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name:-0.06768798828125
name:-0.071787118911743
name:-0.0030579566955566
Miyata; Yoshinao Patent Filings

Miyata; Yoshinao

Patent Applications and Registrations

Patent applications and USPTO patent grants for Miyata; Yoshinao.The latest application filed is for "liquid ejecting apparatus".

Company Profile
3.68.60
  • Miyata; Yoshinao - Matsukawa-mura JP
  • Miyata; Yoshinao - Nagano-ken JP
  • Miyata; Yoshinao - Matsumoto JP
  • Miyata; Yoshinao - Omachi JP
  • Miyata; Yoshinao - Matsumoto-shi JP
  • MIYATA; Yoshinao - Kita-Azumi-Gun JP
  • Miyata; Yoshinao - Matsukawa JP
  • Miyata; Yoshinao - Suwa JP
  • MIYATA; Yoshinao - Minowa-machi JP
  • Miyata; Yoshinao - Suwa-shi JP
  • Miyata; Yoshinao - Nagano JP
  • MIYATA; Yoshinao - Matsukawa-machi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Liquid ejecting apparatus
Grant 10,639,898 - Watanabe , et al.
2020-05-05
Liquid ejecting head and liquid ejecting apparatus
Grant 10,464,321 - Miyata No
2019-11-05
Liquid Ejecting Apparatus
App 20190143701 - WATANABE; Shunsuke ;   et al.
2019-05-16
Liquid ejecting apparatus
Grant 10,195,858 - Watanabe , et al. Fe
2019-02-05
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20180339512 - MIYATA; Yoshinao
2018-11-29
Liquid ejecting head and liquid ejecting apparatus
Grant 10,065,424 - Miyata September 4, 2
2018-09-04
Liquid ejecting head and liquid ejecting apparatus
Grant 9,873,249 - Watanabe , et al. January 23, 2
2018-01-23
Liquid supply unit having an engagement structure for engaging a liquid engagement device
Grant 9,827,773 - Mizutani , et al. November 28, 2
2017-11-28
Ultrasonic sensor and method for producing the same
Grant 9,821,342 - Kojima , et al. November 21, 2
2017-11-21
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20170232742 - MIYATA; Yoshinao
2017-08-17
Liquid ejecting head and liquid ejecting apparatus
Grant 9,676,185 - Miyata June 13, 2
2017-06-13
Liquid Supply Unit
App 20170113464 - Mizutani; Tadahiro ;   et al.
2017-04-27
Liquid ejecting head and liquid ejecting apparatus
Grant 9,610,770 - Naganuma , et al. April 4, 2
2017-04-04
Terminal Connection Assembly And Cartridge
App 20170085031 - Ishizawa; Taku ;   et al.
2017-03-23
Liquid Ejecting Apparatus
App 20170072696 - WATANABE; Shunsuke ;   et al.
2017-03-16
Liquid supply unit having an inclined structure for mounting an electrical contact
Grant 9,566,794 - Mizutani , et al. February 14, 2
2017-02-14
Liquid ejecting apparatus
Grant 9,533,505 - Watanabe , et al. January 3, 2
2017-01-03
Liquid ejecting head and liquid ejecting apparatus
Grant 9,434,162 - Miyata , et al. September 6, 2
2016-09-06
Liquid Ejecting Head and Liquid Ejecting Apparatus
App 20160250852 - Watanabe; Shunsuke ;   et al.
2016-09-01
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20160200101 - MIYATA; Yoshinao
2016-07-14
Liquid ejecting head and liquid ejecting apparatus
Grant 9,365,041 - Watanabe , et al. June 14, 2
2016-06-14
Liquid ejecting head and liquid ejecting apparatus
Grant 9,346,266 - Miyata May 24, 2
2016-05-24
Liquid ejecting head and liquid ejecting apparatus
Grant 9,308,724 - Gao , et al. April 12, 2
2016-04-12
Liquid supply unit
Grant 9,233,546 - Oya , et al. January 12, 2
2016-01-12
Liquid Ejecting Apparatus
App 20150352848 - WATANABE; Shunsuke ;   et al.
2015-12-10
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20150321477 - GAO; Yue ;   et al.
