Markovich; Voya R.

Patent Applications and Registrations

Patent applications and USPTO patent grants for Markovich; Voya R..The latest application filed is for "electrically conductive adhesive (eca) for multilayer device interconnects".

Company Profile

1.161.142

Markovich; Voya R. - Endwell NY
Markovich; Voya R. - Broome NY

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Method of making a circuitized substrate Grant 9,756,724 - Das , et al. September 5, 2	2017-09-05
Electrically conductive adhesive (ECA) for multilayer device interconnects Grant 9,451,693 - Das , et al. September 20, 2	2016-09-20
Conducting paste for device level interconnects Grant 8,685,284 - Das , et al. April 1, 2	2014-04-01
Solder and electrically conductive adhesive based interconnection for CZT crystal attach Grant 8,592,299 - Markovich , et al. November 26, 2	2013-11-26
Electronic package with thermal interposer and method of making same Grant 8,558,374 - Markovich , et al. October 15, 2	2013-10-15
Method of making halogen-free circuitized substrate with reduced thermal expansion Grant 8,499,440 - Japp , et al. August 6, 2	2013-08-06
Method of forming an electrically conductive printed line Grant 8,499,445 - Das , et al. August 6, 2	2013-08-06
Method of forming multilayer capacitors in a printed circuit substrate Grant 8,501,575 - Das , et al. August 6, 2	2013-08-06
Circuitized substrate with low loss capacitive material and method of making same Grant 8,446,707 - Das , et al. May 21, 2	2013-05-21
Electronic package including high density interposer and circuitized substrate assembly utilizing same Grant 8,405,229 - Antesberger , et al. March 26, 2	2013-03-26
Electrically Conductive Adhesive (eca) For Multilayer Device Interconnects App 20130033827 - Das; Rabindra N. ; et al.	2013-02-07
Thermal Substrate App 20130025839 - Egitto; Frank ; et al.	2013-01-31
Circuitized substrate with dielectric interposer assembly and method Grant 8,299,371 - Das , et al. October 30, 2	2012-10-30
Anti-tamper microchip package based on thermal nanofluids or fluids Grant 8,288,857 - Das , et al. October 16, 2	2012-10-16
Conductive Metal Micro-pillars For Enhanced Electrical Interconnection App 20120257343 - Das; Rabindra N. ; et al.	2012-10-11
Modular, Detachable Compute Leaf For Use With Computing System App 20120260063 - Markovich; Voya R. ; et al.	2012-10-11
Coreless Layer Laminated Chip Carrier Having System In Package Structure App 20120247822 - Fuller, JR.; James W. ; et al.	2012-10-04
Circuitized Substrate With Internal Thin Film Capacitor And Method Of Making Same App 20120228014 - Das; Rabindra N. ; et al.	2012-09-13
Method Of Forming Multilayer Capacitors In A Printed Circuit Substrate App 20120223047 - Das; Rabindra N. ; et al.	2012-09-06
Method of making high density interposer and electronic package utilizing same Grant 8,245,392 - Antesberger , et al. August 21, 2	2012-08-21
Method of making circuitized substrate with resistor including material with metal component and electrical assembly and information handling system utilizing said circuitized substrate Grant 8,247,703 - Das , et al. August 21, 2	2012-08-21
Method of joining a semiconductor device/chip to a printed wiring board Grant 8,240,031 - Markovich , et al. August 14, 2	2012-08-14
Circuitized substrates utilizing smooth-sided conductive layers as part thereof Grant 8,242,376 - Lauffer , et al. August 14, 2	2012-08-14
Electronic Package With Thermal Interposer And Method Of Making Same App 20120201006 - Markovich; Voya R. ; et al.	2012-08-09
Multilayered circuitized substrate with P-aramid dielectric layers and method of making same Grant 8,211,790 - Japp , et al. July 3, 2	2012-07-03
Electronic Package And Method Of Making Same App 20120162928 - Das; Rabindra N. ; et al.	2012-06-28
Coreless Layer Buildup Structure App 20120160547 - Antesberger; Timothy ; et al.	2012-06-28
Coreless Layer Buildup Structure With Lga App 20120160544 - Antesberger; Timothy ; et al.	2012-06-28
Circuitized Substrate With Dielectric Interposer Assembly And Method App 20120152605 - Das; Rabindra N. ; et al.	2012-06-21
High Bandwidth Semiconductor Ball Grid Array Package App 20120112345 - Blackwell; Kim J. ; et al.	2012-05-10
Conducting Paste For Device Level Interconnects App 20120069531 - Das; Rabindra N. ; et al.	2012-03-22
Anti-tamper Microchip Package Based On Thermal Nanofluids Or Fluids App 20120068326 - Das; Rabindra N. ; et al.	2012-03-22
Coreless Layer Buildup Structure With Lga And Joining Layer App 20120031649 - Antesberger; Timothy ; et al.	2012-02-09
Circuitized Substrate With Conductive Paste, Electrical Assembly Including Said Circuitized Substrate And Method Of Making Said Substrate App 20120017437 - Das; Rabindra N. ; et al.	2012-01-26
