Meyer-Berg; Georg

Patent Applications and Registrations

Patent applications and USPTO patent grants for Meyer-Berg; Georg.The latest application filed is for "semiconductor device including an antenna".

Company Profile

11.73.78

Meyer-Berg; Georg - Muenchen DE
Meyer-Berg; Georg - Munich DE
Meyer-Berg; Georg - Munchen DE
Meyer-Berg; Georg - Muchen DE

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Semiconductor Device Including An Antenna App 20220148951 - Huynh; Ngoc-Hoa ; et al.	2022-05-12
Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module Grant 11,322,451 - Hohlfeld , et al. May 3, 2	2022-05-03
Semiconductor Device App 20220108966 - KUTTER; Christoph ; et al.	2022-04-07
Semiconductor device Grant 11,233,027 - Kutter , et al. January 25, 2	2022-01-25
Semiconductor device including an antenna Grant 11,195,787 - Huynh , et al. December 7, 2	2021-12-07
Method and Structure for Supporting Thin Semiconductor Chips with a Metal Carrier App 20200395334 - Mahler; Joachim ; et al.	2020-12-17
Chip package with cross-linked thermoplastic dielectric Grant 10,854,547 - Mahler , et al. December 1, 2	2020-12-01
Semiconductor Device App 20200266166 - Kutter; Christoph ; et al.	2020-08-20
Metallic interconnect, a method of manufacturing a metallic interconnect, a semiconductor arrangement and a method of manufacturing a semiconductor arrangement Grant 10,734,352 - Escher-Poeppel , et al.	2020-08-04
Semiconductor device Grant 10,679,959 - Kutter , et al.	2020-06-09
Method for handling a product substrate and a bonded substrate system Grant 10,600,690 - Meyer-Berg , et al.	2020-03-24
Semiconductor device Grant 10,529,678 - Kutter , et al. J	2020-01-07
Chip package and a wafer level package Grant 10,522,447 - Meyer-Berg Dec	2019-12-31
Cross-linked Thermoplastic Dielectric For Chip Package App 20190287907 - Mahler; Joachim ; et al.	2019-09-19
Power Semiconductor Module Having a Direct Copper Bonded Substrate and an Integrated Passive Component, and an Integrated Power App 20190221521 - Hohlfeld; Olaf ; et al.	2019-07-18
Semiconductor die attach system and method Grant 10,297,564 - Mahler , et al.	2019-05-21
Semiconductor Device App 20190123009 - Kutter; Christoph ; et al.	2019-04-25
Semiconductor Die Attach System and Method App 20190109112 - Mahler; Joachim ; et al.	2019-04-11
Metallic Interconnect, a Method of Manufacturing a Metallic Interconnect, a Semiconductor Arrangement and a Method of Manufacturing a Semiconductor Arrangement App 20190103378 - Escher-Poeppel; Irmgard ; et al.	2019-04-04
Power semiconductor module having a direct copper bonded substrate and an integrated passive component, and an integrated power module Grant 10,211,158 - Hohlfeld , et al. Feb	2019-02-19
Attaching chip attach medium to already encapsulated electronic chip Grant 10,177,112 - Mahler , et al. J	2019-01-08
Method for Handling a Product Substrate and a Bonded Substrate System App 20180350683 - Meyer-Berg; Georg ; et al.	2018-12-06
Method of manufacturing a semiconductor component and semiconductor component Grant 10,121,690 - Meyer-Berg , et al. November 6, 2	2018-11-06
Semiconductor package with interlocked connection Grant 10,090,216 - Meyer-Berg , et al. October 2, 2	2018-10-02
Method for handling a product substrate, a bonded substrate system and a temporary adhesive Grant 10,056,295 - Meyer-Berg , et al. August 21, 2	2018-08-21
Arrangement of multiple power semiconductor chips and method of manufacturing the same Grant 10,049,962 - Meyer-Berg , et al. August 14, 2	2018-08-14
Chip Package And A Wafer Level Package App 20180158759 - MEYER-BERG; Georg	2018-06-07
Chip package and a wafer level package Grant 9,917,036 - Meyer-Berg March 13, 2	2018-03-13
Apparatus for determining a state of a rechargeable battery or of a battery, a rechargeable battery or a battery, and a method for determining a state of a rechargeable battery or of a battery Grant 9,748,611 - Elian , et al. August 29, 2	2017-08-29
Semiconductor Device Including An Antenna App 20170236776 - Huynh; Ngoc-Hoa ; et al.	2017-08-17
