Murray; Conal Eugene

Patent Applications and Registrations

Patent applications and USPTO patent grants for Murray; Conal Eugene.The latest application filed is for "compressive (pfet) and tensile (nfet) channel strain in nanowire fets fabricated with a replacement gate process".

Company Profile

0.13.13

Murray; Conal Eugene - Yorktown Heights NY US

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method and structure for determining thermal cycle reliability Grant 9,287,186 - Filippi , et al. March 15, 2	2016-03-15
Compressive (PFET) and tensile (NFET) channel strain in nanowire FETs fabricated with a replacement gate process Grant 8,492,208 - Cohen , et al. July 23, 2	2013-07-23
Compressive (PFET) and Tensile (NFET) Channel Strain in Nanowire FETs Fabricated with a Replacement Gate Process App 20130175503 - Cohen; Guy ; et al.	2013-07-11
Method and structure to reduce soft error rate susceptibility in semiconductor structures Grant 8,362,600 - Cabral, Jr. , et al. January 29, 2	2013-01-29
Schottky Barrier Solar Cells With High And Low Work Function Metal Contacts App 20120285517 - Souza; Joel P. de ; et al.	2012-11-15
Method And Structure To Reduce Soft Error Rate Susceptibility In Semiconductor Structures App 20110175211 - Cabral, JR.; Cyril ; et al.	2011-07-21
Modified via bottom structure for reliability enhancement Grant 7,906,428 - Clevenger , et al. March 15, 2	2011-03-15
Method And Structure For Determining Thermal Cycle Reliability App 20080224135 - Filippi; Ronald Gene ; et al.	2008-09-18
Modified Via Bottom Structure For Reliability Enhancement App 20080220608 - Clevenger; Lawrence A. ; et al.	2008-09-11
Structure for determining thermal cycle reliability Grant 7,388,224 - Filippi , et al. June 17, 2	2008-06-17
Control of liner thickness for improving thermal cycle reliability Grant 7,345,305 - Filippi , et al. March 18, 2	2008-03-18
Modified Via Bottom Structure For Reliability Enhancement App 20070281469 - Clevenger; Lawrence A. ; et al.	2007-12-06
Modified via bottom structure for reliability enhancement Grant 7,282,802 - Clevenger , et al. October 16, 2	2007-10-16
Method of extracting properties of back end of line (BEOL) chip architecture Grant 7,260,810 - Filippi, Jr. , et al. August 21, 2	2007-08-21
Method and structure for determining thermal cycle reliability App 20060273460 - Filippi; Ronald Gene ; et al.	2006-12-07
Method and structure for determining thermal cycle reliability Grant 7,098,054 - Filippi , et al. August 29, 2	2006-08-29
Modified via bottom structure for reliability enhancement App 20060081986 - Clevenger; Lawrence A. ; et al.	2006-04-20
Control of liner thickness for improving thermal cycle reliability App 20060027842 - Filippi; Ronald Gene ; et al.	2006-02-09
Control of liner thickness for improving thermal cycle reliability Grant 6,989,282 - Filippi , et al. January 24, 2	2006-01-24
Control of liner thickness for improving thermal cycle reliability App 20050227380 - Filippi, Ronald Gene ; et al.	2005-10-13
Method and structure for determining thermal cycle reliability App 20050186689 - Filippi, Ronald Gene ; et al.	2005-08-25
Method of extracting properties of back end of line (BEOL) chip architecture App 20050086628 - Filippi, Ronald G. JR. ; et al.	2005-04-21

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