Morgan; Paul A.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Morgan; Paul A..The latest application filed is for "pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same".

Company Profile

3.41.43

Morgan; Paul A. - Kuna ID
Morgan; Paul A - Kuna ID
Morgan, Paul A. - Aptos CA
Morgan; Paul A. - Boise ID
Morgan; Paul A. - Chicago IL

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same App 20220254644 - Zhou; Baosuo ; et al.	2022-08-11
Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same Grant 11,335,563 - Zhou , et al. May 17, 2	2022-05-17
Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Inclu App 20200203171 - Zhou; Baosuo ; et al.	2020-06-25
Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same Grant 10,607,844 - Zhou , et al.	2020-03-31
Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same Grant 10,096,483 - Zhou , et al. October 9, 2	2018-10-09
Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same App 20180286693 - Zhou; Baosuo ; et al.	2018-10-04
Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same App 20170372913 - Zhou; Baosuo ; et al.	2017-12-28
Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same Grant 9,761,457 - Zhou , et al. September 12, 2	2017-09-12
Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same App 20160203993 - Zhou; Baosuo ; et al.	2016-07-14
Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same Grant 9,305,782 - Zhou , et al. April 5, 2	2016-04-05
Selective metal deposition over dielectric layers Grant 9,269,586 - Morgan , et al. February 23, 2	2016-02-23
Gaseous compositions comprising hydrogen fluoride and an alkylated ammonia derivative Grant 9,005,473 - Kiehlbauch , et al. April 14, 2	2015-04-14
Pitch Reduction Technology Using Alternating Spacer Depositions During the Formation of a Semiconductor Device and Systems Including Same App 20150021744 - Zhou; Baosuo ; et al.	2015-01-22
Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same Grant 8,852,851 - Zhou , et al. October 7, 2	2014-10-07
Method of reducing damage to an electron beam inspected semiconductor substrate, and methods of inspecting a semiconductor substrate Grant 8,563,435 - Daycock , et al. October 22, 2	2013-10-22
Methods for treating surfaces, and methods for removing one or more materials from surfaces Grant 8,500,913 - Kiehlbauch , et al. August 6, 2	2013-08-06
Methods for Treating Surfaces, Methods for Removing One or More Materials from Surfaces, and Apparatuses for Treating Surfaces App 20130186431 - Kiehlbauch; Mark ; et al.	2013-07-25
Selective Metal Deposition Over Dielectric Layers App 20130084699 - Morgan; Paul A. ; et al.	2013-04-04
Method Of Reducing Damage To An Electron Beam Inspected Semiconductor Substrate, And Methods Of Inspecting A Semiconductor Substrate App 20130011940 - Daycock; David A. ; et al.	2013-01-10
Selective metal deposition over dielectric layers Grant 8,338,297 - Morgan , et al. December 25, 2	2012-12-25
Method of reducing electron beam damage on post W-CMP wafers Grant 8,334,209 - Daycock , et al. December 18, 2	2012-12-18
Ammonium Fluoride Chemistries App 20120309999 - Kiehlbauch; Mark W. ; et al.	2012-12-06
Methods of removing silicon oxide Grant 8,252,194 - Kiehlbauch , et al. August 28, 2	2012-08-28
Selective metal deposition over dielectric layers Grant 8,183,154 - Morgan , et al. May 22, 2	2012-05-22
Methods Of Removing Silicon Oxide And Gaseous Mixtures For Achieving Same App 20090275205 - Kiehlbauch; Mark W. ; et al.	2009-11-05
Methods of forming semiconductor constructions, and methods of selectively removing metal-containing materials relative to oxide Grant 7,585,782 - Greeley , et al. September 8, 2	2009-09-08
Methods For Treating Surfaces, Methods For Removing One Or More Materials from Surfaces, And Apparatuses For Treating Surfaces App 20090065026 - Kiehlbauch; Mark ; et al.	2009-03-12
Method of reducing electron beam damage on post W-CMP wafers App 20080076263 - Daycock; David A. ; et al.	2008-03-27
Pitch reduction technology using alternating spacer depositions during the formation of a semiconductor device and systems including same App 20080008969 - Zhou; Baosuo ; et al.	2008-01-10
Methods of forming semiconductor constructions, and methods of selectively removing metal-containing materials relative to oxide App 20070238287 - Greeley; Joseph N. ; et al.	2007-10-11
Microfeature dies with porous regions, and associated methods and systems App 20070099397 - Kirby; Kyle K. ; et al.	2007-05-03
Methods and compositions for removing Group VIII metal-containing materials from surfaces App 20060201913 - Morgan; Paul A.	2006-09-14
Methods and compositions for removing group VIII metal-containing materials from surfaces Grant 7,077,975 - Morgan July 18, 2	2006-07-18
Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates Grant 7,060,631 - Morgan June 13, 2	2006-06-13
Wafer cleaning method and resulting wafer Grant 7,023,099 - Andreas , et al. April 4, 2	2006-04-04