Attaching chip attach medium to already encapsulated electronic chip App 20170221857 - MAHLER; Joachim ; et al.	2017-08-03
Semiconductor Package With Interlocked Connection App 20170170082 - Meyer-Berg; Georg ; et al.	2017-06-15
Semiconductor device with encapsulant Grant 9,666,499 - Mahler , et al. May 30, 2	2017-05-30
Semiconductor module with interlocked connection Grant 9,627,305 - Meyer-Berg , et al. April 18, 2	2017-04-18
Device comprising a ductile layer and method of making the same Grant 9,576,867 - Meyer-Berg , et al. February 21, 2	2017-02-21
Arrangement Of Multiple Power Semiconductor Chips And Method Of Manufacturing The Same App 20160358886 - Meyer-Berg; Georg ; et al.	2016-12-08
Integrated circuit package and a method for manufacturing an integrated circuit package Grant 9,425,116 - Meyer-Berg , et al. August 23, 2	2016-08-23
Device Comprising a Ductile Layer and Method of Making the Same App 20160218044 - Meyer-Berg; Georg ; et al.	2016-07-28
Method for Handling a Product Substrate, a Bonded Substrate System and a Temporary Adhesive App 20160218039 - Meyer-Berg; Georg ; et al.	2016-07-28
Chip Package And A Wafer Level Package App 20160190044 - Meyer-Berg; Georg	2016-06-30
Method of manufacturing a semiconductor component and semiconductor component App 20160181138 - Meyer-Berg; Georg ; et al.	2016-06-23
Electronic component with sheet-like redistribution structure Grant 9,349,709 - Hoegerl , et al. May 24, 2	2016-05-24
Power Semiconductor Module Having a Direct Copper Bonded Substrate and an Integrated Passive Component, and an Integrated Power Module App 20160126192 - Hohlfeld; Olaf ; et al.	2016-05-05
Device comprising a ductile layer and method of making the same Grant 9,331,019 - Meyer-Berg , et al. May 3, 2	2016-05-03
Integrated circuit package and packaging methods Grant 9,269,685 - Meyer-Berg , et al. February 23, 2	2016-02-23
Packaged nano-structured component and method of making a packaged nano-structured component Grant 9,249,014 - Hosseini , et al. February 2, 2	2016-02-02
Chip package with passives Grant 9,190,389 - Meyer-Berg , et al. November 17, 2	2015-11-17
Packaged semiconductor device having an embedded system Grant 9,171,787 - Hosseini , et al. October 27, 2	2015-10-27
Method for fabricating an electronic component Grant 9,171,804 - Meyer-Berg , et al. October 27, 2	2015-10-27
Die arrangements containing an inductor coil and methods of manufacturing a die arrangement containing an inductor coil Grant 9,159,777 - Meyer-Berg October 13, 2	2015-10-13
Semiconductor device and method Grant 9,123,544 - Meyer-Berg , et al. September 1, 2	2015-09-01
Method for manufacturing a chip package, a method for manufacturing a wafer level package, a chip package and a wafer level package Grant 9,111,847 - Meyer-Berg August 18, 2	2015-08-18
Integrated circuit package and packaging methods Grant 9,105,562 - Meyer-Berg , et al. August 11, 2	2015-08-11
Semiconductor Device App 20150200174 - Kutter; Christoph ; et al.	2015-07-16
Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package Grant 9,082,767 - Mahler , et al. July 14, 2	2015-07-14
Chip package with embedded passive component Grant 9,070,568 - Hosseini , et al. June 30, 2	2015-06-30
Electronic component with sheet-like redistribution structure App 20150155267 - HOEGERL; Juergen ; et al.	2015-06-04
Chip arrangement and a method of manufacturing a chip arrangement Grant 9,041,226 - Steiner , et al. May 26, 2	2015-05-26
Redistribution layer and method of forming a redistribution layer App 20150115442 - MEYER-BERG; Georg ; et al.	2015-04-30
Chip Arrangement App 20150049443 - Meyer-Berg; Georg	2015-02-19
Chip Package with Passives App 20150028487 - Meyer-Berg; Georg ; et al.	2015-01-29
Chip Package with Embedded Passive Component App 20150028448 - Hosseini; Khalil ; et al.	2015-01-29
Semiconductor Module With Interlocked Connection App 20150014845 - Meyer-Berg; Georg ; et al.	2015-01-15
Apparatus For Determining A State Of A Rechargeable Battery Or Of A Battery, A Rechargeable Battery Or A Battery, And A Method For Determining A State Of A Rechargeable Battery Or Of A Battery App 20150004451 - Elian; Klaus ; et al.	2015-01-01