2015-11-12
Liquid ejecting head and liquid ejecting apparatus
Grant 9,174,444 - Hirai , et al. November 3, 2
2015-11-03
Liquid ejecting apparatus
Grant 9,144,980 - Watanabe , et al. September 29, 2
2015-09-29
Liquid Supply Unit
App 20150258801 - Mizutani; Tadahiro ;   et al.
2015-09-17
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20150239248 - HIRAI; Eiju ;   et al.
2015-08-27
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20150231881 - MIYATA; Yoshinao
2015-08-20
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20150202870 - NAGANUMA; Yoichi ;   et al.
2015-07-23
Liquid Ejecting Apparatus
App 20150202875 - Watanabe; Shunsuke ;   et al.
2015-07-23
Ultrasonic Sensor And Method For Producing The Same
App 20150187347 - KOJIMA; Chikara ;   et al.
2015-07-02
Liquid Supply Unit
App 20150165776 - Oya; Shun ;   et al.
2015-06-18
Liquid ejecting head and liquid ejecting apparatus
Grant 9,050,804 - Miyata June 9, 2
2015-06-09
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20150151541 - MIYATA; Yoshinao ;   et al.
2015-06-04
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20150109375 - GAO; Yue ;   et al.
2015-04-23
Liquid ejecting head and liquid ejecting apparatus
Grant 8,944,565 - Gao , et al. February 3, 2
2015-02-03
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20140375722 - MIYATA; Yoshinao
2014-12-25
Liquid ejecting head and liquid ejecting apparatus
Grant 8,833,911 - Miyata September 16, 2
2014-09-16
Liquid Ejecting Head and Liquid Ejecting Apparatus
App 20140240409 - Watanabe; Shunsuke ;   et al.
2014-08-28
Liquid ejecting head and liquid ejecting apparatus
Grant 8,757,782 - Watanabe , et al. June 24, 2
2014-06-24
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20140043397 - MIYATA; Yoshinao
2014-02-13
Liquid ejecting head and liquid ejecting apparatus
Grant 8,596,767 - Miyata December 3, 2
2013-12-03
Liquid ejection head wiring member and liquid ejection head
Grant 8,573,746 - Miyata November 5, 2
2013-11-05
Liquid Ejecting Head and Liquid Ejecting Apparatus
App 20130127956 - Watanabe; Shunsuke ;   et al.
2013-05-23
Liquid ejecting head and method of inspecting liquid ejecting head
Grant 8,393,717 - Owaki , et al. March 12, 2
2013-03-12
Liquid ejecting head unit and liquid ejecting apparatus
Grant 8,371,679 - Miyata , et al. February 12, 2
2013-02-12
Liquid ejecting head
Grant 8,348,394 - Miyata January 8, 2
2013-01-08
Liquid ejecting head
Grant 8,313,175 - Miyata , et al. November 20, 2
2012-11-20
Liquid ejection head wiring member and liquid ejection head
Grant 8,313,172 - Miyata November 20, 2
2012-11-20
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20120256988 - GAO; Yue ;   et al.
2012-10-11
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20120236085 - MIYATA; Yoshinao
2012-09-20
Liquid ejection head and manufacturing method thereof
Grant 8,162,448 - Miyata April 24, 2
2012-04-24
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20120081476 - MIYATA; Yoshinao ;   et al.
2012-04-05
Liquid ejecting head, liquid ejecting apparatus, and method for manufacturing liquid ejecting head
Grant 8,141,985 - Miyata March 27, 2
2012-03-27
Liquid ejecting head and liquid ejecting apparatus
Grant 8,075,106 - Miyata , et al. December 13, 2
2011-12-13
Liquid Ejecting Head
App 20110205312 - MIYATA; Yoshinao ;   et al.
2011-08-25
Liquid Ejection Head Wiring Member And Liquid Ejection Head
App 20110205308 - MIYATA; Yoshinao
2011-08-25
Liquid Ejection Head Wiring Member And Liquid Ejection Head
App 20110205270 - MIYATA; Yoshinao
2011-08-25
Liquid Ejecting Head
App 20110199437 - MIYATA; Yoshinao
2011-08-18
Liquid injecting head, method of manufacturing liquid injecting head, and liquid injecting device
Grant 7,891,782 - Owaki , et al. February 22, 2
2011-02-22
Liquid Ejecting Head And Method Of Inspecting Liquid Ejecting Head
App 20110032310 - OWAKI; Hiroshige ;   et al.
