022-02-22
Methods and apparatuses for forming interconnection structures Grant 11,205,589 - Ren , et al. December 21, 2	2021-12-21
Multi-Step Pre-Clean for Selective Metal Gap Fill App 20210351032 - Cen; Xi ; et al.	2021-11-11
Process integration approach for selective metal via fill Grant 11,164,780 - You , et al. November 2, 2	2021-11-02
Method Of Dielectric Material Fill And Treatment App 20210317580 - YOU; Shi ; et al.	2021-10-14
Methods For Controllable Metal And Barrier-Liner Recess App 20210305091 - Ren; He ; et al.	2021-09-30
Methods And Devices For Subtractive Self-alignment App 20210233770 - Ren; He ; et al.	2021-07-29
Methods for controllable metal and barrier-liner recess Grant 11,062,942 - Ren , et al. July 13, 2	2021-07-13
Method Of Forming Interconnect For Semiconductor Device App 20210125864 - Jiang; Hao ; et al.	2021-04-29
Methods And Apparatuses For Forming Interconnection Structures App 20210104434 - Ren; He ; et al.	2021-04-08
Methods And Apparatus For Cleaning Metal Contacts App 20210066064 - REN; He ; et al.	2021-03-04
Process Integration Approach For Selective Metal Via Fill App 20200388533 - YOU; SHI ; et al.	2020-12-10
Damage Free Metal Conductor Formation App 20200350178 - Ren; He ; et al.	2020-11-05
Fully Aligned Subtractive Processes And Electronic Devices Therefrom App 20200350206 - Ren; He ; et al.	2020-11-05
Methods for depositing dielectric barrier layers and aluminum containing etch stop layers Grant 10,707,122 - Kesapragada , et al.	2020-07-07
Damage free metal conductor formation Grant 10,685,849 - Ren , et al.	2020-06-16
Self-aligned interconnects formed using subtractive techniques Grant 10,643,895 - Mebarki , et al.	2020-05-05
Physical Vapor Deposition Of Doped Transition Metal Oxide And Post-deposition Treatment Thereof For Non-volatile Memory Applicat App 20200044152 - YU; MINRUI ; et al.	2020-02-06
Method Of Forming Nickel Silicide Materials App 20200024722 - YU; MINRUI ; et al.	2020-01-23
Microwave anneal to improve CVD metal gap-fill and throughput Grant 10,438,849 - Ren , et al. O	2019-10-08
Methods For Controllable Metal And Barrier-Liner Recess App 20190198389 - Ren; He ; et al.	2019-06-27
Methods for forming a metal silicide interconnection nanowire structure Grant 10,204,764 - Mebarki , et al. Feb	2019-02-12
Methods For Depositing Dielectric Barrier Layers And Aluminum Containing Etch Stop Layers App 20190027403 - KESAPRAGADA; Sree Rangasai V. ; et al.	2019-01-24
Methods for depositing dielectric barrier layers and aluminum containing etch stop layers Grant 10,109,520 - Kesapragada , et al. October 23, 2	2018-10-23
Methods for producing interconnects in semiconductor devices Grant 10,062,607 - Emesh , et al. August 28, 2	2018-08-28
Self-aligned Interconnects Formed Using Subtractive Techniques App 20170372960 - Mebarki; Bencherki ; et al.	2017-12-28
Methods for forming 2-dimensional self-aligned vias Grant 9,847,252 - Mebarki , et al. December 19, 2	2017-12-19
Protective via cap for improved interconnect performance Grant 9,847,289 - Naik , et al. December 19, 2	2017-12-19
Microwave Anneal To Improve Cvd Metal Gap-fill And Throughput App 20170309515 - Ren; He ; et al.	2017-10-26
Methods For Forming 2-dimensional Self-aligned Vias App 20170294348 - MEBARKI; Bencherki ; et al.	2017-10-12
Self-aligned interconnects formed using substractive techniques Grant 9,761,489 - Mebarki , et al. September 12, 2	2017-09-12
Cobalt resistance recovery by hydrogen anneal Grant 9,711,397 - Bekiaris , et al. July 18, 2	2017-07-18
Methods For Depositing Dielectric Barrier Layers And Aluminum Containing Etch Stop Layers App 20170098575 - KESAPRAGADA; Sree Rangasai V. ; et al.	2017-04-06
Methods For Producing Interconnects In Semiconductor Devices App 20170047249 - Emesh; Ismail T. ; et al.	2017-02-16