High Density Decal And Method For Attaching Same App 20120015532 - Markovich; Voya R. ; et al.	2012-01-19
Circuitized substrate with continuous thermoplastic support film dielectric layers Grant 8,084,863 - Japp , et al. December 27, 2	2011-12-27
Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate Grant 8,063,315 - Das , et al. November 22, 2	2011-11-22
Method For Making Circuitized Substrates Having Photo-imageable Dielectric Layers In A Continuous Manner App 20110173809 - Lauffer; John M. ; et al.	2011-07-21
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 7,981,245 - Egitto , et al. July 19, 2	2011-07-19
Method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner Grant 7,977,034 - Lauffer , et al. July 12, 2	2011-07-12
Electronic package including high density interposer and circuitized substrate assembly utilizing same App 20110127664 - Antesberger; Timothy ; et al.	2011-06-02
Method of making high density interposer and electronic package utilizing same App 20110126408 - Antesberger; Timothy ; et al.	2011-06-02
Dielectric composition for use in circuitized substrates and circuitized substrate including same Grant 7,931,830 - Japp , et al. April 26, 2	2011-04-26
Capacitive substrate Grant 7,897,877 - Das , et al. March 1, 2	2011-03-01
Method Of Making Circuitized Substrate With Resistor Including Material With Metal Component And Electrical Assembly And Information Handling System Utilizing Said Circuitized Substrate App 20110043987 - Das; Rabindra N. ; et al.	2011-02-24
Photosensitive dielectric film App 20110017498 - Lauffer; John M. ; et al.	2011-01-27
Circuitized Substrates Utilizing Smooth-sided Conductive Layers As Part Thereof App 20100328868 - Lauffer; John M. ; et al.	2010-12-30
Circuitized substrates utilizing smooth-sided conductive layers as part thereof Grant 7,838,776 - Lauffer , et al. November 23, 2	2010-11-23
Apparatus for making circuitized substrates having photo-imageable dielectric layers in a continuous manner Grant 7,827,682 - Lauffer , et al. November 9, 2	2010-11-09
Method of making multilayered circuitized substrate assembly Grant 7,823,274 - Egitto , et al. November 2, 2	2010-11-02
Method of making circuitized substrate with filled isolation border Grant 7,814,649 - Lauffer , et al. October 19, 2	2010-10-19
Capacitive substrate and method of making same Grant 7,803,688 - Das , et al. September 28, 2	2010-09-28
Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same Grant 7,800,916 - Blackwell , et al. September 21, 2	2010-09-21
Multi-layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric App 20100218891 - Egitto; Frank D. ; et al.	2010-09-02
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 7,777,136 - Egitto , et al. August 17, 2	2010-08-17
Circuitized substrate with internal cooling structure and electrical assembly utilizing same Grant 7,738,249 - Chan , et al. June 15, 2	2010-06-15
Method of making circuitized substrate with internal optical pathway using photolithography Grant 7,713,767 - Chan , et al. May 11, 2	2010-05-11
Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same Grant 7,687,722 - Japp , et al. March 30, 2	2010-03-30
Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same Grant 7,679,005 - Chan , et al. March 16, 2	2010-03-16
Multilayered circuitized substrate with p-aramid dielectric layers and method of making same Grant 7,646,098 - Japp , et al. January 12, 2	2010-01-12
Method of improving electrical connections in circuitized substrates Grant 7,629,559 - Desai , et al. December 8, 2	2009-12-08
Method for making a multilayered circuitized substrate Grant 7,627,947 - Davis , et al. December 8, 2	2009-12-08
Method of fabricating a BGA package having decreased adhesion Grant 7,615,477 - Knickerbocker , et al. November 10, 2	2009-11-10
Circuitized substrate with P-aramid dielectric layers and method of making same App 20090258161 - Japp; Robert M. ; et al.	2009-10-15
Circuitized substrate and method of making same App 20090241332 - Lauffer; John M. ; et al.	2009-10-01
Capacitive substrate and method of making same App 20090206051 - Das; Rabindra N. ; et al.	2009-08-20
Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing same App 20090175000 - Japp; Robert M. ; et al.	2009-07-09
Multilayered circuitized substrate with p-aramid dielectric layers and method of making same App 20090173426 - Japp; Robert M. ; et al.	2009-07-09
Method of making circuitized substrate with internal optical pathway Grant 7,541,058 - Chan , et al. June 2, 2	2009-06-02
Method of making a printed circuit board with low cross-talk noise Grant 7,530,167 - Lauffer , et al. May 12, 2	2009-05-12
