| Patent | Date |
|---|
Metal Pads Over Tsv
App 20220302058 - Gao; Guilian ; et al. | 2022-09-22 |
Direct Bonded Stack Structures For Increased Reliability And Improved Yield In Microelectronics
App 20220293567 - Uzoh; Cyprian Emeka ; et al. | 2022-09-15 |
Microelectronic Assembly From Processed Substrate
App 20220285213 - Uzoh; Cyprian Emeka ; et al. | 2022-09-08 |
Contact Structures For Direct Bonding
App 20220285303 - Mirkarimi; Laura Wills ; et al. | 2022-09-08 |
Mitigating Surface Damage Of Probe Pads In Preparation For Direct Bonding Of A Substrate
App 20220285236 - Gao; Guilian ; et al. | 2022-09-08 |
Large metal pads over TSV
Grant 11,393,779 - Gao , et al. July 19, 2 | 2022-07-19 |
Microelectronic assembly from processed substrate
Grant 11,367,652 - Uzoh , et al. June 21, 2 | 2022-06-21 |
Mitigating surface damage of probe pads in preparation for direct bonding of a substrate
Grant 11,355,404 - Gao , et al. June 7, 2 | 2022-06-07 |
Low Temperature Bonded Structures
App 20220165692 - UZOH; Cyprian Emeka ; et al. | 2022-05-26 |
Direct Bonding Methods And Structures
App 20220139869 - Gao; Guilian ; et al. | 2022-05-05 |
Interconnect Structures And Methods For Forming Same
App 20220130714 - Uzoh; Cyprian Emeka ; et al. | 2022-04-28 |
Direct bonded stack structures for increased reliability and improved yield in microelectronics
Grant 11,296,053 - Uzoh , et al. April 5, 2 | 2022-04-05 |
Low temperature bonded structures
Grant 11,244,916 - Uzoh , et al. February 8, 2 | 2022-02-08 |
Layer Structures For Making Direct Metal-to-metal Bonds At Low Temperatures In Microelectronics
App 20220005784 - Gao; Guilian ; et al. | 2022-01-06 |
Interconnect structures and methods for forming same
Grant 11,195,748 - Uzoh , et al. December 7, 2 | 2021-12-07 |
Techniques For Processing Devices
App 20210375850 - Uzoh; Cyprian Emeka ; et al. | 2021-12-02 |
Dimension Compensation Control For Directly Bonded Structures
App 20210296282 - Gao; Guilian ; et al. | 2021-09-23 |
Structures For Bonding Elements
App 20210265227 - Katkar; Rajesh ; et al. | 2021-08-26 |
Techniques for processing devices
Grant 11,037,919 - Uzoh , et al. June 15, 2 | 2021-06-15 |
Layer structures for making direct metal-to-metal bonds at low temperatures in microelectronics
Grant 11,011,494 - Gao , et al. May 18, 2 | 2021-05-18 |
Bonded structures
Grant 11,004,757 - Katkar , et al. May 11, 2 | 2021-05-11 |
Processed Stacked Dies
App 20210104487 - UZOH; Cyprian EMEKA ; et al. | 2021-04-08 |
Direct Gang Bonding Methods And Structures
App 20210098412 - Haba; Belgacem ; et al. | 2021-04-01 |
Direct Bonded Stack Structures For Increased Reliability And Improved Yield In Microelectronics
App 20200411483 - Uzoh; Cyprian Emeka ; et al. | 2020-12-31 |
Processed stacked dies
Grant 10,879,212 - Uzoh , et al. December 29, 2 | 2020-12-29 |
Sealed Bonded Structures And Methods For Forming The Same
App 20200395321 - Katkar; Rajesh ; et al. | 2020-12-17 |
Low Temperature Bonded Structures
App 20200381389 - UZOH; Cyprian Emeka ; et al. | 2020-12-03 |
Techniques For Processing Devices
App 20200365575 - UZOH; Cyprian Emeka ; et al. | 2020-11-19 |
Mitigating Surface Damage Of Probe Pads In Preparation For Direct Bonding Of A Substrate
App 20200335408 - Gao; Guilian ; et al. | 2020-10-22 |
Low temperature bonded structures
Grant 10,790,262 - Uzoh , et al. September 29, 2 | 2020-09-29 |
Microelectronic Assembly From Processed Substrate
App 20200243380 - UZOH; Cyprian Emeka ; et al. | 2020-07-30 |
Techniques for processing devices
Grant 10,727,219 - Uzoh , et al. | 2020-07-28 |
Microelectronic assembly from processed substrate
