| Patent | Date |
|---|
Semiconductor device having a stacked electrode with an electroless nickel plating layer
Grant 10,847,614 - Furukawa , et al. November 24, 2 | 2020-11-24 |
Semiconductor device and power conversion apparatus
Grant 10,763,346 - Furukawa , et al. Sep | 2020-09-01 |
Semiconductor Device and Power Conversion Apparatus
App 20200075722 - FURUKAWA; Tomoyasu ; et al. | 2020-03-05 |
Semiconductor Device and Power Conversion Apparatus
App 20200006301 - FURUKAWA; Tomoyasu ; et al. | 2020-01-02 |
Semiconductor chip and power module, and manufacturing method of the same
Grant 10,522,638 - Sagawa , et al. Dec | 2019-12-31 |
Semiconductor Chip And Power Module, And Manufacturing Method Of The Same
App 20190157412 - SAGAWA; Masakazu ; et al. | 2019-05-23 |
Heat-dissipating structure and semiconductor module using same
Grant 10,177,069 - Naito , et al. J | 2019-01-08 |
Metal Oxide Particles For Bonding, Sintering Binder Including Same, Process For Producing Metal Oxide Particles For Bonding, And Method For Bonding Electronic Components
App 20170278589 - YASUDA; Yusuke ; et al. | 2017-09-28 |
Heat-dissipating Structure And Semiconductor Module Using Same
App 20170236768 - NAITO; Takashi ; et al. | 2017-08-17 |
Semiconductor Device, Method Of Manufacturing Semiconductor Device, And Power Conversion Device
App 20160254761 - FURUKAWA; Tomoyasu ; et al. | 2016-09-01 |
Method for forming multilayer coating film
Grant 9,404,010 - Iwata , et al. August 2, 2 | 2016-08-02 |
Method For Forming Multilayer Coating Film
App 20150218405 - Iwata; Naoyuki ; et al. | 2015-08-06 |
Power Semiconductor Module
App 20150221626 - MOTOWAKI; Shigehisa ; et al. | 2015-08-06 |
Semiconductor device and method for manufacturing same
Grant 8,912,644 - Ide , et al. December 16, 2 | 2014-12-16 |
Electrically conductive bonding material, method of bonding with the same, and semiconductor device bonded with the same
Grant 8,840,811 - Yasuda , et al. September 23, 2 | 2014-09-23 |
Low temperature bonding material comprising coated metal nanoparticles, and bonding method
Grant 8,821,676 - Yasuda , et al. September 2, 2 | 2014-09-02 |
Bonding method and bonding material using metal particle
Grant 8,821,768 - Yasuda , et al. September 2, 2 | 2014-09-02 |
Method For Producing Alumina-crystal-particle-dispersed Alumina Sol, Alumina-crystal-particle-dispersed Alumina Sol Obtained By The Method, And Aluminum Coated Member Produced Using The Sol
App 20140147661 - YASUDA; Yusuke ; et al. | 2014-05-29 |
Scanning probe microscope and method of observing sample using the same
Grant 8,635,710 - Nakata , et al. January 21, 2 | 2014-01-21 |
Semiconductor device and method of manufacturing the same
Grant 8,592,996 - Morita , et al. November 26, 2 | 2013-11-26 |
Semiconductor Device And Method For Manufacturing Same
App 20130299962 - IDE; Eiichi ; et al. | 2013-11-14 |
Semiconductor Device
App 20130264696 - KAJIWARA; Ryoichi ; et al. | 2013-10-10 |
Semiconductor device and bonding material
Grant 8,513,534 - Morita , et al. August 20, 2 | 2013-08-20 |
Mosfet package
Grant 8,455,986 - Kajiwara , et al. June 4, 2 | 2013-06-04 |
Conductive Sintered Layer Forming Composition
App 20130119322 - Ide; Eiichi ; et al. | 2013-05-16 |
Sinterable Bonding Material Using Copper Nanoparticles, Process For Producing Same, And Method Of Bonding Electronic Component
