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Rotary machine coil using a winding electric wire
Grant 11,128,190 - Iwaya , et al. September 21, 2 | 2021-09-21 |
Encapsulated circuit module, and production method therefor
Grant 10,665,568 - Miwa | 2020-05-26 |
Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board
Grant 10,537,021 - Michiwaki Ja | 2020-01-14 |
Surface treatment agent and novel compound
Grant 10,385,076 - Mori , et al. A | 2019-08-20 |
Three-dimensional Wiring Board Production Method, Three-dimensional Wiring Board, And Substrate For Three-dimensional Wiring Board
App 20190124763 - MICHIWAKI; Shigeru | 2019-04-25 |
Encapsulated circuit module, and production method therefor
Grant 10,271,432 - Miwa | 2019-04-23 |
Three-dimensional wiring board production method, three-dimensional wiring board, and substrate for three-dimensional wiring board
Grant 10,244,624 - Michiwaki | 2019-03-26 |
Three-dimensional Wiring Board Production Method, Three-dimensional Wiring Board, And Substrate For Three-dimensional Wiring Board
App 20180160528 - MICHIWAKI; Shigeru | 2018-06-07 |
Encapsulated Circuit Module, And Production Method Therefor
App 20170354039 - Miwa; Satoru | 2017-12-07 |
Encapsulated Circuit Module, And Production Method Therefor
App 20170345789 - MIWA; Satoru | 2017-11-30 |
Encapsulated Circuit Module, And Production Method Therefor
App 20170347462 - Miwa; Satoru | 2017-11-30 |
Method for manufacturing device embedded substrate, and device embedded substrate
Grant 9,793,218 - Toda , et al. October 17, 2 | 2017-10-17 |
Surface treatment method, surface treatment agent, and novel compound
Grant 9,790,242 - Mori , et al. October 17, 2 | 2017-10-17 |
Device embedded substrate and manufacturing method of device embedded substrate
Grant 9,756,732 - Seki , et al. September 5, 2 | 2017-09-05 |
Manufacturing method for component incorporated substrate and component incorporated substrate
Grant 9,622,352 - Shimizu , et al. April 11, 2 | 2017-04-11 |
Manufacturing method for component incorporated substrate and component incorporated substrate manufactured using the method
Grant 9,596,765 - Yamaki , et al. March 14, 2 | 2017-03-14 |
Process for forming metal film, and product equipped with metal film
Grant 9,593,423 - Mori , et al. March 14, 2 | 2017-03-14 |
Component-embedded substrate manufacturing method
Grant 9,526,182 - Shimizu , et al. December 20, 2 | 2016-12-20 |
Substrate manufacturing method
Grant 9,380,711 - Takii , et al. June 28, 2 | 2016-06-28 |
Method of fabricating heat dissipating board
Grant 9,363,885 - Taneko , et al. June 7, 2 | 2016-06-07 |
Manufacturing method of device embedded substrate and device embedded substrate manufactured by this method
Grant 9,355,990 - Matsumoto , et al. May 31, 2 | 2016-05-31 |
Method Of Fabricating Heat Dissipating Board
App 20160143126 - TANEKO; Noriaki ; et al. | 2016-05-19 |
Device Embedded Substrate And Manufacturing Method Thereof
App 20160118346 - Toda; Mitsuaki ; et al. | 2016-04-28 |
Printed wiring board
Grant 9,326,376 - Ishikawa , et al. April 26, 2 | 2016-04-26 |
Method of manufacturing a component-embedded substrate
Grant 9,320,185 - Imamura , et al. April 19, 2 | 2016-04-19 |
Method For Manufacturing Device Embedded Substrate, And Device Embedded Substrate
App 20160099215 - Toda; Mitsuaki ; et al. | 2016-04-07 |
Suction Device
App 20160016318 - Kawata; Shigeru ; et al. | 2016-01-21 |
Device Embedded Substrate And Manufacturing Method Of Device Embedded Substrate