Circuitized substrate with internal cooling structure and electrical assembly utilizing same App 20090109624 - Chan; Benson ; et al.	2009-04-30
Method of making circuitized substrate with internal optical pathway App 20090092353 - Chan; Benson ; et al.	2009-04-09
Method of making circuitized substrate with internal optical pathway using photolithography App 20090093073 - Chan; Benson ; et al.	2009-04-09
Interposer and test assembly for testing electronic devices Grant 7,501,839 - Chan , et al. March 10, 2	2009-03-10
Coupling of conductive vias to complex power-signal substructures Grant 7,500,306 - Carpenter , et al. March 10, 2	2009-03-10
Information handling system utilizing circuitized substrate with split conductive layer Grant 7,491,896 - Lauffer , et al. February 17, 2	2009-02-17
Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate Grant 7,449,381 - Das , et al. November 11, 2	2008-11-11
Circuitized substrate with solder-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate Grant 7,442,879 - Das , et al. October 28, 2	2008-10-28
Electronic card assembly Grant 7,441,709 - Chan , et al. October 28, 2	2008-10-28
Circuitized substrates utilizing smooth-sided conductive layers as part thereof App 20080259581 - Lauffer; John M. ; et al.	2008-10-23
Circuitized substrate with internal stacked semiconductor chips, method of making same, electrical assembly utilizing same and information handling system utilizing same App 20080244902 - Blackwell; Kim J. ; et al.	2008-10-09
Method of making a circuitized substrate having at least one capacitor therein App 20080248596 - Das; Rabindra N. ; et al.	2008-10-09
Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same Grant 7,429,789 - Japp , et al. September 30, 2	2008-09-30
Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate Grant 7,429,510 - Das , et al. September 30, 2	2008-09-30
Multi-layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric App 20080217050 - Egitto; Frank D. ; et al.	2008-09-11
Circuitized substrate with p-aramid dielectric layers and method of making same App 20080191354 - Japp; Robert M. ; et al.	2008-08-14
Multilayered circuitized substrate with p-aramid dielectric layers and method of making same App 20080191353 - Japp; Robert M. ; et al.	2008-08-14
Multi-layered Interconnect Structure Using Liquid Crystalline Polymer Dielectric App 20080178999 - Egitto; Frank D. ; et al.	2008-07-31
Method of making circuitized substrates utilizing smooth-sided conductive layers as part thereof Grant 7,383,629 - Lauffer , et al. June 10, 2	2008-06-10
Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate Grant 7,384,856 - Das , et al. June 10, 2	2008-06-10
Method of making circuitized substrate Grant 7,381,587 - Japp , et al. June 3, 2	2008-06-03
Method of making circuitized substrate with split conductive layer and information handling system utilizing same Grant 7,377,033 - Lauffer , et al. May 27, 2	2008-05-27
Information handling system utilizing circuitized substrate with split conductive layer App 20080117583 - Lauffer; John M. ; et al.	2008-05-22
Circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof App 20080105457 - Egitto; Frank D. ; et al.	2008-05-08
Method of forming printed circuit card Grant 7,353,590 - Fallon , et al. April 8, 2	2008-04-08
Halogen-free circuitized substrate with reduced thermal expansion, method of making same, multilayered substrate structure utilizing same, and information handling system utilizing App 20080078570 - Japp; Robert M. ; et al.	2008-04-03
Method of providing printed circuit board with conductive holes and board resulting therefrom Grant 7,348,677 - Larnerd , et al. March 25, 2	2008-03-25
Method of making circuitized substrate assembly Grant 7,343,674 - Fuller, Jr. , et al. March 18, 2	2008-03-18
Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same Grant 7,342,183 - Egitto , et al. March 11, 2	2008-03-11
Circuitized substrate with increased roughness conductive layer as part thereof App 20080054476 - Egitto; Frank D. ; et al.	2008-03-06
Method of making mutilayered circuitized substrate assembly having sintered paste connections Grant 7,334,323 - Egitto , et al. February 26, 2	2008-02-26
Method for forming a plated microvia interconnect Grant 7,328,506 - Jimarez , et al. February 12, 2	2008-02-12
Apparatus for making circuitized substrates in a continuous manner Grant 7,328,502 - Lauffer , et al. February 12, 2	2008-02-12
Method of making circuitized substrate with internal organic memory device Grant 7,326,643 - Desai , et al. February 5, 2	2008-02-05
Method of making multilayered circuitized substrate assembly App 20080022520 - Egitto; Frank D. ; et al.	2008-01-31
Method For Forming A Plated Microvia Interconnect App 20080017410 - Jimarez; Miguel A. ; et al.	2008-01-24
Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof Grant 7,307,022 - Egitto , et al. December 11, 2	2007-12-11
Method of making an electronic package App 20070278654 - Jimarez; Lisa J. ; et al.	2007-12-06
Capacitive substrate and method of making same App 20070275525 - Das; Rabindra N. ; et al.	2007-11-29
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 7,301,108 - Egitto , et al. November 27, 2	2007-11-27
Apparatus for making circuitized substrates in a continuous manner App 20070266555 - Lauffer; John M. ; et al.	2007-11-22
Apparatus and method for making circuitized substrates in a continuous manner Grant 7,293,355 - Lauffer , et al. November 13, 2	2007-11-13
Method of making circuitized substrate with internal organic memory device App 20070249089 - Desai; Subahu D. ; et al.	2007-10-25
Method of making an electronic package Grant 7,278,207 - Jimarez , et al. October 9, 2	2007-10-09
Circuitized substrate with conductive paste, electrical assembly including said circuitized substrate and method of making said substrate App 20070221404 - Das; Rabindra N. ; et al.	2007-09-27
Method for making a multilayered circuitized substrate App 20070199195 - Davis; Thomas J. ; et al.	2007-08-30
Circuitized substrate with internal organic memory device, electrical assembly utilizing same, and information handling system utilizing same Grant 7,253,502 - Desai , et al. August 7, 2	2007-08-07
Non-flaking capacitor material, capacitive substrate having an internal capacitor therein including said non-flaking capacitor material, and method of making a capacitor member for use in a capacitive substrate App 20070177331 - Das; Rabindra N. ; et al.	2007-08-02
Method of making circuitized substrate App 20070166944 - Japp; Robert M. ; et al.	2007-07-19
Method of making circuitized substrate with split conductive layer and information handling system utilizing same App 20070144772 - Lauffer; John M. ; et al.	2007-06-28
Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate Grant 7,235,745 - Das , et al. June 26, 2	2007-06-26
Method of improving electrical connections in circuitized substrates App 20070139977 - Desai; Subahu D. ; et al.	2007-06-21
Method and Structure for an Organic Package with Improved BGA Life App 20070099342 - Knickerbocker; John U. ; et al.	2007-05-03
Method of making multilayered printed circuit board with filled conductive holes Grant 7,211,289 - Larnerd , et al. May 1, 2	2007-05-01
Method of making a printed circuit board with low cross-talk noise App 20070089290 - Lauffer; John M. ; et al.	2007-04-26
Interposer and test assembly for testing electronic devices App 20070075726 - Chan; Benson ; et al.	2007-04-05
Printed circuit board with low cross-talk noise Grant 7,176,383 - Lauffer , et al. February 13, 2	2007-02-13
Method of making a circuitized substrate with sintered paste connections and multilayered substrate assembly having said substrate as part thereof App 20070006452 - Egitto; Frank D. ; et al.	2007-01-11
Circuitized substrate with sintered paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same App 20070007032 - Egitto; Frank D. ; et al.	2007-01-11
Method of making a capacitive substrate for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate App 20070010065 - Das; Rabindra N. ; et al.	2007-01-11
Circuitized substrate with soler-coated microparticle paste connections, multilayered substrate assembly, electrical assembly and information handling system utilizing same and method of making said substrate App 20070007033 - Das; Rabindra N. ; et al.	2007-01-11
Method of making a capacitive substrate using photoimageable dielectric for use as part of a larger circuitized substrate, method of making said circuitized substrate and method of making an information handling system including said circuitized substrate App 20070010064 - Das; Rabindra N. ; et al.	2007-01-11
Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same Grant 7,157,646 - Lauffer , et al. January 2, 2	2007-01-02
Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same Grant 7,157,647 - Lauffer , et al. January 2, 2	2007-01-02
Method of making high speed circuit board Grant 7,152,319 - Chan , et al. December 26, 2	2006-12-26
Method and structure for an organic package with improved BGA life Grant 7,148,566 - Knickerbocker , et al. December 12, 2	2006-12-12
Method of making circuitized substrate with filled isolation border App 20060248717 - Lauffer; John M. ; et al.	2006-11-09
Apparatus and method for making circuitized substrates in a continuous manner App 20060240641 - Lauffer; John M. ; et al.	2006-10-26