Packaged Semiconductor Device App 20140353808 - Hosseini; Khalil ; et al.	2014-12-04
Integrated circuit, a semiconductor die arrangement and a method for manufacturing an integrated circuit Grant 8,896,128 - Hosseini , et al. November 25, 2	2014-11-25
Chip Arrangement And A Method Of Manufacturing A Chip Arrangement App 20140264950 - Steiner; Rainer ; et al.	2014-09-18
Embedded Integrated Circuit Package And Method For Manufacturing An Embedded Integrated Circuit Package App 20140151862 - Mahler; Joachim ; et al.	2014-06-05
Device Comprising a Ductile Layer and Method of Making the Same App 20140145333 - Meyer-Berg; Georg ; et al.	2014-05-29
Method for Fabricating an Electronic Component App 20140138843 - Meyer-Berg; Georg ; et al.	2014-05-22
Integrated Circuit, A Semiconductor Die Arrangement And A Method For Manufacturing An Integrated Circuit App 20140138841 - Hosseini; Khalil ; et al.	2014-05-22
Packaged Nano-Structured Component and Method of Making a Packaged Nano-Structured Component App 20140126165 - Hosseini; Khalil ; et al.	2014-05-08
Semiconductor Device With Encapsulant App 20140117531 - MAHLER; Joachim ; et al.	2014-05-01
Electric device package comprising a laminate and method of making an electric device package comprising a laminate Grant 8,692,361 - Mahler , et al. April 8, 2	2014-04-08
Device including a semiconductor chip and metal foils Grant 8,680,668 - Meyer-Berg , et al. March 25, 2	2014-03-25
Semiconductor device and manufacturing of the semiconductor device Grant 8,669,175 - Meyer-Berg March 11, 2	2014-03-11
Sensor device and method Grant 8,652,866 - Elian , et al. February 18, 2	2014-02-18
Embedded integrated circuit package and method for manufacturing an embedded integrated circuit package Grant 8,648,456 - Mahler , et al. February 11, 2	2014-02-11
Electric Device Package Comprising a Laminate and Method of Making an Electric Device Package Comprising a Laminate App 20140027892 - Mahler; Joachim ; et al.	2014-01-30
Embedded Integrated Circuit Package And Method For Manufacturing An Embedded Integrated Circuit Package App 20140021638 - Mahler; Joachim ; et al.	2014-01-23
A Method For Manufacturing A Chip Package, A Method For Manufacturing A Wafer Level Package, A Chip Package And A Wafer Level Package App 20130334712 - Meyer-Berg; Georg	2013-12-19
Die structure, die arrangement and method of processing a die Grant 8,610,274 - Hosseini , et al. December 17, 2	2013-12-17
Chip assembly Grant 8,580,612 - Theuss , et al. November 12, 2	2013-11-12
Semiconductor package with integrated inductor Grant 8,513,771 - Elian , et al. August 20, 2	2013-08-20
Sensor Device And Method App 20130122660 - Elian; Klaus ; et al.	2013-05-16
Semiconductor Device and Method App 20130099383 - Meyer-Berg; Georg ; et al.	2013-04-25
Electronic Packaging Connector And Methods For Its Production App 20130087371 - Meyer-Berg; Georg	2013-04-11
Integrated Circuit Package And A Method For Manufacturing An Integrated Circuit Package App 20130082386 - Meyer-Berg; Georg ; et al.	2013-04-04
Device Including A Semiconductor Chip And Metal Foils App 20130069211 - Meyer-Berg; Georg ; et al.	2013-03-21
Sensor device having a structure element Grant 8,373,240 - Elian , et al. February 12, 2	2013-02-12
Encapsulated semiconductor chip with external contact pads and manufacturing method thereof Grant 8,338,231 - Meyer-Berg December 25, 2	2012-12-25
Semiconductor Device And Manufacturing Of The Semiconductor Device App 20120322210 - Meyer-Berg; Georg	2012-12-20
Integrated Circuit Package And Packaging Methods App 20120286414 - Meyer-Berg; Georg	2012-11-15
Integrated Circuit Package And Packaging Methods App 20120286413 - Meyer-Berg; Georg ; et al.	2012-11-15
Die Arrangements And Methods Of Manufacturing A Die Arrangement App 20120261796 - Meyer-Berg; Georg	2012-10-18
Device Including A Semiconductor Chip App 20120231582 - Meyer-Berg; Georg	2012-09-13
Semiconductor device package interconnections Grant 8,264,085 - Meyer-Berg September 11, 2	2012-09-11
