McKerrow; Andrew J.

Patent Applications and Registrations

Patent applications and USPTO patent grants for McKerrow; Andrew J..The latest application filed is for "plasma activated conformal dielectric film deposition".

Company Profile

0.11.13

McKerrow; Andrew J. - Lake Oswego OR
McKerrow; Andrew J. - Dallas TX

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Plasma activated conformal dielectric film deposition Grant 10,043,655 - Swaminathan , et al. August 7, 2	2018-08-07
Plasma Activated Conformal Dielectric Film Deposition App 20170148628 - Swaminathan; Shankar ; et al.	2017-05-25
Plasma activated conformal dielectric film deposition Grant 9,570,274 - Swaminathan , et al. February 14, 2	2017-02-14
Plasma Activated Conformal Dielectric Film Deposition App 20150206719 - Swaminathan; Shankar ; et al.	2015-07-23
Plasma activated conformal dielectric film deposition Grant 8,999,859 - Swaminathan , et al. April 7, 2	2015-04-07
Plasma Activated Conformal Dielectric Film Deposition App 20140216337 - Swaminathan; Shankar ; et al.	2014-08-07
Plasma activated conformal dielectric film deposition Grant 8,637,411 - Swaminathan , et al. January 28, 2	2014-01-28
Plasma Activated Conformal Dielectric Film Deposition App 20120028454 - Swaminathan; Shankar ; et al.	2012-02-02
Method of passivating and/or removing contaminants on a low-k dielectric/copper surface Grant 7,087,518 - Farber , et al. August 8, 2	2006-08-08
Nickel silicide - silicon nitride adhesion through surface passivation App 20050090087 - Lu, Jiong-Ping ; et al.	2005-04-28
Pre-pattern surface modification of low-k dielectrics Grant 6,861,348 - Kirkpatrick , et al. March 1, 2	2005-03-01
Chemical treatment of low-k dielectric films Grant 6,838,300 - Jin , et al. January 4, 2	2005-01-04
Nickel silicide--silicon nitride adhesion through surface passivation Grant 6,831,008 - Lu , et al. December 14, 2	2004-12-14
Chemical treatment of low-k dielectric films App 20040150012 - Jin, Changming ; et al.	2004-08-05
Hexamethyldisilazane treatment of low-k dielectric films App 20040152296 - Matz, Phillip D. ; et al.	2004-08-05
Pre-pattern surface modification for low-k dielectrics using A H2 plasma Grant 6,720,247 - Kirkpatrick , et al. April 13, 2	2004-04-13
Nickel silicide - silicon nitride adhesion through surface passivation App 20040061184 - Lu, Jiong-Ping ; et al.	2004-04-01
Method of passivating and/or removing contaminants on a low-k dielectric/copper surface App 20030224585 - Farber, David Gerald ; et al.	2003-12-04
Plasma treatment of low-k dielectric films to improve patterning Grant 6,620,560 - Jiang , et al. September 16, 2	2003-09-16
Method of passivating and/or removing contaminants on a low-k dielectric/copper surface App 20030170992 - Farber, David Gerald ; et al.	2003-09-11
Pre-pattern surface modification for low-k dielectrics using A H2 plasma App 20020111017 - Kirkpatrick, Brian K. ; et al.	2002-08-15
Pre-pattern surface modification for low-k dielectrics App 20020111037 - Kirkpatrick, Brian K. ; et al.	2002-08-15
Plasma treatment of low-k dielectric films to improve patterning App 20020090822 - Jiang, Ping ; et al.	2002-07-11

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