Apparatus and method for making circuitized substrates having photo-imageable dielectric layers in a continuous manner App 20060240364 - Lauffer; John M. ; et al.	2006-10-26
Electronic card assembly App 20060213973 - Chan; Benson ; et al.	2006-09-28
Circuitized substrate with shielded signal lines and plated-thru-holes and method of making same, and electrical assembly and information handling system utilizing same App 20060214010 - Chan; Benson ; et al.	2006-09-28
Fluoropolymer dielectric composition for use in circuitized substrates and circuitized substrate including same App 20060180936 - Japp; Robert M. ; et al.	2006-08-17
Method of providing printed circuit board with conductive holes and board resulting therefrom App 20060183316 - Larnerd; James M. ; et al.	2006-08-17
Electronic package with filled blinds vias Grant 7,084,509 - Egitto , et al. August 1, 2	2006-08-01
Solid via layer to layer interconnect Grant 7,076,869 - Curcio , et al. July 18, 2	2006-07-18
Method of making an internal capacitive substrate for use in a circuitized substrate and method of making said circuitized substrate App 20060154434 - Das; Rabindra N. ; et al.	2006-07-13
Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate App 20060154501 - Das; Rabindra N. ; et al.	2006-07-13
Resistor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said ciruitized substrate, and information handling system utilizing said ciruitized substrate App 20060151202 - Das; Rabindra N. ; et al.	2006-07-13
Circuitized substrate assembly and method of making same Grant 7,071,423 - Fuller, Jr. , et al. July 4, 2	2006-07-04
Method of making circuitized substrate assembly App 20060123626 - Fuller; James W. JR. ; et al.	2006-06-15
Method of treating conductive layer for use in a circuitized substrate and method of making said substrate having said conductive layer as part thereof App 20060121738 - Egitto; Frank D. ; et al.	2006-06-08
Method of making printed circuit board with varying depth conductive holes adapted for receiving pinned electrical components App 20060121722 - Card; Norman A. ; et al.	2006-06-08
Circuitized substrates utilizing smooth-sided conductive layers as part thereof, method of making same, and electrical assemblies and information handling systems utilizing same App 20060110898 - Lauffer; John M. ; et al.	2006-05-25
Method of making circuitized substrate assembly Grant 7,047,630 - Fuller, Jr. , et al. May 23, 2	2006-05-23
Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same Grant 7,045,897 - Egitto , et al. May 16, 2	2006-05-16
Multi-chip electronic package having laminate carrier and method of making same Grant 7,035,113 - Fraley , et al. April 25, 2	2006-04-25
Capacitor material with metal component for use in circuitized substrates, circuitized substrate utilizing same, method of making said circuitized substrate, and information handling system utilizing said circuitized substrate Grant 7,025,607 - Das , et al. April 11, 2	2006-04-11
Information handling system Grant 7,023,707 - Fraley , et al. April 4, 2	2006-04-04
Dielectric composition for use in circuitized substrates and circuitized substrate including same App 20060054870 - Japp; Robert M. ; et al.	2006-03-16
Economical high density chip carrier Grant 6,998,290 - Adae-Amoakoh , et al. February 14, 2	2006-02-14
Circuitized substrate with internal organic memory device, method of making same, electrical assembly utilizing same, and information handling system utilizing same App 20060022303 - Desai; Subahu D. ; et al.	2006-02-02
Electrical assembly with internal memory circuitized substrate having electronic components positioned thereon, method of making same, and information handling system utilizing same App 20060022310 - Egitto; Frank D. ; et al.	2006-02-02
Method of forming printed circuit card Grant 6,986,198 - Fallon , et al. January 17, 2	2006-01-17
Method of forming printed circuit card App 20060005383 - Fallon; Kenneth ; et al.	2006-01-12
Circuitized substrate with filled isolation border, method of making same, electrical assembly utilizing same, and information handling system utilizing same App 20060000639 - Lauffer; John M. ; et al.	2006-01-05
Circuitized substrate with split conductive layer, method of making same, electrical assembly utilizing same, and information handling system utilizing same App 20060000636 - Lauffer; John M. ; et al.	2006-01-05
Wafer with semiconductor chips mounted thereon Grant 6,967,389 - Infantolino , et al. November 22, 2	2005-11-22
Method of making an electronic package App 20050250249 - Jimarez, Lisa J. ; et al.	2005-11-10
Method of making an electronic package Grant 6,961,995 - Jimarez , et al. November 8, 2	2005-11-08
Method of forming filled blind vias Grant 6,924,224 - Egitto , et al. August 2, 2	2005-08-02
