Moeller; Sascha
Patent Applications and Registrations
Patent applications and USPTO patent grants for Moeller; Sascha.The latest application filed is for "method for forming a packaged semiconductor device".
- Moeller; Sascha - Buerstadt DE
- Moeller; Sascha - Hamburg DE
- Moeller; Sascha - Gilserberg DE
| Patent | Date |
|---|---|
| Seal arrangement Grant 11,255,438 - Nahrwold , et al. February 22, 2 | 2022-02-22 |
| Seal arrangement Grant 11,168,792 - Nahrwold , et al. November 9, 2 | 2021-11-09 |
| Method For Forming A Packaged Semiconductor Device App 20210305095 - Moeller; Sascha ; et al. | 2021-09-30 |
| Semiconductor device and method of making a semiconductor device Grant 11,011,446 - Kamphuis , et al. May 18, 2 | 2021-05-18 |
| Seal Arrangement App 20200370653 - Nahrwold; Olaf ; et al. | 2020-11-26 |
| Seal Arrangement App 20200370655 - Nahrwold; Olaf ; et al. | 2020-11-26 |
| Seal Ring, Sealing Arrangement, And Use Of A Sealing Arrangement App 20190285182 - Moeller; Sascha ; et al. | 2019-09-19 |
| Variable stealth laser dicing process Grant 10,347,534 - Lapke , et al. July 9, 2 | 2019-07-09 |
| Variable Stealth Laser Dicing Process App 20190080963 - LAPKE; Martin ; et al. | 2019-03-14 |
| Plasma dicing with blade saw patterned underside mask Grant 9,847,258 - Rohleder , et al. December 19, 2 | 2017-12-19 |
| Combination grinding after laser (GAL) and laser on-off function to increase die strength Grant 9,812,361 - Buenning , et al. November 7, 2 | 2017-11-07 |
| Semiconductor Device And Method Of Making A Semiconductor Device App 20170148697 - Kamphuis; Tonny ; et al. | 2017-05-25 |
| Plasma Dicing With Blade Saw Patterned Underside Mask App 20170092540 - Rohleder; Thomas ; et al. | 2017-03-30 |
| Plasma etching and stealth dicing laser process Grant 9,601,437 - Albermann , et al. March 21, 2 | 2017-03-21 |
| Wafer Material Removal App 20160172243 - Moeller; Sascha ; et al. | 2016-06-16 |
| Apparatus, device and method for wafer dicing Grant 9,349,645 - Lapke , et al. May 24, 2 | 2016-05-24 |
| Plasma Etching And Stealth Dicing Laser Process App 20160071770 - Albermann; Guido ; et al. | 2016-03-10 |
| Using a double-cut for mechanical protection of a wafer-level chip scale package (WLCSP) Grant 9,245,804 - Zenz , et al. January 26, 2 | 2016-01-26 |
| Protection of a wafer-level chip scale package (WLCSP) Grant 9,196,537 - Van Gemert , et al. November 24, 2 | 2015-11-24 |
| Apparatus, Device And Method For Wafer Dicing App 20150104931 - Lapke; Martin ; et al. | 2015-04-16 |
| Combination Grinding After Laser (gal) And Laser On-off Function To Increase Die Strength App 20150069578 - BUENNING; Hartmut ; et al. | 2015-03-12 |
| Die preparation for wafer-level chip scale package (WLCSP) Grant 8,895,363 - Buenning , et al. November 25, 2 | 2014-11-25 |
| Die Preparation for Wafer-Level Chip Scale Package (WLCSP) App 20140264768 - Buenning; Hartmut ; et al. | 2014-09-18 |
| High die strength semiconductor wafer processing method and system Grant 8,809,166 - Buenning , et al. August 19, 2 | 2014-08-19 |
| High Die Strength Semiconductor Wafer Processing Method And System App 20140179083 - BUENNING; HARTMUT ; et al. | 2014-06-26 |
| Wafer Separation App 20140145294 - Moeller; Sascha ; et al. | 2014-05-29 |
| Protection Of A Wafer-level Chip Scale Package (wlcsp) App 20140138855 - VAN GEMERT; Leonardus Antonius Elisabeth ; et al. | 2014-05-22 |
| Using A Double-cut For Mechanical Protection Of A Wafer-level Chip Scale Package (wlcsp) App 20140110842 - ZENZ; Christian ; et al. | 2014-04-24 |
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