Martin; Kevin P.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Martin; Kevin P..The latest application filed is for "devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof".

Company Profile

0.19.13

Martin; Kevin P. - Atlanta GA
Martin; Kevin P. - Boston NY
Martin; Kevin P. - Naperville IL
Martin; Kevin P. - Glendale AZ

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Trademarks

Patent Activity

Patent	Date
High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use Grant 7,554,347 - Mule' , et al. June 30, 2	2009-06-30
Balanced safety relief valve Grant 7,513,270 - Martin , et al. April 7, 2	2009-04-07
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof Grant 7,468,558 - Bakir , et al. December 23, 2	2008-12-23
Method and apparatus for low energy electron enhanced etching of substrates in an AC or DC plasma environment Grant 7,431,796 - Martin , et al. October 7, 2	2008-10-07
Container Grant D541,656 - Martin May 1, 2	2007-05-01
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof App 20060209519 - Bakir; Muhannad S. ; et al.	2006-09-21
Dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and methods of use thereof Grant 7,099,525 - Bakir , et al. August 29, 2	2006-08-29
Balanced Safety Relief Valve App 20060157116 - Martin; Kevin P. ; et al.	2006-07-20
Systems and methods for three-dimensional lithography and nano-indentation App 20050257709 - Mule, Tony ; et al.	2005-11-24
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package Grant 6,954,576 - Mule' , et al. October 11, 2	2005-10-11
Method and apparatus for low energy electron enhanced etching of substrates in an AC or DC plasma environment Grant 6,852,195 - Martin , et al. February 8, 2	2005-02-08
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package App 20040264840 - Mule, Tony ; et al.	2004-12-30
Curved metal-polymer dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and uses thereof App 20040184704 - Bakir, Muhannad S. ; et al.	2004-09-23
Dual-mode/function optical and electrical interconnects, methods of fabrication thereof, and methods of use thereof App 20040184703 - Bakir, Muhannad S. ; et al.	2004-09-23
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package Grant 6,785,458 - Mule' , et al. August 31, 2	2004-08-31
Method and apparatus for low energy electron enhanced etching of substrates in an AC or DC plasma environment App 20040163763 - Martin, Kevin P. ; et al.	2004-08-26
Barbell bottle Grant D489,001 - Martin April 27, 2	2004-04-27
Compliant wafer-level packaging devices and methods of fabrication Grant 6,690,081 - Bakir , et al. February 10, 2	2004-02-10
High input/output density optoelectronic probe card for wafer-level test of electrical and optical interconnect components, methods of fabrication, and methods of use App 20040017215 - Mule, Tony ; et al.	2004-01-29
Mug bottle Grant D482,621 - Martin November 25, 2	2003-11-25
Large bottle Grant D482,622 - Martin November 25, 2	2003-11-25
Slim bottle Grant D482,623 - Martin November 25, 2	2003-11-25
Devices having compliant wafer-level input/output interconnections and packages using pillars and methods of fabrication thereof App 20030206680 - Bakir, Muhannad S. ; et al.	2003-11-06
Devices having compliant wafer-level packages with pillars and methods of fabrication App 20030122229 - Bakir, Muhannad S. ; et al.	2003-07-03
Guided-wave optical interconnections embedded within a microelectronic wafer-level batch package App 20020136481 - Mule', Tony ; et al.	2002-09-26
Compliant wafer-level packaging devices and methods of fabrication App 20020127768 - Badir, Muhannad S. ; et al.	2002-09-12
Method and apparatus for low energy electron enhanced etching of substrates in an AC or DC plasma environment App 20010030026 - Martin, Kevin P. ; et al.	2001-10-18
Insulated container apparatus Grant 6,041,952 - Martin March 28, 2	2000-03-28
Method and apparatus for low energy electron enhanced etching of substrates Grant 6,027,663 - Martin , et al. February 22, 2	2000-02-22
Method and apparatus for low energy electron enhanced etching of substrates Grant 5,882,538 - Martin , et al. March 16, 1	1999-03-16
Combined liquid container and cap Grant D403,245 - Martin December 29, 1	1998-12-29
Processes and apparatus for lift-off and bonding of materials and devices Grant 5,465,009 - Drabik , et al. November 7, 1	1995-11-07

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