Manufacturing of a device including a semiconductor chip Grant 8,193,040 - Meyer-Berg June 5, 2	2012-06-05
Sensor Device And Method App 20120126344 - Elian; Klaus ; et al.	2012-05-24
Device including a semiconductor chip Grant 8,183,677 - Meyer-Berg May 22, 2	2012-05-22
Die Structure, Die Arrangement And Method Of Processing A Die App 20120061835 - Hosseini; Khalil ; et al.	2012-03-15
Sensor device having a porous structure element Grant 8,124,953 - Elian , et al. February 28, 2	2012-02-28
Device including a semiconductor chip and metal foils Grant 8,124,449 - Meyer-Berg , et al. February 28, 2	2012-02-28
Semiconductor Package with Integrated Inductor App 20110298088 - Elian; Klaus ; et al.	2011-12-08
Encapsulated Semiconductor Chip with External Contact Pads and Manufacturing Method Thereof App 20110233754 - Meyer-Berg; Georg	2011-09-29
Semiconductor Device And Method For Manufacturing A Semiconductor Device App 20110227204 - Kutter; Christoph ; et al.	2011-09-22
Manufacturing of a Device Including a Semiconductor Chip App 20110193217 - Meyer-Berg; Georg	2011-08-11
Sensor Device And Method App 20100230766 - Elian; Klaus ; et al.	2010-09-16
Electronic Device and Method of Manufacturing Same App 20100207227 - Meyer-Berg; Georg	2010-08-19
Chip Assembly App 20100203676 - Theuss; Horst ; et al.	2010-08-12
Device Including A Semiconductor Chip And Metal Foils App 20100133666 - Meyer-Berg; Georg ; et al.	2010-06-03
Device Including A Semiconductor Chip App 20100127386 - Meyer-Berg; Georg	2010-05-27
Method Of Producing Semiconductor Devices App 20100078811 - Meyer-Berg; Georg	2010-04-01
Semiconductor Device And Manufacturing Of The Semiconductor Device App 20090273075 - Meyer-Berg; Georg	2009-11-05
Semiconductor Device And Method For Manufacturing A Semiconductor Device App 20090166843 - KUTTER; CHRISTOPH ; et al.	2009-07-02
Semiconductor module having a coupling substrate, and methods for its production Grant 7,498,674 - Meyer-Berg March 3, 2	2009-03-03
Ball grid array housing having a cooling foil Grant 7,414,311 - Meyer-Berg August 19, 2	2008-08-19
System For Distributing Electrical Power For A Chip App 20080191348 - Meyer-Berg; Georg ; et al.	2008-08-14
Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components Grant 7,317,251 - Meyer-Berg January 8, 2	2008-01-08
Ball Grid Array Housing Having A Cooling Foil App 20070228565 - Meyer-Berg; Georg	2007-10-04
Ball grid array housing having a cooling foil Grant 7,256,493 - Meyer-Berg August 14, 2	2007-08-14
Electronic Component Having at Least One Semiconductor Chip and Flip-Chip Contacts, and Method for Producing the Same App 20070102826 - Meyer-Berg; Georg ; et al.	2007-05-10
Semiconductor module having a coupling substrate, and methods for its production App 20070080442 - Meyer-Berg; Georg	2007-04-12
Method of fabricating an electronic component having at least one semiconductor chip on a circuit carrier with elastic external contacts Grant 7,176,059 - Meyer-Berg February 13, 2	2007-02-13
Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same Grant 7,176,131 - Meyer-Berg , et al. February 13, 2	2007-02-13
Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same Grant 7,129,570 - Meyer-Berg October 31, 2	2006-10-31
Multichip module including a plurality of semiconductor chips, and printed circuit board including a plurality of components App 20060060954 - Meyer-Berg; Georg	2006-03-23
Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same App 20060014318 - Meyer-Berg; Georg	2006-01-19
Ball grid array housing having a cooling foil App 20050269690 - Meyer-Berg, Georg	2005-12-08
Electronic component having at least one semiconductor chip and flip-chip contacts, and method for producing the same App 20050110162 - Meyer-Berg, Georg ; et al.	2005-05-26
Electronic component having at least one semiconductor chip on a circuit carrier and method for producing the same App 20040164400 - Meyer-Berg, Georg	2004-08-26
Multichip module having a silicon carrier substrate Grant 6,359,790 - Meyer-Berg March 19, 2	2002-03-19

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