loadpatents
Patent applications and USPTO patent grants for McHugh; Paul.The latest application filed is for "systems and methods for improving within die co-planarity uniformity".
Patent | Date |
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Systems And Methods For Improving Within Die Co-planarity Uniformity App 20220270923 - McHugh; Paul ;   et al. | 2022-08-25 |
Systems and methods for improving within die co-planarity uniformity Grant 11,367,653 - McHugh , et al. June 21, 2 | 2022-06-21 |
Drying high aspect ratio features Grant 10,971,354 - Bergman , et al. April 6, 2 | 2021-04-06 |
Controlled etch of nitride features Grant 10,840,104 - Bergman , et al. November 17, 2 | 2020-11-17 |
Apparatus and methods to improve ALD uniformity Grant 10,655,226 - Wilson , et al. | 2020-05-19 |
Systems And Methods For Improving Within Die Co-planarity Uniformity App 20200098628 - McHugh; Paul ;   et al. | 2020-03-26 |
Drying high aspect ratio features Grant 10,546,762 - Bergman , et al. Ja | 2020-01-28 |
Electroplating dynamic edge control Grant 10,494,731 - McHugh , et al. De | 2019-12-03 |
Systems And Methods For Removing Contaminants In Electroplating Systems App 20190345624 - Roh; Kwan Wook ;   et al. | 2019-11-14 |
Systems and methods for wetting substrates Grant 10,373,864 - McHugh , et al. | 2019-08-06 |
Electroplating Dynamic Edge Control App 20190177869 - McHugh; Paul ;   et al. | 2019-06-13 |
Controlled Etch Of Nitride Features App 20190019688 - Bergman; Eric J. ;   et al. | 2019-01-17 |
Apparatus and Methods to Improve ALD Uniformity App 20180340259 - Wilson; Gregory J. ;   et al. | 2018-11-29 |
Systems And Methods For Wetting Substrates App 20180182664 - McHugh; Paul ;   et al. | 2018-06-28 |
Drying High Aspect Ratio Features App 20180144954 - Bergman; Eric J. ;   et al. | 2018-05-24 |
Drying High Aspect Ratio Features App 20180019119 - Bergman; Eric J. ;   et al. | 2018-01-18 |
Substrate rinsing systems and methods Grant 9,859,135 - Frankel , et al. January 2, 2 | 2018-01-02 |
Substrate Rinsing Systems And Methods App 20160175857 - Frankel; Jonathan S. ;   et al. | 2016-06-23 |
Semiconductor processing furnace outflow cooling system Grant 5,908,292 - Smith , et al. June 1, 1 | 1999-06-01 |
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