App 20130105980 - Yasuda; Yusuke ; et al. | 2013-05-02 |
Electronic member, electronic part and manufacturing method therefor
Grant 8,400,777 - Ide , et al. March 19, 2 | 2013-03-19 |
Semiconductor Device
App 20120217556 - Kajiwara; Ryoichi ; et al. | 2012-08-30 |
Scanning Probe Microscope and Method of Observing Sample Using the Same
App 20120204297 - NAKATA; Toshihiko ; et al. | 2012-08-09 |
Semiconductor device
Grant 8,183,607 - Kajiwara , et al. May 22, 2 | 2012-05-22 |
Scanning probe microscope and method of observing sample using the same
Grant 8,181,268 - Nakata , et al. May 15, 2 | 2012-05-15 |
Low Temperature Bonding Material And Bonding Method
App 20120104618 - Yasuda; Yusuke ; et al. | 2012-05-03 |
Semiconductor Device
App 20110298020 - KAJIWARA; Ryoichi ; et al. | 2011-12-08 |
Semiconductor device, manufacturing method thereof, composite metal body and manufacturing method thereof
Grant 8,008,772 - Morita , et al. August 30, 2 | 2011-08-30 |
Low Temperature Bonding Material And Bonding Method
App 20110204125 - YASUDA; Yusuke ; et al. | 2011-08-25 |
MOSFET package
Grant 7,985,991 - Kajiwara , et al. July 26, 2 | 2011-07-26 |
Semiconductor Device And Method Of Manufacturing The Same
App 20110156225 - Hozoji; Hiroshi ; et al. | 2011-06-30 |
Low temperature bonding material comprising metal particles and bonding method
Grant 7,955,411 - Yasuda , et al. June 7, 2 | 2011-06-07 |
Semiconductor Device And Method Of Manufacturing The Same
App 20110012262 - MORITA; Toshiaki ; et al. | 2011-01-20 |
Scanning Probe Microscope and Method of Observing Sample Using the Same
App 20100325761 - Nakata; Toshihiko ; et al. | 2010-12-23 |
Electrically Conductive Bonding Material, Method Of Bonding With The Same, And Semiconductor Device Bonded With The Same
App 20100270515 - YASUDA; Yuusuke ; et al. | 2010-10-28 |
Electronic Member, Electronic Part And Manufacturing Method Therefor
App 20100195292 - Ide; Eiichi ; et al. | 2010-08-05 |
Semiconductor device and bonding material
App 20090244868 - Morita; Toshiaki ; et al. | 2009-10-01 |
Inverter and vehicle drive unit using the same
Grant 7,589,400 - Hozoji , et al. September 15, 2 | 2009-09-15 |
Semiconductor device
Grant 7,579,805 - Saito , et al. August 25, 2 | 2009-08-25 |
Semiconductor device and power conversion apparatus using the same
Grant 7,542,317 - Azuma , et al. June 2, 2 | 2009-06-02 |
Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
Grant 7,528,485 - Morita , et al. May 5, 2 | 2009-05-05 |
Power Semiconductor Module And Method of Manufacturing the Power Semiconductor Module
App 20080315401 - Imamura; Hisayuki ; et al. | 2008-12-25 |
Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors
Grant 7,449,786 - Kawanabe , et al. November 11, 2 | 2008-11-11 |
Semiconductor Device, Manufacturing Method Thereof, Composite Metal Body And Manufacturing Method Thereof
App 20080237851 - Morita; Toshiaki ; et al. | 2008-10-02 |
Low Temperature Bonding Material And Bonding Method
App 20080173398 - Yasuda; Yusuke ; et al. | 2008-07-24 |
Semiconductor Device
App 20080169537 - KAJIWARA; Ryoichi ; et al. | 2008-07-17 |
MOSFET package
Grant 7,400,002 - Kajiwara , et al. July 15, 2 | 2008-07-15 |
Conductive Sintered Layer Forming Composition And Conductive Coating Film Forming Method And Bonding Method Using The Same
