Maier; Hubert

Patent Applications and Registrations

Patent applications and USPTO patent grants for Maier; Hubert.The latest application filed is for "separation of chips on a substrate".

Company Profile

0.10.10

Maier; Hubert - Villach AT

*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.

Patent Activity

Patent	Date
Passivation layer and method of making a passivation layer Grant 9,728,480 - Matoy , et al. August 8, 2	2017-08-08
Separation of chips on a substrate Grant 9,490,103 - Engelhardt , et al. November 8, 2	2016-11-08
Method for processing wafer Grant 9,490,173 - Maier November 8, 2	2016-11-08
Separation of Chips on a Substrate App 20160111255 - Engelhardt; Manfred ; et al.	2016-04-21
Separation of chips on a substrate Grant 9,219,011 - Engelhardt , et al. December 22, 2	2015-12-22
Passivation Layer and Method of Making a Passivation Layer App 20150235917 - Matoy; Kurt ; et al.	2015-08-20
Method for producing bonding connection of semiconductor device Grant 9,059,182 - Maier , et al. June 16, 2	2015-06-16
Method For Processing Wafer App 20150115448 - Maier; Hubert	2015-04-30
Separation of Chips on a Substrate App 20150064879 - Engelhardt; Manfred ; et al.	2015-03-05
Passivation Layer and Method of Making a Passivation Layer App 20140117511 - Matoy; Kurt ; et al.	2014-05-01
Integrated circuit having a semiconductor arrangement Grant 7,834,427 - Detzel , et al. November 16, 2	2010-11-16
Method of forming a semiconductor structure comprising insulating layers with different thicknesses Grant 7,718,505 - Vannucci , et al. May 18, 2	2010-05-18
Method for forming an integrated semiconductor circuit arrangement Grant 7,531,439 - Rieger , et al. May 12, 2	2009-05-12
Method Of Forming A Semiconductor Structure Comprising Insulating Layers With Different Thicknesses App 20080315303 - Vannucci; Nicola ; et al.	2008-12-25
Integrated Circuit Having A Semiconductor Arrangement App 20080179669 - Detzel; Thomas ; et al.	2008-07-31
Semiconductor device for bonding connection App 20070063318 - Maier; Hubert ; et al.	2007-03-22
Method for forming an integrated semiconductor circuit arrangement App 20060014371 - Rieger; Johann ; et al.	2006-01-19
Method for producing an electrode by means of a field effect controllable semiconductor component and field-effect-controllable semiconductor component Grant 6,605,841 - Lanzerstorfer , et al. August 12, 2	2003-08-12
Method for producing an electrode of a field-effect-controllable semiconductor component and field-effect-controllable semiconductor component App 20020100923 - Lanzerstorfer, Sven ; et al.	2002-08-01

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