Printed circuit board with low cross-talk noise App 20050133257 - Lauffer, John M. ; et al.	2005-06-23
Method of providing printed circuit board with conductive holes and board resulting therefrom App 20050136646 - Larnerd, James M. ; et al.	2005-06-23
Information handling system utilizing circuitized substrate Grant 6,900,392 - Fuller, Jr. , et al. May 31, 2	2005-05-31
High performance dense wire for printed circuit board Grant 6,894,228 - Anstrom , et al. May 17, 2	2005-05-17
Information handling system utilizing circuitized substrate Grant 6,872,894 - Fuller, Jr. , et al. March 29, 2	2005-03-29
Method for forming an electrical structure Grant 6,868,604 - Kresge , et al. March 22, 2	2005-03-22
Multi-layered interconnect structure using liquid crystalline polymer dielectric App 20050057908 - Egitto, Frank D. ; et al.	2005-03-17
Colloidal seed formation for printed circuit board metallization App 20050042383 - Galasco, Raymond T. ; et al.	2005-02-24
Colloidal seed formulation for printed circuit board metallization Grant 6,852,152 - Galasco , et al. February 8, 2	2005-02-08
Information handling system utilizing circuitized substrate App 20050023035 - Fuller, James W. JR. ; et al.	2005-02-03
Electrical coupling of substrates by conductive buttons Grant 6,848,914 - Beaman , et al. February 1, 2	2005-02-01
Circuitized substrate assembly and method of making same App 20050011670 - Fuller, James W. JR. ; et al.	2005-01-20
Coupling of conductive vias to complex power-signal substructures App 20050005439 - Carpenter, Karen ; et al.	2005-01-13
Method for forming a substructure of a multilayered laminate Grant 6,832,436 - Anstrom , et al. December 21, 2	2004-12-21
Forming a through hole in a photoimageable dielectric structure Grant 6,830,875 - Fuerniss , et al. December 14, 2	2004-12-14
High speed circuit board and method for fabrication Grant 6,828,514 - Chan , et al. December 7, 2	2004-12-07
Multi-layered interconnect structure using liquid crystalline polymer dielectric Grant 6,826,830 - Egitto , et al. December 7, 2	2004-12-07
High speed circuit board and method for fabrication App 20040231888 - Chan, Benson ; et al.	2004-11-25
Laminate circuit structure and method of fabricating Grant 6,820,332 - Japp , et al. November 23, 2	2004-11-23
Coupling of conductive vias to complex power-signal substructures Grant 6,810,583 - Carpenter , et al. November 2, 2	2004-11-02
Circuitized substrate assembly and method of making same Grant 6,809,269 - Fuller, Jr. , et al. October 26, 2	2004-10-26
Circuitized substrate assembly and method of making same App 20040177998 - Fuller, James W. JR. ; et al.	2004-09-16
Laminate substrate containing fiber optic cables Grant 6,788,859 - Markovich , et al. September 7, 2	2004-09-07
Printed circuit boards for electronic device packages having glass free non-conductive layers and method of forming same Grant 6,781,064 - Appelt , et al. August 24, 2	2004-08-24
Multi-chip electronic package having laminate carrier and method of making same App 20040150114 - Fraley, Lawrence R. ; et al.	2004-08-05
Information handling system App 20040150101 - Fraley, Lawrence R. ; et al.	2004-08-05
High speed circuit board and method for fabrication App 20040150969 - Chan, Benson ; et al.	2004-08-05
Wafer with semiconductor chips mounted thereon App 20040135245 - Infantolino, William ; et al.	2004-07-15
Two signal one power plane circuit board App 20040134685 - Fallon, Kenneth ; et al.	2004-07-15
Electronic package with filled blind vias App 20040132279 - Egitto, Frank D. ; et al.	2004-07-08
Semiconductor chip module and method of manufacture of same Grant 6,759,270 - Infantolino , et al. July 6, 2	2004-07-06
Semiconductor chip module and method of manufacture of same Grant 6,756,662 - Infantolino , et al. June 29, 2	2004-06-29
Circuitized substrate assembly and method of making same App 20040118596 - Fuller, James W. JR. ; et al.	2004-06-24
Information handling system utilizing circuitized substrate App 20040118598 - Fuller, James W. JR. ; et al.	2004-06-24
Economical high density chip carrier Grant 6,753,612 - Adae-Amoakoh , et al. June 22, 2	2004-06-22
Two signal one power plane circuit board Grant 6,750,405 - Fallon , et al. June 15, 2	2004-06-15
Economical high density chip carrier App 20040099960 - Adae-Amoakoh, Sylvia ; et al.	2004-05-27
Printed wiring board Grant 6,740,819 - Bhatt , et al. May 25, 2	2004-05-25
Electronic package with filled blinds vias App 20040065960 - Egitto, Frank D. ; et al.	2004-04-08
Semiconductor chip module and method of manufacture of same App 20040058474 - Infantolino, William ; et al.	2004-03-25
Semiconductor Chip Module And Method Of Manufacture Of Same App 20040056347 - Infantolino, William ; et al.	2004-03-25