2011-02-10
Method for manufacturing liquid jet head
Grant 7,841,085 - Miyata , et al. November 30, 2
2010-11-30
Method for dividing wafer, method for manufacturing silicon devices, and method for manufacturing liquid ejecting heads
Grant 7,829,446 - Takahashi , et al. November 9, 2
2010-11-09
Liquid Ejecting Head Unit And Liquid Ejecting Apparatus
App 20100171794 - Miyata; Yoshinao ;   et al.
2010-07-08
Liquid Ejecting Head, Liquid Ejecting Apparatus, And Method For Manufacturing Liquid Ejecting Head
App 20100134564 - Miyata; Yoshinao
2010-06-03
Method of processing silicon wafer and method of manufacturing liquid ejecting head
Grant 7,659,128 - Miyata February 9, 2
2010-02-09
Liquid Injecting Head, Method Of Manufacturing Liquid Injecting Head, And Liquid Injecting Device
App 20090237464 - OWAKI; Hiroshige ;   et al.
2009-09-24
Liquid-jet head unit and liquid-jet apparatus
Grant 7,585,046 - Miyata September 8, 2
2009-09-08
Liquid Ejection Head And Manufacturing Method Thereof
App 20090207212 - Miyata; Yoshinao
2009-08-20
Liquid Ejecting Head And Liquid Ejecting Apparatus
App 20090201346 - MIYATA; Yoshinao ;   et al.
2009-08-13
Liquid-jet head and liquid-jet apparatus
Grant 7,553,003 - Takahashi , et al. June 30, 2
2009-06-30
Liquid-jet head and liquid-jet apparatus
Grant 7,537,313 - Miyata May 26, 2
2009-05-26
Method Of Processing Silicon Wafer And Method Of Manufacturing Liquid Ejecting Head
App 20080233713 - Miyata; Yoshinao
2008-09-25
Bonding structure, actuator device and liquid-jet head
Grant 7,399,061 - Owaki , et al. July 15, 2
2008-07-15
Method For Dividing Wafer, Method For Manufacturing Silicon Devices, And Method For Manufacturing Liquid Ejecting Heads
App 20080113459 - TAKAHASHI; Wataru ;   et al.
2008-05-15
Liquid-jet head and liquid-jet apparatus
Grant 7,239,070 - Shimada , et al. July 3, 2
2007-07-03
Method For Manufacturing Liquid Jet Head
App 20070074394 - Miyata; Yoshinao ;   et al.
2007-04-05
Liquid-jet head and liquid-jet apparatus
App 20070035589 - Takahashi; Tomoaki ;   et al.
2007-02-15
Liquid jet head and liquid jet apparatus
Grant 7,152,963 - Owaki , et al. December 26, 2
2006-12-26
Method of manufacturing an ink jet print head
Grant 7,153,442 - Furuhata , et al. December 26, 2
2006-12-26
Liquid-jet head unit and liquid-jet apparatus
App 20060221116 - Miyata; Yoshinao
2006-10-05
Liquid-jet head and liquid-jet apparatus
App 20060192817 - Miyata; Yoshinao
2006-08-31
Liquid-jet head and liquid-jet apparatus
App 20060176343 - Shimada; Masato ;   et al.
2006-08-10
Bonding structure, actuator device and liquid-jet head
App 20060077227 - Owaki; Hiroshige ;   et al.
2006-04-13
Ink jet recording head and ink jet recording apparatus comprising the same
Grant 6,966,635 - Miyata , et al. November 22, 2
2005-11-22
Method of manufacturing silicon device, method of manufacturing liquid jet head and liquid jet head
Grant 6,959,490 - Miyata November 1, 2
2005-11-01
Small-sized liquid-jet head and liquid-jet apparatus with increased number of arrays of nozzle orifices
Grant 6,886,923 - Miyata May 3, 2
2005-05-03
Silicon wafer break pattern, silicon substrate, and method of generating silicon wafer break pattern
Grant 6,878,609 - Wanibe , et al. April 12, 2
2005-04-12
Ink-jet recording head having a vibration plate prevented from being damaged and ink-jet recording apparatus for using the same
Grant 6,869,170 - Shimada , et al. March 22, 2
2005-03-22
Liquid jet head and liquid jet apparatus
App 20050046678 - Owaki, Hiroshige ;   et al.