Grant 10,672,654 - Uzoh , et al. | 2020-06-02 |
Selective recess
Grant 10,658,313 - Delacruz , et al. | 2020-05-19 |
Interconnection substrates for interconnection between circuit modules, and methods of manufacture
Grant 10,586,759 - Shen , et al. | 2020-03-10 |
Layer Structures For Making Direct Metal-to-metal Bonds At Low Temperatures In Microelectronics
App 20200075534 - GAO; Guilian ; et al. | 2020-03-05 |
Low Temperature Bonded Structures
App 20200051937 - UZOH; Cyprian Emeka ; et al. | 2020-02-13 |
Techniques For Joining Dissimilar Materials In Microelectronics
App 20200013765 - FOUNTAIN, Jr.; Gaius Gillman ; et al. | 2020-01-09 |
Tsv As Pad
App 20190385935 - GAO; Guilian ; et al. | 2019-12-19 |
Large Metal Pads Over Tsv
App 20190385966 - GAO; Guilian ; et al. | 2019-12-19 |
Structures For Bonding Elements
App 20190348336 - Katkar; Rajesh ; et al. | 2019-11-14 |
Low Temperature Bonded Structures
App 20190319007 - UZOH; Cyprian Emeka ; et al. | 2019-10-17 |
Interposers with electrically conductive features having different porosities
Grant 10,440,822 - Lee , et al. O | 2019-10-08 |
Techniques For Processing Devices
App 20190252364 - UZOH; Cyprian Emeka ; et al. | 2019-08-15 |
Selective Recess
App 20190181107 - DELACRUZ; Javier A. ; et al. | 2019-06-13 |
Interconnect Structures And Methods For Forming Same
App 20190096741 - Uzoh; Cyprian Emeka ; et al. | 2019-03-28 |
Interconnection Substrates for Interconnection Between Circuit Modules, and Methods of Manufacture
App 20180337118 - Shen; Hong ; et al. | 2018-11-22 |
Processed stacked dies
App 20180331066 - UZOH; Cyprian Emeka ; et al. | 2018-11-15 |
Bonded Structures With Integrated Passive Component
App 20180190580 - Haba; Belgacem ; et al. | 2018-07-05 |
Bonded Structures With Integrated Passive Component
App 20180190583 - DeLaCruz; Javier A. ; et al. | 2018-07-05 |
Interconnection substrates for interconnection between circuit modules, and methods of manufacture
Grant 10,014,243 - Shen , et al. July 3, 2 | 2018-07-03 |
Microelectronic assembly from processed substrate
App 20180182666 - UZOH; Cyprian Emeka ; et al. | 2018-06-28 |
Processed Substrate
App 20180182665 - UZOH; Cyprian Emeka ; et al. | 2018-06-28 |
Wafer-level packaging using wire bond wires in place of a redistribution layer
Grant 10,008,469 - Katkar , et al. June 26, 2 | 2018-06-26 |
Off-chip vias in stacked chips
Grant 9,899,353 - Haba , et al. February 20, 2 | 2018-02-20 |
Integrated circuit assemblies with reinforcement frames, and methods of manufacture
Grant 9,887,166 - Katkar , et al. February 6, 2 | 2018-02-06 |
Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields
App 20170374738 - Lee; Bong-Sub ; et al. | 2017-12-28 |
Fan-out wafer-level packaging using metal foil lamination
Grant 9,847,238 - Li , et al. December 19, 2 | 2017-12-19 |
Interposers
Grant 9,769,923 - Lee , et al. September 19, 2 | 2017-09-19 |
Fan-Out Wafer-Level Packaging Using Metal Foil Lamination
App 20170170031 - Li; Xuan ; et al. | 2017-06-15 |
Fan-out wafer-level packaging using metal foil lamination
Grant 9,646,946 - Li , et al. May 9, 2 | 2017-05-09 |
Interconnection Substrates For Interconnection Between Circuit Modules, And Methods Of Manufacture
App 20170125331 - SHEN; Hong ; et al. | 2017-05-04 |
Fan-out Wafer-level Packaging Using Metal Foil Lamination
App 20170103957 - Li; Xuan ; et al. | 2017-04-13 |
Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields
App 20170099733 - Lee; Bong-Sub ; et al. | 2017-04-06 |
Wafer-level Packaging Using Wire Bond Wires In Place Of A Redistribution Layer
App 20170069591 - Katkar; Rajesh ; et al. | 2017-03-09 |