Colloidal seed formation for printed circuit board metallization App 20040058071 - Galasco, Raymond T. ; et al.	2004-03-25
Dielectric structure and method of formation Grant 6,699,350 - Bhatt , et al. March 2, 2	2004-03-02
Process for forming a multi-level thin-film electronic packaging structure Grant 6,678,949 - Prasad , et al. January 20, 2	2004-01-20
Full additive process with filled plated through holes Grant 6,664,485 - Bhatt , et al. December 16, 2	2003-12-16
Copper plated PTH barrels and methods for fabricating App 20030209799 - Magnuson, Roy H. ; et al.	2003-11-13
Printed wiring board App 20030188890 - Bhatt, Anilkumar C. ; et al.	2003-10-09
Copper plated PTH barrels and methods for fabricating Grant 6,630,743 - Magnuson , et al. October 7, 2	2003-10-07
Electrically conductive filled through holes App 20030162047 - Appelt, Bernd K. ; et al.	2003-08-28
Method of making a printed circuit board having filled holes and a fill member for use therewith including reinforcement means Grant 6,609,296 - Farquhar , et al. August 26, 2	2003-08-26
Method for making a printed wiring board Grant 6,608,757 - Bhatt , et al. August 19, 2	2003-08-19
Multi-layered interconnect structure using liquid crystalline polymer dielectric App 20030147227 - Egitto, Frank D. ; et al.	2003-08-07
Printed wiring board structure with z-axis interconnections Grant 6,593,534 - Jones , et al. July 15, 2	2003-07-15
Strain relief for substrates having a low coefficient of thermal expansion App 20030101581 - Kresge, John S. ; et al.	2003-06-05
Laminate having plated microvia interconnects and method for forming the same App 20030102158 - Jimarez, Miguel A. ; et al.	2003-06-05
Electrical coupling of substrates by conductive buttons App 20030073329 - Beaman, Brian S. ; et al.	2003-04-17
Fabrication of a metalized blind via App 20030054635 - Egitto, Frank D. ; et al.	2003-03-20
Forming a through hole in a photoimageable dielectric structure App 20030047357 - Fuerniss, Stephen J. ; et al.	2003-03-13
Laminate circuit structure and method of fabricating App 20030042046 - Japp, Robert M. ; et al.	2003-03-06
Method of joining laminates for z-axis interconnection App 20030041966 - Casey, Jon A. ; et al.	2003-03-06
Method of making a parallel capacitor laminate Grant 6,524,352 - Adae-Amoakoh , et al. February 25, 2	2003-02-25
Solid via layer to layer interconnect App 20030035272 - Curcio, Brian E. ; et al.	2003-02-20
Coupling of conductive vias to complex power-signal substructures App 20030029636 - Carpenter, Karen ; et al.	2003-02-13
Compliant layer for encapsulated columns App 20030020150 - Jimarez, Lisa J. ; et al.	2003-01-30
Dielectric structure and method of formation App 20030010440 - Bhatt, Anilkumar C. ; et al.	2003-01-16
High performance dense wire for printed circuit board App 20030006857 - Anstrom, Donald O. ; et al.	2003-01-09
An Electronic Package Having A Substrate With Electrically Conductive Filled Through Holes App 20030006066 - APPELT, BERND K. ; et al.	2003-01-09
Copper plated PTH barrels and methods for fabricating App 20020195716 - Magnuson, Roy H. ; et al.	2002-12-26
High performance dense wire for printed circuit board Grant 6,495,772 - Anstrom , et al. December 17, 2	2002-12-17
Solid Via Layer To Layer Interconnect App 20020179334 - Curcio, Brian E. ; et al.	2002-12-05
Composite laminate circuit structure and methods of interconnecting the same Grant 6,479,093 - Lauffer , et al. November 12, 2	2002-11-12
High Performance Dense Wire For Printed Circuit Board App 20020148637 - Anstrom, Donald O. ; et al.	2002-10-17
Method and structure for economical high density chip carrier App 20020145203 - Adae-Amoakoh, Sylvia ; et al.	2002-10-10
Method and structure for an organic package with improved BGA life App 20020137256 - Knickerbocker, John U. ; et al.	2002-09-26
Printed wiring board structure with z-axis interconnections App 20020131229 - Jones, Gerald W. ; et al.	2002-09-19
Method of preparing a printed circuit board Grant RE37,840 - Bhatt , et al. September 17, 2	2002-09-17
Composite laminate circuit structure and method of forming the same Grant 6,451,509 - Keesler , et al. September 17, 2	2002-09-17
Multilayered laminate App 20020108780 - Blackwell, Kim J. ; et al.	2002-08-15
Conductive substructures of a multilayered laminate App 20020100613 - Anstrom, Donald O. ; et al.	2002-08-01
Composite laminate circuit structure and methods of interconnecting the same App 20020098331 - Lauffer, John M. ; et al.	2002-07-25
Compliant layer for encapsulated cloumns App 20020092676 - Jimarez, Lisa J. ; et al.	2002-07-18
Conductive substructures of a multilayered laminate Grant 6,407,341 - Anstrom , et al. June 18, 2	2002-06-18