2005-03-03
Method of manufacturing an ink jet print head
App 20050006338 - Furuhata, Yutaka ;   et al.
2005-01-13
Liquid-jet head and liquid-jet apparatus
Grant 6,840,601 - Miyata January 11, 2
2005-01-11
Liquid-jet head and liquid-jet apparatus
Grant 6,820,969 - Miyata November 23, 2
2004-11-23
Liquid-jet head and liquid-jet apparatus
Grant 6,796,640 - Miyata September 28, 2
2004-09-28
Method of manufacturing an ink jet print head
Grant 6,789,319 - Furuhata , et al. September 14, 2
2004-09-14
Ink-jet recording head inkjet recording apparatus
Grant 6,764,167 - Shimada , et al. July 20, 2
2004-07-20
Silicon wafer break pattern, silicon substrate, and method of generating silicon wafer break pattern
App 20040121560 - Wanibe, Akihisa ;   et al.
2004-06-24
Method of manufacturing silicon device, method of manufacturing liquid jet head and liquid jet head
App 20040085410 - Miyata, Yoshinao
2004-05-06
Silicon wafer break pattern, silicon substrate
Grant 6,699,552 - Wanibe , et al. March 2, 2
2004-03-02
Liquid-jet head and liquid-jet apparatus
App 20040001122 - Miyata, Yoshinao
2004-01-01
Liquid-jet head and liquid-jet apparatus
App 20030218657 - Miyata, Yoshinao
2003-11-27
Ink-jet recording head inkjet recording apparatus
App 20030214561 - Shimada, Masato ;   et al.
2003-11-20
Liquid-jet head and liquid-jet apparatus
App 20030214564 - Miyata, Yoshinao
2003-11-20
Ink jet recording head and ink jet recording apparatus comprising the same
App 20030206218 - Miyata, Yoshinao ;   et al.
2003-11-06
Ink jet recording head and ink jet recording apparatus comprising the same
Grant 6,616,270 - Miyata , et al. September 9, 2
2003-09-09
Liquid-jet head and liquid-jet apparatus
App 20030117464 - Miyata, Yoshinao
2003-06-26
Ink jet recording head and ink jet recording apparatus comprising the same
Grant 6,502,928 - Shimada , et al. January 7, 2
2003-01-07
Ink jet recording head, method for manufacturing the same, and ink jet recorder
Grant 6,502,930 - Shimada , et al. January 7, 2
2003-01-07
Silicon wafer break pattern, silicon substrate, and method of generating silicon wafer break pattern
App 20020164874 - Wanibe, Akihisa ;   et al.
2002-11-07
Ink-jet recording head and ink-jet recording apparatus
App 20020085065 - Shimada, Masato ;   et al.
2002-07-04
Ink-jet recording head and ink-jet recording apparatus
App 20020051040 - Shimada, Masato ;   et al.
2002-05-02
Ink-jet recording head and ink-jet recording apparatus
Grant 6,378,996 - Shimada , et al. April 30, 2
2002-04-30
Ink-jet recording head, method of manufacturing the same, and ink-jet recording apparatus
App 20020012029 - Miyata, Yoshinao
2002-01-31
Ink jet recording head and ink jet recording apparatus
Grant 6,336,717 - Shimada , et al. January 8, 2
2002-01-08
Ink jet printing head and method of manufacturing the same
App 20010040609 - Furuhata, Yutaka ;   et al.
2001-11-15
Micro device, ink-jet printing head, method of manufacturing them and ink-jet recording device
App 20010010529 - Furuhata, Yutaka ;   et al.
2001-08-02
Method for manufacturing an ink-jet head having nozzle openings with a constant width
Grant 6,238,585 - Miyata May 29, 2
2001-05-29
Ink jet print head and a method of manufacturing the same
Grant 6,109,738 - Miyata , et al. August 29, 2
2000-08-29
Ink-jet printing head and ink-jet printing apparatus using same
Grant 5,984,459 - Takahashi , et al. November 16, 1
1999-11-16
Ink jet recording head with pressure chambers arranged along a 112 lattice orientation in a single-crystal silicon substrate
Grant 5,754,205 - Miyata , et al. May 19, 1
1998-05-19

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