Multi-layer substrates suitable for interconnection between circuit modules
Grant 9,583,426 - Shen , et al. February 28, 2 | 2017-02-28 |
Method for fabrication of interconnection circuitry with electrically conductive features passing through a support and comprising core portions formed using nanoparticle-containing inks
Grant 9,570,385 - Lee , et al. February 14, 2 | 2017-02-14 |
Wafer level packages with mechanically decoupled fan-in and fan-out areas
Grant 9,543,277 - Lee , et al. January 10, 2 | 2017-01-10 |
Wafer-level packaging using wire bond wires in place of a redistribution layer
Grant 9,502,372 - Katkar , et al. November 22, 2 | 2016-11-22 |
Interconnect structure
Grant 9,496,236 - Gupta , et al. November 15, 2 | 2016-11-15 |
Wafer-level Packaging Using Wire Bond Wires In Place Of A Redistribution Layer
App 20160322326 - KATKAR; Rajesh ; et al. | 2016-11-03 |
Integrated Circuit Assemblies With Reinforcement Frames, And Methods Of Manufacture
App 20160276294 - KATKAR; Rajesh ; et al. | 2016-09-22 |
Interposers And Fabrication Methods That Use Nanoparticle Inks And Magnetic Fields
App 20160218057 - Lee; Bong-Sub ; et al. | 2016-07-28 |
Integrated circuit assemblies with reinforcement frames, and methods of manufacture
Grant 9,355,997 - Katkar , et al. May 31, 2 | 2016-05-31 |
Substrates And Methods Of Manufacture
App 20160126174 - Shen; Hong ; et al. | 2016-05-05 |
Off-chip Vias In Stacked Chips
App 20150333042 - Haba; Belgacem ; et al. | 2015-11-19 |
Integrated Circuit Assemblies With Reinforcement Frames, And Methods Of Manufacture
App 20150262972 - KATKAR; Rajesh ; et al. | 2015-09-17 |
Off-chip vias in stacked chips
Grant 9,048,234 - Haba , et al. June 2, 2 | 2015-06-02 |
Interconnect Structure
App 20150014850 - Gupta; Debabrata ; et al. | 2015-01-15 |
Reconstituted wafer stack packaging with after-applied pad extensions
Grant 8,883,562 - Haba , et al. November 11, 2 | 2014-11-11 |
Reconstituted Wafer Stack Packaging With After-applied Pad Extensions
App 20130344652 - Haba; Belgacem ; et al. | 2013-12-26 |
Off-chip Vias In Stacked Chips
App 20130273693 - Haba; Belgacem ; et al. | 2013-10-17 |
Off-chip VIAS in stacked chips
Grant 8,476,774 - Haba , et al. July 2, 2 | 2013-07-02 |
Off-chip Vias In Stacked Chips
App 20120080807 - Haba; Belgacem ; et al. | 2012-04-05 |
Reconstituted wafer level stacking
Grant 7,901,989 - Haba , et al. March 8, 2 | 2011-03-08 |
Off-chip Vias In Stacked Chips
App 20110049696 - Haba; Belgacem ; et al. | 2011-03-03 |
Reconstituted Wafer Level Stacking
App 20090160065 - Haba; Belgacem ; et al. | 2009-06-25 |
Photonic crystal sensors
Grant 7,489,846 - Grot , et al. February 10, 2 | 2009-02-10 |
Method for etching smooth sidewalls in III-V based compounds for electro-optical devices
Grant 7,196,017 - Mirkarimi , et al. March 27, 2 | 2007-03-27 |
Photonic crystal optical temperature measuring system
App 20060067605 - Mirkarimi; Laura Wills ; et al. | 2006-03-30 |
Apparatus for single nanoparticle detection
App 20050201660 - Grot, Annette C. ; et al. | 2005-09-15 |
Photonic crystal sensors
App 20050200942 - Grot, Annette ; et al. | 2005-09-15 |
Method for etching high aspect ratio features in III-V based compounds for optoelectronic devices
App 20050164504 - Mirkarimi, Laura Wills | 2005-07-28 |
Method for etching smooth sidewalls in III-V based compounds for electro-optical devices
App 20050090116 - Mirkarimi, Laura Wills ; et al. | 2005-04-28 |
Post-etch cleaning treatment
Grant 6,692,976 - Mirkarimi , et al. February 17, 2 | 2004-02-17 |
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