Majid; Tariq

Patent Applications and Registrations

Patent applications and USPTO patent grants for Majid; Tariq.The latest application filed is for "protection of seed layers during electrodeposition of metals in semiconductor device manufacturing".

Company Profile

1.12.11

Majid; Tariq - West Linn OR
Majid; Tariq - Wilsonville OR
Majid; Tariq - Tualatin OR

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Protection Of Seed Layers During Electrodeposition Of Metals In Semiconductor Device Manufacturing App 20220208604 - Zhu; Huanfeng ; et al.	2022-06-30
Gap fill process stability monitoring of an electroplating process using a potential-controlled exit step Grant 10,358,738 - Ma , et al. July 23, 2	2019-07-23
Gap Fill Process Stability Monitoring Of An Electroplating Process Using A Potential-controlled Exit Step App 20180080140 - Ma; Quan ; et al.	2018-03-22
Apparatus and method for edge bevel removal of copper from silicon wafers Grant 9,685,353 - Ganesan , et al. June 20, 2	2017-06-20
Membrane design for reducing defects in electroplating systems Grant 9,677,190 - Kim , et al. June 13, 2	2017-06-13
Membrane Design For Reducing Defects In Electroplating Systems App 20150122658 - Kim; Doyeon ; et al.	2015-05-07
Apparatus And Method For Edge Bevel Removal Of Copper From Silicon Wafers App 20140190529 - Ganesan; Kousik ; et al.	2014-07-10
Apparatus and method for edge bevel removal of copper from silicon wafers Grant 8,419,964 - Ganesan , et al. April 16, 2	2013-04-16
Rapidly cleanable electroplating cup seal Grant 8,398,831 - Ghongadi , et al. March 19, 2	2013-03-19
Electroplating cup assembly Grant 8,377,268 - Rash , et al. February 19, 2	2013-02-19
Electroplating Cup Assembly App 20110233056 - Rash; Robert ; et al.	2011-09-29
Rapidly Cleanable Electroplating Cup Seal App 20110181000 - Ghongadi; Shantinath ; et al.	2011-07-28
Closed contact electroplating cup assembly Grant 7,985,325 - Rash , et al. July 26, 2	2011-07-26
Rapidly cleanable electroplating cup assembly Grant 7,935,231 - Ghongadi , et al. May 3, 2	2011-05-03
Apparatus And Method For Edge Bevel Removal Of Copper From Silicon Wafers App 20100055924 - Ganesan; Kousik ; et al.	2010-03-04
Rapidly Cleanable Electroplating Cup Assembly App 20090107835 - Ghongadi; Shantinath ; et al.	2009-04-30
Closed Contact Electroplating Cup Assembly App 20090107836 - Rash; Robert ; et al.	2009-04-30
Electroplating using DC current interruption and variable rotation rate Grant 6,884,335 - Webb , et al. April 26, 2	2005-04-26
Electroplating using DC current interruption and variable rotation rate App 20040231996 - Webb, Eric G. ; et al.	2004-11-25

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