Malone; Kelly

Patent Applications and Registrations

Patent applications and USPTO patent grants for Malone; Kelly.The latest application filed is for "anonymous notification and intervention of users requiring assistance".

Company Profile

3.33.42

Malone; Kelly - ESSEX MA
Malone; Kelly - Delmar NY
Malone; Kelly - Middleton MA
Malone; Kelly - Newburgh NY
Malone; Kelly - Poughkeepsie NY
Malone; Kelly - San Jose CA

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Anonymous Notification And Intervention Of Users Requiring Assistance App 20190287373 - Coq; Marc H. ; et al.	2019-09-19
Anonymous notification and intervention of users requiring assistance Grant 10,410,497 - Coq , et al. Sept	2019-09-10
Using A Service-provider Password To Simulate F-sso Functionality App 20190199707 - Hinton; Heather M. ; et al.	2019-06-27
Simulated SSO functionality by means of multiple authentication procedures and out-of-band communications Grant 10,333,927 - Hinton , et al.	2019-06-25
Using a service-provider password to simulate F-SSO functionality Grant 10,305,882 - Hinton , et al.	2019-05-28
Environmental control in vehicles Grant 10,144,275 - Gaddis , et al. De	2018-12-04
Simulated Sso Functionality By Means Of Multiple Authentication Procedures And Out-of-band Communications App 20180302398 - Hinton; Heather M. ; et al.	2018-10-18
SSO functionality by means of a temporary password and out-of-band communications Grant 10,063,539 - Hinton , et al. August 28, 2	2018-08-28
Environmental Control In Vehicles App 20180065453 - GADDIS; Cynthia H. ; et al.	2018-03-08
Sso Functionality By Means Of A Temporary Password And Out-of-band Communications App 20170353447 - Hinton; Heather M. ; et al.	2017-12-07
Using an out-of-band password to provide enhanced SSO functionality Grant 9,807,087 - Hinton , et al. October 31, 2	2017-10-31
Using A Service-provider Password To Simulate F-sso Functionality App 20170149767 - Hinton; Heather M. ; et al.	2017-05-25
Using An Out-of-band Password To Provide Enhanced Sso Functionality App 20170149770 - Hinton; Heather M. ; et al.	2017-05-25
Semiconductor device defect monitoring using a plurality of temperature sensing devices in an adjacent semiconductor device Grant 9,170,296 - Malone , et al. October 27, 2	2015-10-27
Toughness, adhesion and smooth metal lines of porous low K dielectric interconnect structures Grant RE45,781 - Hedrick , et al. October 27, 2	2015-10-27
Semiconductor Device Defect Monitoring App 20150042371 - Malone; Kelly ; et al.	2015-02-12
ADHESION LAYER AND MULTIPHASE ULTRA-LOW k DIELECTRIC MATERIAL App 20140203336 - GRILL; ALFRED ; et al.	2014-07-24
Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates Grant 8,735,284 - Malone , et al. May 27, 2	2014-05-27
Conductive Metal And Diffusion Barrier Seed Compositions, And Methods Of Use In Semiconductor And Interlevel Dielectric Substrates App 20140072796 - Malone; Kelly ; et al.	2014-03-13
Conductive metal and diffusion barrier seed compositions, and methods of use in semiconductor and interlevel dielectric substrates Grant 8,647,535 - Malone , et al. February 11, 2	2014-02-11
Process to form an adhesion layer and multiphase ultra-low k dielectric material using PECVD Grant 8,637,412 - Grill , et al. January 28, 2	2014-01-28
Multiphase Ultra Low K Dielectric Material App 20130043514 - Grill; Alfred ; et al.	2013-02-21
Conductive Metal And Diffusion Barrier Seed Compositions, And Methods Of Use In Semiconductor And Interlevel Dielectric Substrates App 20120178241 - Malone; Kelly ; et al.	2012-07-12
Method and system for preparing and replying to multi-party e-mails Grant 8,099,465 - Daniels , et al. January 17, 2	2012-01-17
Dynamic webcast content viewer method and system Grant 8,037,095 - Haileselassie , et al. October 11, 2	2011-10-11
Context-based user assistance Grant 8,032,834 - Burton , et al. October 4, 2	2011-10-04
Cellular telephone signal monitoring method and system Grant 7,933,592 - Johnson , et al. April 26, 2	2011-04-26
Polycarbosilane buried etch stops in interconnect structures Grant 7,879,717 - Huang , et al. February 1, 2	2011-02-01
Surface treatment of inter-layer dielectric Grant 7,816,253 - Chen , et al. October 19, 2	2010-10-19
Dual damascene integration of ultra low dielectric constant porous materials Grant 7,737,561 - Kumar , et al. June 15, 2	2010-06-15
Vehicle help system and method Grant 7,711,462 - Daniels , et al. May 4, 2	2010-05-04
Enhanced mechanical strength via contacts Grant 7,671,470 - Yang , et al. March 2, 2	2010-03-02
