MOSELY; Roderick C.

Patent Applications and Registrations

Patent applications and USPTO patent grants for MOSELY; Roderick C..The latest application filed is for "self-ionized and inductively-coupled plasma for sputtering and resputtering".

Company Profile

0.28.20

MOSELY; Roderick C. - Pleasanton CA
MOSELY, RODERICK C - PLEASANTON CA
Mosely; Roderick C. - Mountain View CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20180327893 - DING; Peijun ; et al.	2018-11-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 10,047,430 - Ding , et al. August 14, 2	2018-08-14
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20140305802 - DING; Peijun ; et al.	2014-10-16
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 8,696,875 - Ding , et al. April 15, 2	2014-04-15
Self-ionized and inductively-coupled plasma for sputtering and resputtering Grant 8,668,816 - Ding , et al. March 11, 2	2014-03-11
Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device Grant 7,802,480 - Mosely , et al. September 28, 2	2010-09-28
Cleaning of native oxide with hydrogen-containing radicals Grant 7,604,708 - Wood , et al. October 20, 2	2009-10-20
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20090233438 - DING; Peijun ; et al.	2009-09-17
Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device App 20090173160 - Mosely; Roderick C. ; et al.	2009-07-09
Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device Grant 7,497,122 - Montesclaros , et al. March 3, 2	2009-03-03
Vacuum-type electrical switching apparatus Grant 7,499,255 - Domo , et al. March 3, 2	2009-03-03
Method and apparatus for the sonic detection of high pressure conditions in a vacuum switching device Grant 7,383,733 - Mosely , et al. June 10, 2	2008-06-10
Self-ionized And Inductively-coupled Plasma For Sputtering And Resputtering App 20080110747 - DING; Peijun ; et al.	2008-05-15
Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device App 20080072678 - Montesclaros; Mary Grace ; et al.	2008-03-27
Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device Grant 7,313,964 - Montesclaros , et al. January 1, 2	2008-01-01
Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device Grant 7,302,854 - Egermeier, legal representative , et al. Decembe	2007-12-04
Method and apparatus for the sonic detection of high pressure conditions in a vacuum switching device App 20070089521 - Mosely; Roderick C. ; et al.	2007-04-26
Method and apparatus for the detection of high pressure conditions in a vacuum-type electrical device App 20060278010 - Montesclaros; Mary Grace ; et al.	2006-12-14
Vacuum-type electrical switching apparatus App 20060126257 - Domo; James Francis ; et al.	2006-06-15
End point detection for sputtering and resputtering Grant 7,048,837 - Somekh , et al. May 23, 2	2006-05-23
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20050255691 - Ding, Peijun ; et al.	2005-11-17
Method of TiSiN deposition using a chemical vapor deposition (CVD) process Grant 6,933,021 - Chou , et al. August 23, 2	2005-08-23
End point detection for sputtering and resputtering App 20050173239 - Somekh, Sasson R. ; et al.	2005-08-11
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20050006222 - Ding, Peijun ; et al.	2005-01-13
Cleaning of native oxide with hydrogen-containing radicals App 20040219789 - Wood, Bingxi Sun ; et al.	2004-11-04
Copper interconnect barrier layer structure and formation method Grant 6,607,976 - Chen , et al. August 19, 2	2003-08-19
Self-ionized and inductively-coupled plasma for sputtering and resputtering App 20030116427 - Ding, Peijun ; et al.	2003-06-26
Copper interconnect barrier layer structure and formation method App 20030059980 - Chen, Ling ; et al.	2003-03-27
Method of selective formation of a barrier layer for a contact level via Grant 6,518,176 - Guo , et al. February 11, 2	2003-02-11
Construction of a film on a semiconductor wafer Grant 6,500,742 - Chern , et al. December 31, 2	2002-12-31
Method and apparatus for detecting the thickness of copper oxide App 20020186381 - Subrahmanyan, Suchitra ; et al.	2002-12-12
Single step process for blanket-selective CVD aluminum deposition Grant 6,458,684 - Guo , et al. October 1, 2	2002-10-01
Construction of a film on a semiconductor wafer Grant 6,444,036 - Chern , et al. September 3, 2	2002-09-03
Single step process for blanket-selective cvd aluminum deposition App 20020068427 - Guo, Ted ; et al.	2002-06-06
Interconnect Structure For Use In An Integrated Circuit App 20020033533 - LIAO, MARVIN ; et al.	2002-03-21
Construction of a film on a semiconductor wafer App 20010025205 - Chern, Chyi ; et al.	2001-09-27
Contact Level Via And Method Of Selective Formation Of A Barrier Layer For A Contact Level Via App 20010001503 - GUO, TED ; et al.	2001-05-24
Deposition film orientation and reflectivity improvement using a self-aligning ultra-thin layer Grant 6,120,844 - Chen , et al. September 19, 2	2000-09-19
Single step process for blanket-selective CVD aluminum deposition Grant 6,077,781 - Guo , et al. June 20, 2	2000-06-20
Forming tin thin films using remote activated specie generation Grant 6,071,572 - Mosely , et al. June 6, 2	2000-06-06
Blanket-selective chemical vapor deposition using an ultra-thin nucleation layer Grant 6,066,358 - Guo , et al. May 23, 2	2000-05-23
Construction of a tantalum nitride film on a semiconductor wafer Grant 5,989,999 - Levine , et al. November 23, 1	1999-11-23
Variable cell size collimator Grant 5,650,052 - Edelstein , et al. July 22, 1	1997-07-22
Collimation hardware with RF bias rings to enhance sputter and/or substrate cavity ion generation efficiency Grant 5,431,799 - Mosely , et al. July 11, 1	1995-07-11
Deposition and planarizing methods and apparatus Grant 4,756,810 - Lamont, Jr. , et al. July 12, 1	1988-07-12
System and method for processing workpieces Grant 4,717,461 - Strahl , et al. January 5, 1	1988-01-05

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