App 20080160183 - Ide; Eiichi ; et al. | 2008-07-03 |
Bonding Method And Bonding Material Using Metal Particle
App 20080156398 - Yasuda; Yusuke ; et al. | 2008-07-03 |
Method for mounting an electronic part on a substrate using a liquid containing metal particles
Grant 7,393,771 - Hozoji , et al. July 1, 2 | 2008-07-01 |
MOSFET package
Grant 7,394,146 - Kajiwara , et al. July 1, 2 | 2008-07-01 |
Resin encapsulated semiconductor device and the production method
Grant 7,372,132 - Suzuki , et al. May 13, 2 | 2008-05-13 |
MOSFET package
Grant 7,342,267 - Kajiwara , et al. March 11, 2 | 2008-03-11 |
Dryer apparatus for clothing knitted or woven fabric
Grant 7,334,348 - Morita February 26, 2 | 2008-02-26 |
MOSFET package
Grant 7,332,757 - Kajiwara , et al. February 19, 2 | 2008-02-19 |
Bonding Materials Having Particle With Anisotropic Shape
App 20070298244 - YASUDA; YUSUKE ; et al. | 2007-12-27 |
Knitting method and system using stretch yarn
Grant 7,289,869 - Morita October 30, 2 | 2007-10-30 |
Removable moving member for knitting and weft knitting machine provided with knitting member switching apparatus
Grant 7,272,959 - Morita , et al. September 25, 2 | 2007-09-25 |
Pile knitting method by weft knitting machine
Grant 7,272,957 - Morita September 25, 2 | 2007-09-25 |
Method For Mounting An Electronic Part On A Substrate Using A Liquid Containing Metal Particles
App 20070216012 - HOZOJI; HIROSHI ; et al. | 2007-09-20 |
Semiconductor Device
App 20070215316 - Saito; Atsushi ; et al. | 2007-09-20 |
Pile Knitting Method By Weft Knitting Machine
App 20070180865 - Morita; Toshiaki | 2007-08-09 |
Method and apparatus for adjusting suction of cutting machine
App 20070169597 - Morita; Toshiaki | 2007-07-26 |
Yarn feeding apparatus of weft knitting machine
Grant 7,218,988 - Morita , et al. May 15, 2 | 2007-05-15 |
Semiconductor device and power conversion apparatus using the same
App 20070051974 - Azuma; Katsunori ; et al. | 2007-03-08 |
Removable moving member for knitting and weft knitting machine provided with knitting member switching apparatus
App 20070051139 - Morita; Toshiaki ; et al. | 2007-03-08 |
Semiconductor device
App 20070040248 - Kajiwara; Ryoichi ; et al. | 2007-02-22 |
Semiconductor device
App 20070040250 - Kajiwara; Ryoichi ; et al. | 2007-02-22 |
Semiconductor device
App 20070040249 - Kajiwara; Ryoichi ; et al. | 2007-02-22 |
Semiconductor device
App 20070029540 - Kajiwara; Ryoichi ; et al. | 2007-02-08 |
Dryer apparatus for clothing knitted or woven fabric
App 20070011906 - Morita; Toshiaki | 2007-01-18 |
Yarn feeding device of weft knitting machine
App 20070000287 - Morita; Toshiaki ; et al. | 2007-01-04 |
Compound needle
Grant 7,152,437 - Morita December 26, 2 | 2006-12-26 |
Weft knitting machine having movable sinker
Grant 7,152,435 - Sonomura , et al. December 26, 2 | 2006-12-26 |
Knitting method and system using elastic yarn
App 20060272358 - Morita; Toshiaki | 2006-12-07 |
Electronic part mounting method, semiconductor module, and semiconductor device
App 20060267218 - Hozoji; Hiroshi ; et al. | 2006-11-30 |
Weft Knitting Machine Having Movable Sinker
App 20060243001 - Sonomura; Minoru ; et al. | 2006-11-02 |
Printing device
Grant 7,111,922 - Morita September 26, 2 | 2006-09-26 |
Semiconductor device
App 20060197200 - Kajiwara; Ryoichi ; et al. | 2006-09-07 |
Semiconductor device