Enhanced mechanical strength via contacts Grant 7,670,943 - Yang , et al. March 2, 2	2010-03-02
Dynamic Webcast Content Viewer Method And System App 20090198701 - Haileselassie; Welela ; et al.	2009-08-06
Cellular Telephone Signal Monitoring Method And System App 20090047944 - Johnson; Sandra K. ; et al.	2009-02-19
Providing Gaps In Capping Layer To Reduce Tensile Stress For Beol Fabrication Of Integrated Circuits App 20080315347 - Bonilla; Griselda ; et al.	2008-12-25
Enhanced Mechanical Strength Via Contacts App 20080284030 - Yang; Chih-Chao ; et al.	2008-11-20
Enhanced Mechanical Strength Via Contacts App 20080280434 - YANG; CHIH-CHAO ; et al.	2008-11-13
Enhanced mechanical strength via contacts Grant 7,439,624 - Yang , et al. October 21, 2	2008-10-21
Polycarbosilane Buried Etch Stops In Interconnect Structures App 20080254612 - Huang; Elbert E. ; et al.	2008-10-16
Polycarbosilane buried etch stops in interconnect structures Grant 7,396,758 - Huang , et al. July 8, 2	2008-07-08
Metal to Metal Low-K Antifuse App 20080157270 - Kim; Deok-kee ; et al.	2008-07-03
Fuse Element Using Low-K Dielectric App 20080157268 - Kim; Deok-kee ; et al.	2008-07-03
Vehicle Help System And Method App 20080147262 - DANIELS; Fonda ; et al.	2008-06-19
Method For Post Cap Ild/imd Repair With Uv Irradiation App 20080124815 - Malone; Kelly ; et al.	2008-05-29
Context-based User Assistance App 20080109723 - Burton; Mary Catherine ; et al.	2008-05-08
Dual Damascene Integration Of Ultra Low Dielectric Constant Porous Materials App 20080099923 - Kumar; Kaushik A. ; et al.	2008-05-01
Method for dual damascene integration of ultra low dielectric constant porous materials Grant 7,338,895 - Kumar , et al. March 4, 2	2008-03-04
Enhanced Mechanical Strength Via Contacts App 20070284736 - Yang; Chih-Chao ; et al.	2007-12-13
Surface Treatment Of Inter-layer Dielectric App 20070222081 - Chen; Shyng-Tsong ; et al.	2007-09-27
Polycarbosilane Buried Etch Stops In Interconnect Structures App 20070111509 - Huang; Elbert E. ; et al.	2007-05-17
Polycarbosilane buried etch stops in interconnect structures Grant 7,187,081 - Huang , et al. March 6, 2	2007-03-06
Method For Protecting A Semiconductor Device From Carbon Depletion Based Damage App 20070048981 - Bonilla; Griselda ; et al.	2007-03-01
Method and system for preparing and replying to multi-party e-mails App 20060277263 - Daniels; Fonda J. ; et al.	2006-12-07
Line level air gaps App 20060264036 - Chen; Shyng-Tsong ; et al.	2006-11-23
Line level air gaps Grant 7,084,479 - Chen , et al. August 1, 2	2006-08-01
Surface Treatment Of Post-rie-damaged P-osg And Other Damaged Materials App 20060128163 - Chen; Shyng-Tsong ; et al.	2006-06-15
Dual damascene integration of ultra low dielectric constant porous materials App 20060118961 - Kumar; Kaushik A. ; et al.	2006-06-08
Dual damascene integration of ultra low dielectric constant porous materials Grant 7,057,287 - Kumar , et al. June 6, 2	2006-06-06
Line level air gaps App 20050127514 - Chen, Shyng-Tsong ; et al.	2005-06-16
Process for removing impurities from low dielectric constant films disposed on semiconductor devices App 20050087490 - Chace, Mark S. ; et al.	2005-04-28
Dual damascene integration of ultra low dielectric constant porous materials App 20050040532 - Kumar, Kaushik A. ; et al.	2005-02-24
Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same App 20040253457 - Hichri, Habib ; et al.	2004-12-16
Structure and method for reducing thermo-mechanical stress in stacked vias Grant 6,831,363 - Dalton , et al. December 14, 2	2004-12-14
Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures Grant 6,783,862 - Hedrick , et al. August 31, 2	2004-08-31
Polycarbosilane buried etch stops in interconnect structures App 20040147111 - Huang, Elbert E. ; et al.	2004-07-29
Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same Grant 6,764,873 - Hichri , et al. July 20, 2	2004-07-20
Improved Formation Of Porous Interconnection Layers App 20040130027 - Chen, Shyng-Tsong ; et al.	2004-07-08
Structure and method for reducing thermo-mechanical stress in stacked vias App 20040113278 - Dalton, Timothy J. ; et al.	2004-06-17
Semiconductor wafer including a low dielectric constant thermosetting polymer film and method of making same App 20040013887 - Hichri, Habib ; et al.	2004-01-22
Toughness, adhesion and smooth metal lines of porous low k dielectric interconnect structures App 20030114013 - Hedrick, Jeffrey C. ; et al.	2003-06-19

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