Trademark applications and grants for Meiko Electronics Co L T D. Meiko Electronics Co L T D has 3 trademark applications. The latest application filed is for "M-VIA EMBEDDED"
Patent Application | Date |
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THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL WIRING BOARD, AND SUBSTRATE FOR THREE-DIMENSIONAL WIRING BOARD 20190124763 - 16/229948 MICHIWAKI; Shigeru | 2019-04-25 |
THREE-DIMENSIONAL WIRING BOARD PRODUCTION METHOD, THREE-DIMENSIONAL WIRING BOARD, AND SUBSTRATE FOR THREE-DIMENSIONAL WIRING BOARD 20180160528 - 15/578484 MICHIWAKI; Shigeru | 2018-06-07 |
Encapsulated Circuit Module, And Production Method Therefor 20170354039 - 15/534401 Miwa; Satoru | 2017-12-07 |
Encapsulated Circuit Module, And Production Method Therefor 20170347462 - 15/534427 Miwa; Satoru | 2017-11-30 |
Encapsulated Circuit Module, And Production Method Therefor 20170345789 - 15/534277 MIWA; Satoru | 2017-11-30 |
Mark Image Registration | Serial | Trademark Application Date |
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"M-VIA EMBEDDED" 4677058 79145820 |
M-VIA EMBEDDED 2014-02-14 |
"M-VIA FLEX" 4677056 79145726 |
M-VIA FLEX 2014-02-14 |
"MEIKO" 3867628 79079517 |
MEIKO 2009-11-11 |
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