App 20060197196 - Kajiwara; Ryoichi ; et al. | 2006-09-07 |
Semiconductor device having improved adhesion between bonding and ball portions of electrical connectors
App 20060138679 - Kawanabe; Naoki ; et al. | 2006-06-29 |
Stitch presser in a weft knitting machine
Grant 7,059,157 - Morita , et al. June 13, 2 | 2006-06-13 |
Yarn feeding device for flat knitting machine
Grant 7,055,349 - Morita , et al. June 6, 2 | 2006-06-06 |
Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors
Grant 7,049,214 - Kawanabe , et al. May 23, 2 | 2006-05-23 |
Stitch Presser In A Weft Knitting Machine
App 20060090519 - Morita; Toshiaki ; et al. | 2006-05-04 |
Yarn Feeding Device For Flat Knitting Machine
App 20060090520 - Morita; Toshiaki ; et al. | 2006-05-04 |
Inverter and vehicle drive unit using the same
App 20060071860 - Hozoji; Hiroshi ; et al. | 2006-04-06 |
Semiconductor device and a method of manufacturing the same
Grant 7,015,127 - Nakajima , et al. March 21, 2 | 2006-03-21 |
Semiconductor device, power converter device using it, and hybrid vehicle using the power converter device
App 20060022326 - Morita; Toshiaki ; et al. | 2006-02-02 |
Weft knitting machine with movable sinker device
Grant 6,978,642 - Morita , et al. December 27, 2 | 2005-12-27 |
Circuit board and semiconductor device using the same
App 20050258550 - Morita, Toshiaki ; et al. | 2005-11-24 |
Resin encapsulated semiconductor device and the production method
App 20050221538 - Suzuki, Kazuhiro ; et al. | 2005-10-06 |
Printing device
App 20050212849 - Morita, Toshiaki | 2005-09-29 |
Weft knitting machine with movable sinker device
App 20050183466 - Morita, Toshiaki ; et al. | 2005-08-25 |
Composite needle of knitting machine
Grant 6,915,667 - Morita , et al. July 12, 2 | 2005-07-12 |
Composite needs
Grant 6,904,774 - Morita June 14, 2 | 2005-06-14 |
Semiconductor device and a method of manufacturing the same
App 20050121805 - Matsuzawa, Tomoo ; et al. | 2005-06-09 |
Semiconductor device with alternate bonding wire arrangement
Grant 6,900,551 - Matsuzawa , et al. May 31, 2 | 2005-05-31 |
Yarn carrier of weft knitting device
Grant 6,895,785 - Morita May 24, 2 | 2005-05-24 |
Semiconductor device with joint structure having lead-free solder layer over nickel layer
Grant 6,879,041 - Yamamoto , et al. April 12, 2 | 2005-04-12 |
Method of manufacturing a semiconductor device to provide improved adhesion between bonding pads and ball portions of electrical connectors
App 20050035449 - Kawanabe, Naoki ; et al. | 2005-02-17 |
Composite Needle Of Knitting Machine
App 20040237596 - Morita, Toshiaki ; et al. | 2004-12-02 |
Semiconductor device
App 20040217474 - Kajiwara, Ryoichi ; et al. | 2004-11-04 |
Stitch control device in flat knitting machine
Grant 6,802,192 - Morita , et al. October 12, 2 | 2004-10-12 |
Flatbed knitting machine
Grant 6,799,443 - Morita , et al. October 5, 2 | 2004-10-05 |
Flip chip assembly structure for semiconductor device and method of assembling therefor
Grant 6,798,072 - Kajiwara , et al. September 28, 2 | 2004-09-28 |
Semiconductor device and manufacturing method thereof
Grant 6,784,554 - Kajiwara , et al. August 31, 2 | 2004-08-31 |
Semiconductor device
Grant 6,774,466 - Kajiwara , et al. August 10, 2 | 2004-08-10 |
Semiconductor device
App 20040150082 - Kajiwara, Ryoichi ; et al. | 2004-08-05 |
