Patent | Date |
---|
Semiconductor device and method of manufacturing the same Grant 11,270,971 - Ikura , et al. March 8, 2 | 2022-03-08 |
Light projection device Grant 10,895,373 - Maeda January 19, 2 | 2021-01-19 |
Light Projection Device App 20200408393 - MAEDA; Takehiko | 2020-12-31 |
Semiconductor Device And Method Of Manufacturing The Same App 20200135687 - IKURA; Kenji ;   et al. | 2020-04-30 |
Method of manufacturing semiconductor device Grant 10,181,450 - Isozaki , et al. Ja | 2019-01-15 |
Semiconductor Device And Method Of Manufacturing The Same App 20180068964 - MAEDA; Takehiko ;   et al. | 2018-03-08 |
Semiconductor device and method of manufacturing the same Grant 9,853,005 - Maeda , et al. December 26, 2 | 2017-12-26 |
Method Of Manufacturing Semiconductor Device App 20170287868 - ISOZAKI; Seiya ;   et al. | 2017-10-05 |
Semiconductor device Grant 9,659,888 - Okada , et al. May 23, 2 | 2017-05-23 |
Semiconductor Device App 20160163667 - Okada; Makio ;   et al. | 2016-06-09 |
Semiconductor device Grant 9,299,632 - Okada , et al. March 29, 2 | 2016-03-29 |
Semiconductor Device And Method Of Manufacturing The Same App 20160013142 - MAEDA; Takehiko ;   et al. | 2016-01-14 |
Semiconductor device manufacturing method Grant 8,975,150 - Mori , et al. March 10, 2 | 2015-03-10 |
Semiconductor Device App 20150061159 - Okada; Makio ;   et al. | 2015-03-05 |
Semiconductor device and method for manufacturing the same Grant 8,536,691 - Kikuchi , et al. September 17, 2 | 2013-09-17 |
Semiconductor Device And Manufacturing Method Therefor App 20130127050 - MIYAGAWA; Yuichi ;   et al. | 2013-05-23 |
Method of manufacturing a wiring board Grant 8,389,414 - Kikuchi , et al. March 5, 2 | 2013-03-05 |
Method For Manufacturing A Semiconductor Device Having A Heat Spreader App 20130005090 - Sato; Yuko ;   et al. | 2013-01-03 |
Semiconductor Device Manufacturing Method App 20110281401 - MORI; Kentaro ;   et al. | 2011-11-17 |
Semiconductor device including an LSI chip and a method for manufacturing the same Grant 8,043,953 - Murai , et al. October 25, 2 | 2011-10-25 |
Semiconductor device and method for manufacturing same Grant 8,035,217 - Mori , et al. October 11, 2 | 2011-10-11 |
Semiconductor device and method of manufacturing same Grant 7,999,401 - Murai , et al. August 16, 2 | 2011-08-16 |
Method Of Manufacturing A Wiring Board App 20110136298 - KIKUCHI; Katsumi ;   et al. | 2011-06-09 |
Method of manufacturing a semiconductor device having a heat spreader App 20110104872 - Sato; Yuko ;   et al. | 2011-05-05 |
Wiring board, semiconductor device using wiring board and their manufacturing methods Grant 7,911,038 - Kikuchi , et al. March 22, 2 | 2011-03-22 |
Wiring board, method for manufacturing same, and semiconductor package Grant 7,838,779 - Yamamichi , et al. November 23, 2 | 2010-11-23 |
Wiring Board Composite Body, Semiconductor Device, And Method For Manufacturing The Wiring Board Composite Body And The Semiconductor Device App 20100232127 - Mori; Kentaro ;   et al. | 2010-09-16 |
Interconnecting substrate and semiconductor device Grant 7,745,736 - Ogawa , et al. June 29, 2 | 2010-06-29 |
Semiconductor device and manufacturing method therefor App 20100117244 - Miyagawa; Yuichi ;   et al. | 2010-05-13 |
Method for manufacturing a semiconductor device having a heat spreader App 20100105170 - Sato; Yuko ;   et al. | 2010-04-29 |
Method of manufacturing a wiring substrate and semiconductor device Grant 7,701,726 - Tsukano , et al. April 20, 2 | 2010-04-20 |
Wiring board and method for manufacturing the same Grant 7,674,989 - Kikuchi , et al. March 9, 2 | 2010-03-09 |
Wiring substrate, semiconductor device, and method of manufacturing the same Grant 7,649,749 - Tsukano , et al. January 19, 2 | 2010-01-19 |
Wiring Board, Semiconductor Device Using Wiring Board And Their Manufacturing Methods App 20090315190 - Kikuchi; Katsumi ;   et al. | 2009-12-24 |
Semiconductor Device And Method For Manufacturing The Same App 20090294951 - Murai; Hideya ;   et al. | 2009-12-03 |
Semiconductor Device And Method For Manufacturing The Same App 20090283895 - Kikuchi; Katsumi ;   et al. | 2009-11-19 |
Method Of Manufacturing A Wiring Substrate And Semiconductor Device App 20090137085 - TSUKANO; Jun ;   et al. | 2009-05-28 |
Semiconductor Device And Method Of Manufacturing Same App 20090026636 - MURAI; Hideya ;   et al. | 2009-01-29 |
Semiconductor Device And Method For Manufacturing Same App 20080303136 - Mori; Kentaro ;   et al. | 2008-12-11 |
Semiconductor Device Including Multilayer Wiring Board With Power Supply Circuit App 20080272829 - Maeda; Takehiko | 2008-11-06 |
Wiring substrate, semiconductor device, and method of manufacturing the same App 20080012140 - Tsukano; Jun ;   et al. | 2008-01-17 |
Wiring board and method for manufacturing the same App 20060283629 - Kikuchi; Katsumi ;   et al. | 2006-12-21 |
Wiring board, method for manufacturing same, and semiconductor package App 20060283625 - Yamamichi; Shintaro ;   et al. | 2006-12-21 |
Interconnecting substrate and semiconductor device App 20060192287 - Ogawa; Kenta ;   et al. | 2006-08-31 |
Light thin stacked package semiconductor device and process for fabrication thereof Grant 6,762,488 - Maeda , et al. July 13, 2 | 2004-07-13 |
Light thin stacked package semiconductor device and process for fabrication thereof App 20030178716 - Maeda, Takehiko ;   et al. | 2003-09-25 |
Resin encapsulated BGA-type semiconductor device App 20030166314 - Ono, Yoshihiro ;   et al. | 2003-09-04 |
Semiconductor device and manufacturing method for the same App 20030119296 - Tsukano, Jun ;   et al. | 2003-06-26 |
Resin encapsulated BGA-type semiconductor device App 20030107129 - Ono, Yoshihiro ;   et al. | 2003-06-12 |