McGrath; Scott
Patent Applications and Registrations
Patent applications and USPTO patent grants for McGrath; Scott.The latest application filed is for "water heater and boiler processes".
Company Profile
2.24.25
Trademarks
- McGrath; Scott - Newton NJ
- McGrath; Scott - Montreal CA
- McGrath; Scott - Boscawen NH
- McGrath; Scott - Scotts Valley CA
- McGrath; Scott - Sunnyvale CA
Trademarks
Patent Activity
| Patent | Date |
|---|---|
| Water Heater And Boiler Processes App 20200348017 - Shah; Kunal ; et al. | 2020-11-05 |
| Waveform Model App 20190128997 - Beaudin; Andre ; et al. | 2019-05-02 |
| Waveform model Grant 10,254,386 - Beaudin , et al. | 2019-04-09 |
| Product identification based on location associated with image of product Grant 10,062,099 - McGrath August 28, 2 | 2018-08-28 |
| Methods and structures to repair device warpage Grant 9,859,234 - Uzoh , et al. January 2, 2 | 2018-01-02 |
| Flipped die stack Grant 9,825,002 - Katkar , et al. November 21, 2 | 2017-11-21 |
| Semiconductor die mount by conformal die coating Grant 9,824,999 - Crane , et al. November 21, 2 | 2017-11-21 |
| Stiffened wires for offset BVA Grant 9,659,848 - Villavicencio , et al. May 23, 2 | 2017-05-23 |
| Stiffened Wires For Offset Bva App 20170141020 - Villavicencio; Grant ; et al. | 2017-05-18 |
| Methods And Structures To Repair Device Warpage App 20170040270 - Uzoh; Cyprian Emeka ; et al. | 2017-02-09 |
| Flipped Die Stack App 20170018529 - Katkar; Rajesh ; et al. | 2017-01-19 |
| Electrical connector between die pad and z-interconnect for stacked die assemblies Grant 9,508,689 - Co , et al. November 29, 2 | 2016-11-29 |
| Dynamic beamforming configuration based on network conditions Grant 9,503,915 - Dharanipragada , et al. November 22, 2 | 2016-11-22 |
| Monitoring link quality between network devices Grant 9,438,496 - Raman , et al. September 6, 2 | 2016-09-06 |
| Semiconductor Die Mount By Conformal Die Coating App 20160104689 - Crane; Scott Jay ; et al. | 2016-04-14 |
| Semiconductor die mount by conformal die coating Grant 9,252,116 - Crane , et al. February 2, 2 | 2016-02-02 |
| Product Identification Based On Location Associated With Image Of Product App 20160027091 - McGrath; Scott | 2016-01-28 |
| Electrical Connector Between Die Pad And Z-interconnect For Stacked Die Assemblies App 20160027761 - Co; Reynaldo ; et al. | 2016-01-28 |
| Electrical connector between die pad and z-interconnect for stacked die assemblies Grant 9,153,517 - Co , et al. October 6, 2 | 2015-10-06 |
| Policy-Based Control Mechanism For Wireless Network Physical Layer Resources App 20150117322 - McGrath; Scott ; et al. | 2015-04-30 |
| Monitoring Link Quality Between Network Devices App 20150117234 - Raman; Gopalakrishna ; et al. | 2015-04-30 |
| Stacked die assembly having reduced stress electrical interconnects Grant 8,912,661 - McGrath , et al. December 16, 2 | 2014-12-16 |
| Dynamic Beamforming Configuration Based on Network Conditions App 20140269370 - Dharanipragada; Kalyan ; et al. | 2014-09-18 |
| Semiconductor Die Mount By Conformal Die Coating App 20140213020 - Crane; Scott Jay ; et al. | 2014-07-31 |
| Vertical electrical interconnect formed on support prior to die mount Grant 8,742,602 - Caskey , et al. June 3, 2 | 2014-06-03 |
| Electrically interconnected stacked die assemblies Grant 8,723,332 - McElrea , et al. May 13, 2 | 2014-05-13 |
| Semiconductor die mount by conformal die coating Grant 8,704,379 - Crane , et al. April 22, 2 | 2014-04-22 |
| Electrically interconnected stacked die assemblies Grant 8,629,543 - McElrea , et al. January 14, 2 | 2014-01-14 |
| Bonding Wedge App 20130119117 - McGrath; Scott | 2013-05-16 |
| Wafer level surface passivation of stackable integrated circuit chips Grant 8,324,081 - McElrea , et al. December 4, 2 | 2012-12-04 |
| Electrical Connector Between Die Pad and Z-Interconnect for Stacked Die Assemblies App 20120119385 - Co; Reynaldo ; et al. | 2012-05-17 |
| Stacked Die Assembly Having Reduced Stress Electrical Interconnects App 20110272825 - McGrath; Scott ; et al. | 2011-11-10 |
| Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips App 20110147943 - McElrea; Simon J. S. ; et al. | 2011-06-23 |
| Wafer level surface passivation of stackable integrated circuit chips Grant 7,923,349 - McElrea , et al. April 12, 2 | 2011-04-12 |
| Electrically Interconnected Stacked Die Assemblies App 20110037159 - McElrea; Simon J. S. ; et al. | 2011-02-17 |
| Semiconductor Die Interconnect Formed By Aerosol Application Of Electrically Conductive Material App 20100140811 - Leal; Jeffrey S. ; et al. | 2010-06-10 |
| Chip Scale Stacked Die Package App 20090102038 - MCELREA; SIMON J.S. ; et al. | 2009-04-23 |
| Electrical Interconnect Formed by Pulsed Dispense App 20090068790 - Caskey; Terrence ; et al. | 2009-03-12 |
| Semiconductor Die Mount By Conformal Die Coating App 20090065916 - Crane; Scott Jay ; et al. | 2009-03-12 |
| Wafer Level Surface Passivation Of Stackable Integrated Circuit Chips App 20080315434 - McElrea; Simon J.S. ; et al. | 2008-12-25 |
| Three-dimensional Circuitry Formed On Integrated Circuit Device Using Two-dimensional Fabrication App 20080315407 - Andrews, JR.; Lawrence Douglas ; et al. | 2008-12-25 |
| Electrically Interconnected Stacked Die Assemblies App 20080303131 - McElrea; Simon J.S. ; et al. | 2008-12-11 |
| Vertical Electrical Interconnect Formed On Support Prior To Die Mount App 20080224279 - Caskey; Terrence ; et al. | 2008-09-18 |
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