MARUYAMA; Hiromitsu
Patent Applications and Registrations
Patent applications and USPTO patent grants for MARUYAMA; Hiromitsu.The latest application filed is for "dicing die attach film and method of producing the same, and semiconductor package and method of producing the same".
- MARUYAMA; Hiromitsu - Tokyo JP
- MARUYAMA; Hiromitsu - Chiyoda-ku JP
| Patent | Date |
|---|---|
| Dicing Die Attach Film And Method Of Producing The Same, And Semiconductor Package And Method Of Producing The Same App 20220310547 - MORITA; Minoru ; et al. | 2022-09-29 |
| Adhesive sheet Grant 9,631,123 - Aoyama , et al. April 25, 2 | 2017-04-25 |
| Adhesive sheet Grant 9,523,023 - Aoyama , et al. December 20, 2 | 2016-12-20 |
| Wafer processing tape Grant 9,324,592 - Maruyama , et al. April 26, 2 | 2016-04-26 |
| Wafer processing tape Grant 9,324,593 - Maruyama , et al. April 26, 2 | 2016-04-26 |
| Adhesive Sheet App 20150017374 - AOYAMA; Masami ; et al. | 2015-01-15 |
| Adhesive Sheet App 20150017375 - AOYAMA; Masami ; et al. | 2015-01-15 |
| Adhesive Sheet App 20150017373 - AOYAMA; Masami ; et al. | 2015-01-15 |
| Wafer Processing Tape App 20120100325 - MARUYAMA; Hiromitsu ; et al. | 2012-04-26 |
| Semiconductor wafer processing tape Grant D628,170 - Maruyama , et al. November 30, 2 | 2010-11-30 |
| Wafer Processing Tape App 20100227165 - Maruyama; Hiromitsu ; et al. | 2010-09-09 |
| Semiconductor wafer processing tape Grant D621,803 - Maruyama , et al. August 17, 2 | 2010-08-17 |
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