Semiconductor device and a method of manufacturing the same
App 20040142551 - Nakajima, Yasuyuki ; et al. | 2004-07-22 |
Composite Needle
App 20040093909 - Morita, Toshiaki | 2004-05-20 |
Yarn carrier of weft knitting device
App 20040093911 - Morita, Toshiaki | 2004-05-20 |
Stitch control device in flat knitting machine
App 20040083765 - Morita, Toshiaki ; et al. | 2004-05-06 |
Flatbed knitting machine
App 20040031292 - Morita, Toshiaki ; et al. | 2004-02-19 |
Semiconductor device and a method of manufacturing the same
App 20030218245 - Matsuzawa, Tomoo ; et al. | 2003-11-27 |
Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member
App 20030201530 - Kurihara, Yasutoshi ; et al. | 2003-10-30 |
Semiconductor device and a method of manufacturing the same
App 20030197277 - Yamamoto, Kenichi ; et al. | 2003-10-23 |
Flat bed knitting machine having an oil feeding device
Grant 6,619,075 - Morita September 16, 2 | 2003-09-16 |
Semiconductor device and a method of manufacturing the same
App 20030168740 - Nakajima, Yasuyuki ; et al. | 2003-09-11 |
Weft knitting machine with transferring mechanism and transferring method
Grant 6,609,396 - Morita , et al. August 26, 2 | 2003-08-26 |
Flat Bed Knitting Machine Having An Oil Feeding Device
App 20030140660 - Morita, Toshiaki | 2003-07-31 |
Semiconductor device and manufacturing method thereof
App 20030127747 - Kajiwara, Ryoichi ; et al. | 2003-07-10 |
Writing instrument
Grant D474,810 - Morita May 20, 2 | 2003-05-20 |
Weft knitting machine with transferring mechanism and transferring method
App 20030033836 - Morita, Toshiaki ; et al. | 2003-02-20 |
Semiconductor package and flip chip bonding method therein
App 20030001286 - Kajiwara, Ryoichi ; et al. | 2003-01-02 |
Composite material member for semiconductor device and insulated and non-insulated semiconductor devices using composite material member
App 20020192488 - Kurihara, Yasutoshi ; et al. | 2002-12-19 |
Flip chip assembly structure for semiconductor device and method of assembling therefor
App 20020056906 - Kajiwara, Ryoichi ; et al. | 2002-05-16 |
Compound needle with asymmetrically divided closing element
Grant 6,339,942 - Majer , et al. January 22, 2 | 2002-01-22 |
Apparatus for measuring a cutting blade width in a cutting apparatus
Grant 5,573,442 - Morita , et al. November 12, 1 | 1996-11-12 |
Method and apparatus for yarn processing position control of flat knitting machine
Grant 5,369,966 - Morita , et al. December 6, 1 | 1994-12-06 |
Optical character recognition system
Grant 5,369,715 - Tanaka , et al. November 29, 1 | 1994-11-29 |
Translation method and apparatus using optical character reader
Grant 5,062,047 - Tanaka , et al. October 29, 1 | 1991-10-29 |
Method for determining coordinates of circumscribed rectangular frame of each character for use in optical character reader
Grant 5,054,091 - Tanaka , et al. October 1, 1 | 1991-10-01 |
Optical character reader
Grant 4,941,195 - Tanaka , et al. July 10, 1 | 1990-07-10 |
Handwritten character recognition device
Grant 4,607,386 - Morita , et al. August 19, 1 | 1986-08-19 |
Resin composition for powder coating
Grant 4,499,239 - Murakami , et al. February 12, 1 | 1985-02-12 |
OCR for reading a constraint free hand-written character or the like
Grant 4,193,056 - Morita , et al. March 11, 1 | 1980-03-11 |
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