Microfeature dies with porous regions, and associated methods and systems App 20060043534 - Kirby; Kyle K. ; et al.	2006-03-02
Structure and method for field emitter tips App 20050282301 - Gilton, Terry L. ; et al.	2005-12-22
Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates Grant 6,955,995 - Morgan October 18, 2	2005-10-18
Methods using a peroxide-generating compound to remove group VIII metal-containing residue App 20050217696 - Morgan, Paul A.	2005-10-06
Device with layer edges separated through mechanical spacing Grant 6,952,360 - Morgan October 4, 2	2005-10-04
Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates App 20050215064 - Morgan, Paul A.	2005-09-29
Structure and method for field emitter tips Grant 6,933,665 - Gilton , et al. August 23, 2	2005-08-23
Wafer Cleaning method and resulting wafer Grant 6,930,017 - Andreas , et al. August 16, 2	2005-08-16
Methods using a peroxide-generating compound to remove group VIII metal-containing residue Grant 6,905,974 - Morgan June 14, 2	2005-06-14
Removal of organic material in integrated circuit fabrication using ozonated organic acid solutions Grant 6,867,148 - Yates , et al. March 15, 2	2005-03-15
Wafer cleaning method and resulting wafer App 20050040442 - Andreas, Michael T. ; et al.	2005-02-24
Wafer cleaning method and resulting wafer App 20050040443 - Andreas, Michael T. ; et al.	2005-02-24
Copper post-etch cleaning process Grant 6,835,668 - Andreas , et al. December 28, 2	2004-12-28
Delivery of dissolved ozone App 20040211514 - Torek, Kevin J. ; et al.	2004-10-28
Delivery of dissolved ozone App 20040194883 - Torek, Kevin J. ; et al.	2004-10-07
Etching processes for integrated circuit manufacturing including methods of forming capacitors Grant 6,790,786 - Morgan , et al. September 14, 2	2004-09-14
High aspect ratio fill method and resulting structure Grant 6,787,450 - Sinha , et al. September 7, 2	2004-09-07
Delivery of dissolved ozone Grant 6,758,938 - Torek , et al. July 6, 2	2004-07-06
Method to isolate device layer edges through mechanical spacing App 20040124456 - Morgan, Paul A.	2004-07-01
High aspect ratio fill method and resulting structure Grant 6,756,682 - Sinha , et al. June 29, 2	2004-06-29
Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates App 20040110372 - Morgan, Paul A.	2004-06-10
Method to isolate device layer edges through mechanical spacing Grant 6,737,283 - Morgan May 18, 2	2004-05-18
Method To Isolate Device Layer Edges Through Mechanical Spacing App 20040041181 - Morgan, Paul A.	2004-03-04
Methods using a peroxide-generating compound to remove group VIII metal-containing residue App 20040029392 - Morgan, Paul A.	2004-02-12
Methods and compositions for removing group VIII metal-containing materials from surfaces App 20040025904 - Morgan, Paul A.	2004-02-12
High aspect ratio fill method and resulting structure App 20030230808 - Sinha, Nishant ; et al.	2003-12-18
High aspect ratio fill method and resulting structure App 20030222347 - Sinha, Nishant ; et al.	2003-12-04
Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates Grant 6,653,243 - Morgan November 25, 2	2003-11-25
Delivery of dissolved ozone Grant 6,645,874 - Torek , et al. November 11, 2	2003-11-11
Delivery Of Dissolved Ozone App 20030196678 - Torek, Kevin J. ; et al.	2003-10-23
Etching processes for integrated circuit manufacturing including methods of forming capacitors App 20030170961 - Morgan, Paul A. ; et al.	2003-09-11
Copper post-etch cleaning process App 20030077902 - Andreas, Michael T. ; et al.	2003-04-24
Copper post-etch cleaning process App 20030077903 - Andreas, Michael T. ; et al.	2003-04-24
Methods Of Cleaning Surfaces Of Copper-containing Materials, And Methods Of Forming Openings To Copper-containing Substrates App 20030068886 - Morgan, Paul A.	2003-04-10
Structure and method for field emitter tips App 20020175608 - Gilton, Terry L. ; et al.	2002-11-28
Removal of organic material in integrated circuit fabrication using ozonated organic acid solutions App 20020173156 - Yates, Donald L. ; et al.	2002-11-21
Global personalization engine App 20020165967 - Morgan, Paul A.	2002-11-07
Methods of cleaning surfaces of copper-containing materials, and methods of forming openings to copper-containing substrates App 20020119656 - Smith, David ; et al.	2002-08-29
Structure and method for field emitter tips Grant 6,417,016 - Gilton , et al. July 9, 2	2002-07-09
Ruthenium silicide processing methods Grant 6,399,492 - Andreas , et al. June 4, 2	2002-06-04
Delivery of dissolved ozone App 20010037816 - Torek, Kevin J. ; et al.	2001-11-08
Method and apparatus for etch of a specific subarea of a semiconductor work object Grant 6,290,863 - Morgan , et al. September 18, 2	2001-09-18
Micrometer With Movable Anvil Grant 3,845,564 - Morgan November 5, 1	1974-11-05

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