App 20150382478 - SHIMADA; Hiroshi ; et al. | 2015-12-31 |
Printed Wiring Board
App 20150373829 - Ishikawa; Akihiro ; et al. | 2015-12-24 |
Device Embedded Substrate and Manufacturing Method of Device Embedded Substrate
App 20150327369 - Seki; Yasuaki ; et al. | 2015-11-12 |
Method of producing printed circuit board, and printed board produced by the method
Grant 9,185,811 - Saito , et al. November 10, 2 | 2015-11-10 |
Method Of Bending Back Rigid Printed Wiring Board With Flexible Portion
App 20150257284 - Toda; Mitsuaki ; et al. | 2015-09-10 |
Component-embedded Substrate And Manufacturing Method Thereof
App 20150245475 - Matsumoto; Tohru ; et al. | 2015-08-27 |
Manufacturing Method of Device Embedded Substrate and Device Embedded Substrate Manufactured by this Method
App 20150243628 - Matsumoto; Tohru ; et al. | 2015-08-27 |
Manufacturing Method For Component Incorporated Substrate And Component Incorporated Substrate Manufactured Using The Method
App 20150237734 - Shimizu; Ryoichi ; et al. | 2015-08-20 |
Component-embedded substrate, and method of manufacturing the component-embedded substrate
Grant 8,921,706 - Toda , et al. December 30, 2 | 2014-12-30 |
Component-Embedded Substrate Manufacturing Method and Component-Embedded Substrate Manufactured Using the Same
App 20140299367 - Imamura; Yoshio | 2014-10-09 |
Substrate Manufacturing Method
App 20140224762 - Takii; Shukichi ; et al. | 2014-08-14 |
Method Of Manufacturing Component-embedded Substrate And Component-embedded Substrate Manufactured By The Same
App 20140216801 - Matsumoto; Tohru ; et al. | 2014-08-07 |
Process for forming metal film, and product equipped with metal film
Grant 8,753,748 - Mori , et al. June 17, 2 | 2014-06-17 |
Spiral Probe And Method Of Manufacturing The Spiral Probe
App 20140111238 - Shingai; Noboru | 2014-04-24 |
Method of Manufacturing Component-Embedded Substrate, and Component-Embedded Substrate Manufactured Using the Method
App 20130242516 - Imamura; Yoshio ; et al. | 2013-09-19 |
Component-embedded Substrate, And Method Of Manufacturing The Component- Embedded Substrate
App 20130176701 - Toda; Mitsuaki ; et al. | 2013-07-11 |
Printed wiring board
Grant 7,800,917 - Shimada , et al. September 21, 2 | 2010-09-21 |
Circuit board
Grant 7,609,526 - Eiki October 27, 2 | 2009-10-27 |
Circuit board
App 20060109635 - Eiki; Shunsuke | 2006-05-25 |
Core substrate, and multilayer circuit board using it
App 20040136152 - Mitsuhashi, Takayuki ; et al. | 2004-07-15 |
Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
Grant 6,350,957 - Shingai , et al. February 26, 2 | 2002-02-26 |
Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
Grant 6,239,983 - Shingai , et al. May 29, 2 | 2001-05-29 |
Circuit board, manufacturing method therefor, and bump-type contact head and semiconductor component packaging module using the circuit board
Grant 5,886,877 - Shingai , et al. March 23, 1 | 1999-03-23 |
Process for producing a copper-clad laminate
Grant 5,049,221 - Wada , et al. September 17, 1 | 1991-09-17 |
Method of producing conductor circuit boards
Grant 4,889,584 - Wada , et al. December 26, 1 | 1989-12-26 |
Apparatus for continuously producing a base for a printed circuit board
Grant 4,883,575 - Yasuno , et al. November 28, 1 | 1989-11-28 |
Method of producing conductor circuit boards
Grant 4,790,902 - Wada , et al. December 13, 1 | 1988-12-13 |
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