Method of making a parallel capacitor laminate App 20020054471 - Adae-Amoakoh, Sylvia ; et al.	2002-05-09
Capacitor laminate for use in printed circuit board and as an interconnector Grant 6,370,012 - Adae-Amoakoh , et al. April 9, 2	2002-04-09
Process for manufacturing a multi-layer circuit board App 20010042733 - Appelt, Bernd K. ; et al.	2001-11-22
Process for forming a multi-level thin-film electronic packaging structure App 20010037565 - Prasad, Chandrika ; et al.	2001-11-08
Composite laminate circuit structure and method of forming the same App 20010023044 - Keesler, Ross W. ; et al.	2001-09-20
Multi-level thin-film electronic packaging structure and related method Grant 6,281,452 - Prasad , et al. August 28, 2	2001-08-28
Full additive process with filled plated through holes App 20010009066 - Bhatt, Anilkumar C. ; et al.	2001-07-26
Selective seed and plate using permanent resist Grant 6,264,851 - Markovich , et al. July 24, 2	2001-07-24
Circuitized semiconductor structure and method for producing such Grant 6,265,075 - Klueppel , et al. July 24, 2	2001-07-24
Full additive process with filled plated through holes App 20010007289 - Bhatt, Anilkumar C. ; et al.	2001-07-12
Filling open through holes in a multilayer board Grant 6,204,456 - Lauffer , et al. March 20, 2	2001-03-20
Two signal one power plane circuit board Grant 6,204,453 - Fallon , et al. March 20, 2	2001-03-20
Multi-voltage plane, multi-signal plane circuit card with photoimageable dielectric Grant 6,201,194 - Lauffer , et al. March 13, 2	2001-03-13
Full additive process with filled plated through holes Grant 6,195,883 - Bhatt , et al. March 6, 2	2001-03-06
Composite laminate circuit structure and method of forming the same Grant 6,175,087 - Keesler , et al. January 16, 2	2001-01-16
Interconnect structure for joining a chip to a circuit card Grant 6,121,069 - Boyko , et al. September 19, 2	2000-09-19
Method of making a printed circuit board having filled holes and fill member for use therewith Grant 6,079,100 - Farquhar , et al. June 27, 2	2000-06-27
Ball limiting metal mask and tin enrichment of high melting point solder for low temperature interconnection Grant 5,953,623 - Boyko , et al. September 14, 1	1999-09-14
Process for selective application of solder to circuit packages Grant 5,597,469 - Carey , et al. January 28, 1	1997-01-28
Method of preparing a printed circuit board Grant 5,557,844 - Bhatt , et al. September 24, 1	1996-09-24
Method and apparatus for testing integrated circuit chips Grant 5,528,159 - Charlton , et al. June 18, 1	1996-06-18
Depositing a conductive metal onto a substrate Grant 5,509,557 - Jimarez , et al. April 23, 1	1996-04-23
Method for making printed circuit boards with selectivity filled plated through holes Grant 5,487,218 - Bhatt , et al. January 30, 1	1996-01-30
Printed circuit board with aligned connections and method of making same Grant 5,450,290 - Boyko , et al. September 12, 1	1995-09-12
Interconnection method and structure for organic circuit boards Grant 5,435,057 - Bindra , et al. July 25, 1	1995-07-25
Semi-subtractive circuitization Grant 5,427,895 - Magnuson , et al. June 27, 1	1995-06-27
Method and apparatus for testing of integrated circuit chips Grant 5,420,520 - Anschel , et al. May 30, 1	1995-05-30
Printed circuit board or card for direct chip attachment and fabrication thereof Grant 5,418,689 - Alpaugh , et al. May 23, 1	1995-05-23
Method for conditioning halogenated polymeric materials and structures fabricated therewith Grant 5,374,454 - Bickford , et al. December 20, 1	1994-12-20
Applying solder to high density substrates Grant 5,316,788 - Dibble , et al. May 31, 1	1994-05-31
Interconnection method and structure for organic circuit boards Grant 5,298,685 - Bindra , et al. March 29, 1	1994-03-29
Solder interconnection structure on organic substrates and process for making Grant 5,292,688 - Hsiao , et al. * March 8, 1	1994-03-08
High density circuit board and method of making same Grant 5,191,174 - Chang , et al. March 2, 1	1993-03-02
Method of fabricating nendritic materials Grant 5,185,073 - Bindra , et al. February 9, 1	1993-02-09
Method of external circuitization of a circuit panel Grant 5,158,645 - Covert , et al. October 27, 1	1992-10-27
Separable electrical connection technology Grant 5,137,461 - Bindra , et al. August 11, 1	1992-08-11
Encapsulated circuitized power core alignment and lamination Grant 5,129,142 - Bindra , et al. July 14, 1	1992-07-14
Solder interconnection structure on organic substrates Grant 5,121,190 - Hsiao , et al. June 9, 1	1992-06-09
Conditioning a non-conductive substrate for subsequent selective deposition of a metal thereon Grant 4,948,707 - Johnson , et al. August 14, 1	1990-08-14