MUNEKATA; Osamu
Patent Applications and Registrations
Patent applications and USPTO patent grants for MUNEKATA; Osamu.The latest application filed is for "solder alloy, solder powder, solder paste, and solder joint obtained using these".
- MUNEKATA; Osamu - Tokyo JP
- Munekata; Osamu - Tochigi JP
- Munekata; Osamu - Kawachi-gun JP
- Munekata; Osamu - Souka JP
- Munekata; Osamu - Souka-shi JP
- Munekata; Osamu - Saitama JP
- Munekata; Osamu - Koshigaya JP
| Patent | Date |
|---|---|
| Solder Alloy, Solder Powder, Solder Paste, And Solder Joint Obtained Using These App 20220258288 - KAWASAKI; Hiroyoshi ; et al. | 2022-08-18 |
| Solder material, solder paste, and solder joint Grant 11,344,976 - Kawasaki , et al. May 31, 2 | 2022-05-31 |
| Solder Alloy, Solder Power, And Solder Joint App 20220088722 - KAWASAKI; Hiroyoshi ; et al. | 2022-03-24 |
| Solder Alloy, Solder Powder, Solder Paste, And A Solder Joint Using These App 20210308808 - Kawasaki; Hiroyoshi ; et al. | 2021-10-07 |
| Solder Alloy, Solder Powder, Solder Paste, And A Solder Joint Using These App 20210245305 - Kawasaki; Hiroyoshi ; et al. | 2021-08-12 |
| Solder Material, Solder Paste, And Solder Joint App 20200376607 - Kawasaki; Hiroyoshi ; et al. | 2020-12-03 |
| Solder ball, solder joint, and joining method Grant 10,780,531 - Kawasaki , et al. Sept | 2020-09-22 |
| Solder Ball, Solder Joint, and Joining Method App 20200147732 - Kawasaki; Hiroyoshi ; et al. | 2020-05-14 |
| Solder Alloy For Bonding Cu Pipes And/or Fe Pipes, Preform Solder, Resin Flux Cored Solder, And Solder Joint App 20190358751 - KAMEDA; Naoto ; et al. | 2019-11-28 |
| Solder Alloy For Plating And Electronic Component App 20170348805 - TSURUTA; Kaichi ; et al. | 2017-12-07 |
| Lead-free solder alloy Grant 8,216,395 - Munekata , et al. July 10, 2 | 2012-07-10 |
| Lead-free solder alloy App 20100297470 - Munekata; Osamu ; et al. | 2010-11-25 |
| Lead-free solder alloy Grant 7,682,468 - Munekata , et al. March 23, 2 | 2010-03-23 |
| Method of replenishing an oxidation suppressing element in a solder bath Grant 7,628,308 - Ojima , et al. December 8, 2 | 2009-12-08 |
| Lead-free solder alloy App 20080061117 - Munekata; Osamu ; et al. | 2008-03-13 |
| Lead-free solder alloy Grant 7,338,567 - Munekata , et al. March 4, 2 | 2008-03-04 |
| Lead-free solder alloy Grant 7,029,542 - Amagai , et al. April 18, 2 | 2006-04-18 |
| Soldering method and solder alloy for additional supply App 20060011709 - Ojima; Masayuki ; et al. | 2006-01-19 |
| Lead-free solder alloy App 20050036902 - Amagai, Masazumi ; et al. | 2005-02-17 |
| Lead-free solder alloy App 20040062679 - Munekata, Osamu ; et al. | 2004-04-01 |
| Lead-free solder paste Grant 6,554,180 - Katoh , et al. April 29, 2 | 2003-04-29 |
| Lead-free solder alloy App 20030021718 - Munekata, Osamu ; et al. | 2003-01-30 |
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