Patent | Date |
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Chemical Planarization App 20200365412 - Misra; Sudhanshu ;   et al. | 2020-11-19 |
Customized polishing pads for CMP and methods of fabrication and use thereof Grant 10,220,487 - Roy , et al. | 2019-03-05 |
Customized Polishing Pads For Cmp And Methods Of Fabrication And Use Thereof App 20160229025 - ROY; Pradip K. ;   et al. | 2016-08-11 |
Grooved CMP pads Grant 9,375,823 - Kerprich , et al. June 28, 2 | 2016-06-28 |
Customized polishing pads for CMP and methods of fabrication and use thereof Grant 9,278,424 - Roy , et al. March 8, 2 | 2016-03-08 |
Polishing systems Grant 9,272,388 - Misra March 1, 2 | 2016-03-01 |
Grooved Cmp Pads App 20160023321 - Kerprich; Robert ;   et al. | 2016-01-28 |
Grooved CMP pad Grant 9,180,570 - Kerprich , et al. November 10, 2 | 2015-11-10 |
Customized Polishing Pads For Cmp And Methods Of Fabrication And Use Thereof App 20150065020 - Roy; Pradip K. ;   et al. | 2015-03-05 |
Customized polishing pads for CMP and methods of fabrication and use thereof Grant 8,864,859 - Roy , et al. October 21, 2 | 2014-10-21 |
Customized polishing pads for CMP and methods of fabrication and use thereof Grant 8,715,035 - Roy , et al. May 6, 2 | 2014-05-06 |
Polishing Systems App 20130149945 - Misra; Sudhanshu | 2013-06-13 |
Polishing systems Grant 8,383,003 - Misra February 26, 2 | 2013-02-26 |
Customized polish pads for chemical mechanical planarization Grant 8,380,339 - Misra , et al. February 19, 2 | 2013-02-19 |
Customized Polish Pads For Chemical Mechanical Planarization App 20100273398 - Misra; Sudhanshu ;   et al. | 2010-10-28 |
Customized polish pads for chemical mechanical planarization Grant 7,704,122 - Misra , et al. April 27, 2 | 2010-04-27 |
Customized polishing pads for CMP and methods of fabrication and use thereof Grant 7,704,125 - Roy , et al. April 27, 2 | 2010-04-27 |
Polishing systems App 20090318063 - Misra; Sudhanshu | 2009-12-24 |
Grooved CMP pad App 20090311955 - Kerprich; Robert ;   et al. | 2009-12-17 |
Customized Polishing Pads for CMP and Methods of Fabrication and Use Thereof App 20090053976 - Roy; Pradip K. ;   et al. | 2009-02-26 |
Customized polish pads for chemical mechanical planarization Grant 7,425,172 - Misra , et al. September 16, 2 | 2008-09-16 |
Customized polishing pads for CMP and methods of fabrication and use thereof App 20080207100 - Roy; Pradip K. ;   et al. | 2008-08-28 |
Customized polish pads for chemical mechanical planarization App 20080090498 - Misra; Sudhanshu ;   et al. | 2008-04-17 |
Customized polishing pads for CMP and methods of fabrication and use thereof App 20060276109 - Roy; Pradip K. ;   et al. | 2006-12-07 |
Customized polishing pads for CMP and methods of fabrication and use thereof App 20060189269 - Roy; Pradip K. ;   et al. | 2006-08-24 |
Customized polish pads for chemical mechanical planarization App 20050009448 - Misra, Sudhanshu ;   et al. | 2005-01-13 |
Semiconductor device having an interconnect layer with a plurality of layout regions having substantially uniform densities of active interconnects and dummy fills Grant 6,683,382 - Cwynar , et al. January 27, 2 | 2004-01-27 |
Pad for chemical mechanical polishing Grant 6,659,846 - Misra , et al. December 9, 2 | 2003-12-09 |
Non-hydrolytic-sol-gel process for high K dielectric Grant 6,616,965 - Misra , et al. September 9, 2 | 2003-09-09 |
Chemical mechanical polishing composition and method of polishing metal layers using same Grant 6,599,837 - Merchant , et al. July 29, 2 | 2003-07-29 |
Method for chemical/mechanical planarization of a semiconductor wafer having dissimilar metal pattern densities Grant 6,596,639 - Easter , et al. July 22, 2 | 2003-07-22 |
Composite polishing pads for chemical-mechanical polishing Grant 6,544,107 - Misra , et al. April 8, 2 | 2003-04-08 |
Process for making mixed metal oxides Grant 6,540,974 - Misra , et al. April 1, 2 | 2003-04-01 |
Pad for chemical mechanical polishing App 20030054735 - Misra, Sudhanshu ;   et al. | 2003-03-20 |
Method for making an interconnect layer and a semiconductor device including the same App 20020162082 - Cwynar, Donald Thomas ;   et al. | 2002-10-31 |
Local area alloying for preventing dishing of copper during chemical-mechanical polishing (CMP) Grant 6,461,225 - Misra , et al. October 8, 2 | 2002-10-08 |
Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method Grant 6,458,016 - Merchant , et al. October 1, 2 | 2002-10-01 |
Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method Grant 6,439,972 - Misra , et al. August 27, 2 | 2002-08-27 |
Composite polishing pads for chemical-mechanical polishing App 20020115385 - Misra, Sudhanshu ;   et al. | 2002-08-22 |
Method for making an interconnect layer and a semiconductor device including the same Grant 6,436,807 - Cwynar , et al. August 20, 2 | 2002-08-20 |
Silicon carbide barrier layers for porous low dielectric constant materials Grant 6,410,419 - Merchant , et al. June 25, 2 | 2002-06-25 |
Polishing pads from closed-cell elastomer foam Grant 6,368,200 - Merchant , et al. April 9, 2 | 2002-04-09 |
CMP system and slurry for polishing semiconductor wafers and related method Grant 6,364,744 - Merchant , et al. April 2, 2 | 2002-04-02 |
In-situ electroplated oxide passivating film for corrosion inhibition App 20020030282 - Merchant, Sailesh Mansinh ;   et al. | 2002-03-14 |
Colloidal suspension of abrasive particles containing magnesium as CMP slurry Grant 6,319,095 - Merchant , et al. November 20, 2 | 2001-11-20 |
Thin film deposition of mixed metal oxides App 20010040785 - Misra, Sudhanshu ;   et al. | 2001-11-15 |
Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method App 20010036795 - Merchant, Sailesh Mansinh ;   et al. | 2001-11-01 |
Polishing fluid, polishing method, semiconductor device and semiconductor device fabrication method App 20010036796 - Misra, Sudhanshu ;   et al. | 2001-11-01 |
Method of making a semiconductor with copper passivating film Grant 6,114,234 - Merchant , et al. September 5, 2 | 2000-09-05 |
Silicon carbide barrier layers for porous low dielectric constant materials Grant 6,100,587 - Merchant , et al. August 8, 2 | 2000-08-08 |
Method of passivating copper interconnects in a semiconductor Grant 6,071,808 - Merchant , et al. June 6, 2 | 2000-06-06 |