McPartlin; Michael Joseph
Patent Applications and Registrations
Patent applications and USPTO patent grants for McPartlin; Michael Joseph.The latest application filed is for "direct substrate to solder bump connection for thermal management in flip chip amplifiers".
Company Profile
15.21.30
- McPartlin; Michael Joseph - North Andover MA
Patent Activity
| Patent | Date |
|---|---|
| Direct Substrate To Solder Bump Connection For Thermal Management In Flip Chip Amplifiers App 20210119584 - McPartlin; Michael Joseph ; et al. | 2021-04-22 |
| WLAN front-end Grant 10,869,362 - Huang , et al. December 15, 2 | 2020-12-15 |
| Direct substrate to solder bump connection for thermal management in flip chip amplifiers Grant 10,790,788 - McPartlin , et al. September 29, 2 | 2020-09-29 |
| Integrated RF front end system Grant 10,522,617 - McPartlin , et al. Dec | 2019-12-31 |
| Integrated Rf Front End System App 20190319093 - McPartlin; Michael Joseph ; et al. | 2019-10-17 |
| Flip chip amplifier for wireless device Grant 10,447,210 - McPartlin , et al. Oc | 2019-10-15 |
| Methods For Thermal Management In Amplifiers App 20190199294 - McPartlin; Michael Joseph ; et al. | 2019-06-27 |
| Wlan Front-end App 20190182894 - HUANG; Chun-Wen Paul ; et al. | 2019-06-13 |
| Bipolar Transistor On High-resistivity Substrate App 20190131438 - McPartlin; Michael Joseph | 2019-05-02 |
| Flip Chip Amplifier For Wireless Device App 20190123693 - McPartlin; Michael Joseph ; et al. | 2019-04-25 |
| Integrated RF front end system Grant 10,263,072 - McPartlin , et al. | 2019-04-16 |
| Fabrication of radio-frequency devices with amplifier voltage limiting features Grant 10,211,197 - Quaglietta , et al. Feb | 2019-02-19 |
| Solder bump placement for thermal management in flip chip amplifiers Grant 10,193,504 - McPartlin , et al. Ja | 2019-01-29 |
| Direct Substrate To Solder Bump Connection For Thermal Management In Flip Chip Amplifiers App 20190028067 - McPartlin; Michael Joseph ; et al. | 2019-01-24 |
| Solder bump placement for grounding in flip chip amplifiers Grant 10,181,824 - McPartlin , et al. Ja | 2019-01-15 |
| Solder bump placement for emitter-ballasting in flip chip amplifiers Grant 10,177,716 - McPartlin , et al. J | 2019-01-08 |
| Front-end integrated circuit for WLAN applications Grant 10,149,347 - Huang , et al. De | 2018-12-04 |
| Semiconductor die fabrication methods Grant 10,103,254 - McPartlin October 16, 2 | 2018-10-16 |
| Direct substrate to solder bump connection for thermal management in flip chip amplifiers Grant 10,069,466 - McPartlin , et al. September 4, 2 | 2018-09-04 |
| Integrated Rf Front End System App 20180130876 - McPartlin; Michael Joseph ; et al. | 2018-05-10 |
| Bipolar Transistor On High-resistivity Substrate App 20180019329 - McPartlin; Michael Joseph | 2018-01-18 |
| Fabrication Of Radio-frequency Devices With Amplifier Voltage Limiting Features App 20170373052 - QUAGLIETTA; Anthony Francis ; et al. | 2017-12-28 |
| Integrated RF front end system Grant 9,818,821 - McPartlin , et al. November 14, 2 | 2017-11-14 |
| Amplifier voltage limiting in radio-frequency devices Grant 9,768,157 - Quaglietta , et al. September 19, 2 | 2017-09-19 |
| Bipolar transistor on high-resistivity substrate Grant 9,761,700 - McPartlin September 12, 2 | 2017-09-12 |
| Solder Bump Placement For Thermal Management In Flip Chip Amplifiers App 20170117204 - McPartlin; Michael Joseph ; et al. | 2017-04-27 |
| Direct Substrate To Solder Bump Connection For Thermal Management In Flip Chip Amplifiers App 20170117853 - McPartlin; Michael Joseph ; et al. | 2017-04-27 |
| Solder Bump Placement For Emitter-ballasting In Flip Chip Amplifiers App 20170117270 - McPartlin; Michael Joseph ; et al. | 2017-04-27 |
| Solder Bump Placement For Grounding In Flip Chip Amplifiers App 20170117857 - McPartlin; Michael Joseph ; et al. | 2017-04-27 |
| Integrated Rf Front End System App 20170018607 - McPartlin; Michael Joseph ; et al. | 2017-01-19 |
| Amplifier Voltage Limiting In Radio-frequency Devices App 20160268246 - QUAGLIETTA; Anthony Francis ; et al. | 2016-09-15 |
| Integrated RF front end system Grant 9,419,073 - McPartlin , et al. August 16, 2 | 2016-08-16 |
| Front-end Integrated Circuit For Wlan Applications App 20160227603 - Huang; Chun-Wen Paul ; et al. | 2016-08-04 |
| Amplifier voltage limiting using punch-through effect Grant 9,373,613 - Quaglietta , et al. June 21, 2 | 2016-06-21 |
| Integrated Rf Front End System App 20150340429 - McPartlin; Michael Joseph ; et al. | 2015-11-26 |
| Amplifier Voltage Limiting Using Punch-through Effect App 20150187751 - QUAGLIETTA; Anthony Francis ; et al. | 2015-07-02 |
| Integrated RF front end system Grant 9,048,284 - McPartlin , et al. June 2, 2 | 2015-06-02 |
| Switching circuit Grant 8,729,949 - Nisbet , et al. May 20, 2 | 2014-05-20 |
| Device Manufacturing Using High-resistivity Bulk Silicon Wafer App 20140001602 - McPartlin; Michael Joseph | 2014-01-02 |
| Semiconductor Substrate Having High And Low-resistivity Portions App 20140001608 - McPartlin; Michael Joseph | 2014-01-02 |
| Integrated Rf Front End System App 20140002187 - McPartlin; Michael Joseph ; et al. | 2014-01-02 |
| Fet Transistor On High-resistivity Substrate App 20140001567 - McPartlin; Michael Joseph | 2014-01-02 |
| Bipolar Transistor On High-resistivity Substrate App 20140003000 - McPartlin; Michael Joseph | 2014-01-02 |
| Switching Circuit App 20130260698 - Nisbet; John Jackson ; et al. | 2013-10-03 |
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