Cobalt resistance recovery by hydrogen anneal Grant 9,570,345 - Bekiaris , et al. February 14, 2	2017-02-14
Methods for barrier layer removal Grant 9,514,953 - Kao , et al. December 6, 2	2016-12-06
Methods for forming an interconnect pattern on a substrate Grant 9,437,479 - Parikh , et al. September 6, 2	2016-09-06
Methods for producing interconnects in semiconductor devices Grant 9,425,092 - Emesh , et al. August 23, 2	2016-08-23
Methods For Forming A Metal Silicide Interconnection Nanowire Structure App 20160118260 - MEBARKI; Bencherki ; et al.	2016-04-28
Ultra-thin structure to protect copper and method of preparation Grant 9,257,330 - Chatterjee , et al. February 9, 2	2016-02-09
Protective Via Cap For Improved Interconnect Performance App 20150348902 - Naik; Mehul ; et al.	2015-12-03
Ultra-thin Structure To Protect Copper And Method Of Preparation App 20150147879 - Chatterjee; Amit ; et al.	2015-05-28
Methods For Barrier Layer Removal App 20150140827 - KAO; Chia-Ling ; et al.	2015-05-21
Methods For Forming An Interconnect Pattern On A Substrate App 20150140805 - PARIKH; Suketu A. ; et al.	2015-05-21
Self-aligned interconnects formed using substractive techniques App 20150056800 - Mebarki; Bencherki ; et al.	2015-02-26
Methods For Producing Interconnects In Semiconductor Devices App 20140287577 - Emesh; Ismail T. ; et al.	2014-09-25
Silicon nitride passivation layer for covering high aspect ratio features Grant 8,563,095 - Rajagopalan , et al. October 22, 2	2013-10-22
Fabrication of through-silicon vias on silicon wafers Grant 8,329,575 - Rajagopalan , et al. December 11, 2	2012-12-11
Fabrication of through-silicon vias on silicon wafers Grant 8,283,237 - Rajagopalan , et al. October 9, 2	2012-10-09
Fabrication Of Through-silicon Vias On Silicon Wafers App 20120164827 - RAJAGOPALAN; Nagarajan ; et al.	2012-06-28
Fabrication Of Through-silicon Vias On Silicon Wafers App 20120164829 - Rajagopalan; Nagarajan ; et al.	2012-06-28
Method Of Processing Low K Dielectric Films App 20120122320 - Lakshmanan; Annamalai ; et al.	2012-05-17
Self Aligned Triple Patterning App 20120085733 - Mebarki; Bencherki ; et al.	2012-04-12
Post-ash Sidewall Healing App 20120009796 - Cui; Zhenjiang ; et al.	2012-01-12
Restoring low dielectric constant film properties Grant 8,058,183 - Cui , et al. November 15, 2	2011-11-15
Silicon Nitride Passivation Layer For Covering High Aspect Ratio Features App 20110223765 - RAJAGOPALAN; Nagarajan ; et al.	2011-09-15
Plasma Surface Treatment To Prevent Pattern Collapse In Immersion Lithography App 20110111604 - Kim; Eui Kyoon ; et al.	2011-05-12
Methods And Apparatus Of Creating Airgap In Dielectric Layers For The Reduction Of Rc Delay App 20110104891 - AL-BAYATI; AMIR ; et al.	2011-05-05
Air gap interconnects using carbon-based films Grant 7,928,003 - Naik April 19, 2	2011-04-19
Methods and apparatus of creating airgap in dielectric layers for the reduction of RC delay Grant 7,879,683 - Al-Bayati , et al. February 1, 2	2011-02-01
Air gap formation and integration using a patterning cap Grant 7,811,924 - Cui , et al. October 12, 2	2010-10-12
Air Gap Interconnects Using Carbon-based Films App 20100093168 - NAIK; MEHUL	2010-04-15
Restoring Low Dielectric Constant Film Properties App 20090317971 - Cui; Zhenjiang ; et al.	2009-12-24
Methods And Appartus To Prevent Contamination Of A Photoresist Layer On A Substrate App 20090317628 - Naik; Mehul ; et al.	2009-12-24
Air Gap Formation And Integration Using A Patterning Cap App 20090309230 - CUI; ZHENJIANG ; et al.	2009-12-17
Dual damascene fabrication with low k materials Grant 7,618,889 - Naik November 17, 2	2009-11-17
Etch depth control for dual damascene fabrication process Grant 7,572,734 - Naik , et al. August 11, 2	2009-08-11
