Moehle; Paul R

Patent Applications and Registrations

Patent applications and USPTO patent grants for Moehle; Paul R.The latest application filed is for "palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication".

Company Profile

0.8.7

Moehle; Paul R - Seekonk MA
Moehle; Paul R. - Seekonk MA
Moehle; Paul R. - Attleboro MA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication Grant 7,939,378 - Abbott , et al. May 10, 2	2011-05-10
Palladium-Spot Leadframes for High Adhesion Semiconductor Devices and Method of Fabrication App 20070243665 - Abbott; Donald C. ; et al.	2007-10-18
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication Grant 7,245,006 - Abbott , et al. July 17, 2	2007-07-17
Gold spot plated leadframes for semiconductor devices and method of fabrication Grant 7,148,085 - Abbott , et al. December 12, 2	2006-12-12
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication App 20060001132 - Abbott; Donald C. ; et al.	2006-01-05
Stabilizer/spacer for semiconductor device Grant 6,956,282 - Alvarez , et al. October 18, 2	2005-10-18
Leadframes for high adhesion semiconductor devices and method of fabrication Grant 6,953,986 - Abbott , et al. October 11, 2	2005-10-11
Preplating of semiconductor small outline no-lead leadframes Grant 6,838,757 - Abbott , et al. January 4, 2	2005-01-04
Gradient dragout system in a continuous plating line Grant 6,780,253 - Moehle , et al. August 24, 2	2004-08-24
Gold spot plated leadframes for semiconductor devices and method of fabrication App 20040113241 - Abbott, Donald C. ; et al.	2004-06-17
Semiconductor Circuit Assembly Having A Plated Leadframe Including Gold Selectively Covering Areas To Be Soldered App 20030011048 - Abbott, Donald C. ; et al.	2003-01-16
Gradient dragout system in a continuous plating line App 20020179121 - Moehle, Paul R. ; et al.	2002-12-05
Palladium-spot leadframes for high adhesion semiconductor devices and method of fabrication App 20020070434 - Abbott, Donald C. ; et al.	2002-06-13
Preplating of semiconductor small outline no-lead leadframes App 20020003292 - Abbott, Donald C. ; et al.	2002-01-10
Leadframes with selective palladium plating Grant 6,194,777 - Abbott , et al. February 27, 2	2001-02-27

uspto.report is an independent third-party trademark research tool that is not affiliated, endorsed, or sponsored by the United States Patent and Trademark Office (USPTO) or any other governmental organization. The information provided by uspto.report is based on publicly available data at the time of writing and is intended for informational purposes only.

While we strive to provide accurate and up-to-date information, we do not guarantee the accuracy, completeness, reliability, or suitability of the information displayed on this site. The use of this site is at your own risk. Any reliance you place on such information is therefore strictly at your own risk.

All official trademark data, including owner information, should be verified by visiting the official USPTO website at www.uspto.gov. This site is not intended to replace professional legal advice and should not be used as a substitute for consulting with a legal professional who is knowledgeable about trademark law.