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Module And Mounted Structure Using The Same
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Module and mounted structure using the same
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Shock Eliminating Sheet And Electronic Appliance Making Use Of The Same
App 20090047470 - Kuwajima; Hideki ; et al. | 2009-02-19 |
Module and Mounted Structure Using the Same
App 20080048307 - Nakatani; Seiichi ; et al. | 2008-02-28 |
Electronic part, and electronic part mounting element and an process for manufacturing such the articles
Grant 7,151,306 - Kitae , et al. December 19, 2 | 2006-12-19 |
Electronic part, and electronic part mounting element and an process for manufacturing such the articles
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Electronic part, an electronic part mounting element and a process for manufacturing such the articles
Grant 6,853,074 - Kitae , et al. February 8, 2 | 2005-02-08 |
Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
Grant 6,814,893 - Takezawa , et al. November 9, 2 | 2004-11-09 |
Semiconductor device including a wiring board with a three-dimensional wiring pattern
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Semiconductor device including wiring board with three dimensional wiring pattern
Grant 6,756,663 - Shiraishi , et al. June 29, 2 | 2004-06-29 |
Conductive adhesive and connection structure using the same
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Method for producing mounting structure for an electronic component
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Electronic component mounted member and repair method thereof
Grant 6,675,474 - Mitani , et al. January 13, 2 | 2004-01-13 |
Conductive adhesive and packaging structure using the same
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Mounting structure for an electronic component and method for producing the same
App 20030207073 - Takezawa, Hiroaki ; et al. | 2003-11-06 |
Conductive adhesive agent, packaging structure, and method for manufacturing the same structure
Grant 6,620,345 - Takezawa , et al. September 16, 2 | 2003-09-16 |
Conductive adhesive and connection structure using the same
App 20030127632 - Takezawa, Hiroaki ; et al. | 2003-07-10 |
Conductive adhesive and packaging structure using the same
App 20030116756 - Takezawa, Hiroaki ; et al. | 2003-06-26 |
Semiconductor device and module of the same
App 20030094685 - Shiraishi, Tsukasa ; et al. | 2003-05-22 |
Semiconductor device including a wiring board and semiconductor elements mounted thereon
Grant 6,525,414 - Shiraishi , et al. February 25, 2 | 2003-02-25 |
Conductive adhesive and connection structure using the same
Grant 6,521,144 - Takezawa , et al. February 18, 2 | 2003-02-18 |
Electronic component mounted member and repair method thereof
Grant 6,512,183 - Mitani , et al. January 28, 2 | 2003-01-28 |
Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
Grant 6,510,059 - Mitani , et al. January 21, 2 | 2003-01-21 |
Conductive resin, electronic module using conductive resin, and method of manufacturing electronic module
App 20020185306 - Mitani, Tsutomu ; et al. | 2002-12-12 |
Conductive adhesive, apparatus for mounting electronic component, and method for mounting the same
App 20020158232 - Mitani, Tsutomu ; et al. | 2002-10-31 |
Electronic component mounted member and repair method thereof
App 20020062988 - Mitani, Tsutomu ; et al. | 2002-05-30 |
Conductive adhesive agent, packaging structrue, and method for manufacturing the same structure
App 20020050643 - Takezawa, Hiroaki ; et al. | 2002-05-02 |
Conductive adhesive and packaging structure using the same
App 20020043652 - Takezawa, Hiroaki ; et al. | 2002-04-18 |
Mounting structure for an electronic component and method for producing the same
App 20020034620 - Takezawa, Hiroaki ; et al. | 2002-03-21 |
Conductive adhesive and connection structure using the same
App 20010015424 - Takezawa, Hiroaki ; et al. | 2001-08-23 |
Electronic part, an electronic part mounting element and an process for manufacturing such the articles
App 20010005053 - Kitae, Takashi ; et al. | 2001-06-28 |
Semiconductor device and module of the same
App 20010002727 - Shiraishi, Tsukasa ; et al. | 2001-06-07 |
Substrate on which bumps are formed and method of forming the same
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Method of synthesizing diamond-like carbon thin films
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Plasma CVD apparatus and method therefor
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Method of and apparatus for synthesizing diamondlike thin film
Grant 5,203,924 - Mitani , et al. April 20, 1 | 1993-04-20 |
Photosensitive element used in electrophotography
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Magnetic recording medium
Grant 4,833,031 - Kurokawa , et al. May 23, 1 | 1989-05-23 |
Magnetic recording media
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Plasma CVD apparatus and method for forming a diamond like carbon film
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