Plasma Surface Treatment To Prevent Pattern Collapse In Immersion Lithography App 20090104541 - Kim; Eui Kyoon ; et al.	2009-04-23
Methods And Apparatus Of Creating Airgap In Dielectric Layers For The Reduction Of Rc Delay App 20090093112 - AL-BAYATI; AMIR ; et al.	2009-04-09
Scheme for copper filling in vias and trenches App 20080124924 - Naik; Mehul	2008-05-29
Etch Depth Control For Dual Damascene Fabrication Process App 20080102638 - NAIK; MEHUL ; et al.	2008-05-01
Dual damascene fabrication with low k materials App 20080020570 - Naik; Mehul	2008-01-24
Selective etching of organosilicate films over silicon oxide stop etch layers Grant 7,244,672 - Nguyen , et al. July 17, 2	2007-07-17
Selective metal encapsulation schemes Grant 7,205,228 - Padhi , et al. April 17, 2	2007-04-17
Integrated circuit fabricating techniques employing sacrificial liners App 20070082477 - Naik; Mehul ; et al.	2007-04-12
Selective etching of organosilicate films over silicon oxide stop etch layers Grant 7,183,201 - Nguyen , et al. February 27, 2	2007-02-27
Integrated equipment set for forming a low K dielectric interconnect on a substrate App 20060246683 - Pan; Judon Tony ; et al.	2006-11-02
Dielectric materials to prevent photoresist poisoning Grant 7,115,534 - Nguyen , et al. October 3, 2	2006-10-03
Method of eliminating photoresist poisoning in damascene applications App 20060205206 - Xu; Ping ; et al.	2006-09-14
Method of eliminating photoresist poisoning in damascene applications Grant 7,034,409 - Xu , et al. April 25, 2	2006-04-25
Selective etching of organosilicate films over silicon oxide stop etch layers App 20050255697 - Nguyen, Huong Thanh ; et al.	2005-11-17
Dielectric materials to prevent photoresist poisoning App 20050014361 - Nguyen, Son Van ; et al.	2005-01-20
Selective metal encapsulation schemes App 20040248409 - Padhi, Deenesh ; et al.	2004-12-09
Method of eliminating photoresist poisoning in damascene applications App 20040106278 - Xu, Ping ; et al.	2004-06-03
Integrated equipment set for forming a low K dielectric interconnect on a substrate App 20040007325 - Pan, Judon Tony ; et al.	2004-01-15
Method of eliminating photoresist poisoning in damascene applications Grant 6,656,837 - Xu , et al. December 2, 2	2003-12-02
Method of eliminating photoresist poisoning in damascene applications App 20030077916 - Xu, Ping ; et al.	2003-04-24
Method of producing an interconnect structure for an integrated circuit Grant 6,548,396 - Naik , et al. April 15, 2	2003-04-15
Selective etching of organosilicate films over silicon oxide stop etch layers App 20030017694 - Nguyen, Huong Thanh ; et al.	2003-01-23
Apparatus for integrating low dielectric constant materials into a multilevel metallization and interconnect structure App 20030001264 - Naik, Mehul	2003-01-02
Single step process for blanket-selective CVD aluminum deposition Grant 6,458,684 - Guo , et al. October 1, 2	2002-10-01
Single step process for blanket-selective cvd aluminum deposition App 20020068427 - Guo, Ted ; et al.	2002-06-06
Method of producing an interconnect structure for an integrated circuit App 20020048929 - Naik, Mehul ; et al.	2002-04-25
Method of producing an interconnect structure for an integrated circuit Grant 6,245,662 - Naik , et al. June 12, 2	2001-06-12
Etching an oxidized organo-silane film Grant 6,168,726 - Li , et al. January 2, 2	2001-01-02
Single step process for blanket-selective CVD aluminum deposition Grant 6,077,781 - Guo , et al. June 20, 2	2000-06-20
Method and apparatus for integrating low dielectric constant materials into a multilevel metallization and interconnect structure Grant 6,054,380 - Naik April 25, 2	2000-04-25

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