loadpatents
name:-0.059051990509033
name:-0.034460067749023
name:-0.0030190944671631
Maeda; Takehiko Patent Filings

Maeda; Takehiko

Patent Applications and Registrations

Patent applications and USPTO patent grants for Maeda; Takehiko.The latest application filed is for "light projection device".

Company Profile
1.22.30
  • Maeda; Takehiko - Tokyo JP
  • Maeda; Takehiko - Gunma JP
  • MAEDA; Takehiko - Takasaki-shi JP
  • Maeda; Takehiko - Takasaki JP
  • Maeda; Takehiko - Kawasaki JP
  • Maeda; Takehiko - Kanagawa JP
  • Maeda; Takehiko - Kawasaki-shi JP
*profile and listings may contain filings by different individuals or companies with the same name. Review application materials to confirm ownership/assignment.
Patent Activity
PatentDate
Semiconductor device and method of manufacturing the same
Grant 11,270,971 - Ikura , et al. March 8, 2
2022-03-08
Light projection device
Grant 10,895,373 - Maeda January 19, 2
2021-01-19
Light Projection Device
App 20200408393 - MAEDA; Takehiko
2020-12-31
Semiconductor Device And Method Of Manufacturing The Same
App 20200135687 - IKURA; Kenji ;   et al.
2020-04-30
Method of manufacturing semiconductor device
Grant 10,181,450 - Isozaki , et al. Ja
2019-01-15
Semiconductor Device And Method Of Manufacturing The Same
App 20180068964 - MAEDA; Takehiko ;   et al.
2018-03-08
Semiconductor device and method of manufacturing the same
Grant 9,853,005 - Maeda , et al. December 26, 2
2017-12-26
Method Of Manufacturing Semiconductor Device
App 20170287868 - ISOZAKI; Seiya ;   et al.
2017-10-05
Semiconductor device
Grant 9,659,888 - Okada , et al. May 23, 2
2017-05-23
Semiconductor Device
App 20160163667 - Okada; Makio ;   et al.
2016-06-09
Semiconductor device
Grant 9,299,632 - Okada , et al. March 29, 2
2016-03-29
Semiconductor Device And Method Of Manufacturing The Same
App 20160013142 - MAEDA; Takehiko ;   et al.
2016-01-14
Semiconductor device manufacturing method
Grant 8,975,150 - Mori , et al. March 10, 2
2015-03-10
Semiconductor Device
App 20150061159 - Okada; Makio ;   et al.
2015-03-05
Semiconductor device and method for manufacturing the same
Grant 8,536,691 - Kikuchi , et al. September 17, 2
2013-09-17
Semiconductor Device And Manufacturing Method Therefor
App 20130127050 - MIYAGAWA; Yuichi ;   et al.
2013-05-23
Method of manufacturing a wiring board
Grant 8,389,414 - Kikuchi , et al. March 5, 2
2013-03-05
Method For Manufacturing A Semiconductor Device Having A Heat Spreader
App 20130005090 - Sato; Yuko ;   et al.
2013-01-03
Semiconductor Device Manufacturing Method
App 20110281401 - MORI; Kentaro ;   et al.
2011-11-17
Semiconductor device including an LSI chip and a method for manufacturing the same
Grant 8,043,953 - Murai , et al. October 25, 2
2011-10-25
Semiconductor device and method for manufacturing same
Grant 8,035,217 - Mori , et al. October 11, 2
2011-10-11
Semiconductor device and method of manufacturing same
Grant 7,999,401 - Murai , et al. August 16, 2
2011-08-16
Method Of Manufacturing A Wiring Board
App 20110136298 - KIKUCHI; Katsumi ;   et al.
2011-06-09
Method of manufacturing a semiconductor device having a heat spreader
App 20110104872 - Sato; Yuko ;   et al.
2011-05-05
Wiring board, semiconductor device using wiring board and their manufacturing methods
Grant 7,911,038 - Kikuchi , et al. March 22, 2
2011-03-22
Wiring board, method for manufacturing same, and semiconductor package
Grant 7,838,779 - Yamamichi , et al. November 23, 2
2010-11-23
Wiring Board Composite Body, Semiconductor Device, And Method For Manufacturing The Wiring Board Composite Body And The Semiconductor Device
App 20100232127 - Mori; Kentaro ;   et al.
2010-09-16
Interconnecting substrate and semiconductor device
Grant 7,745,736 - Ogawa , et al. June 29, 2
2010-06-29
Semiconductor device and manufacturing method therefor
App 20100117244 - Miyagawa; Yuichi ;   et al.
2010-05-13
Method for manufacturing a semiconductor device having a heat spreader
App 20100105170 - Sato; Yuko ;   et al.
2010-04-29
Method of manufacturing a wiring substrate and semiconductor device
Grant 7,701,726 - Tsukano , et al. April 20, 2
2010-04-20
Wiring board and method for manufacturing the same
Grant 7,674,989 - Kikuchi , et al. March 9, 2
2010-03-09
Wiring substrate, semiconductor device, and method of manufacturing the same
Grant 7,649,749 - Tsukano , et al. January 19, 2
2010-01-19
Wiring Board, Semiconductor Device Using Wiring Board And Their Manufacturing Methods
App 20090315190 - Kikuchi; Katsumi ;   et al.
2009-12-24
Semiconductor Device And Method For Manufacturing The Same
App 20090294951 - Murai; Hideya ;   et al.
2009-12-03
Semiconductor Device And Method For Manufacturing The Same
App 20090283895 - Kikuchi; Katsumi ;   et al.
2009-11-19
Method Of Manufacturing A Wiring Substrate And Semiconductor Device
App 20090137085 - TSUKANO; Jun ;   et al.
2009-05-28
Semiconductor Device And Method Of Manufacturing Same
App 20090026636 - MURAI; Hideya ;   et al.
2009-01-29
Semiconductor Device And Method For Manufacturing Same
App 20080303136 - Mori; Kentaro ;   et al.
2008-12-11
Semiconductor Device Including Multilayer Wiring Board With Power Supply Circuit
App 20080272829 - Maeda; Takehiko
2008-11-06
Wiring substrate, semiconductor device, and method of manufacturing the same
App 20080012140 - Tsukano; Jun ;   et al.
2008-01-17
Wiring board and method for manufacturing the same
App 20060283629 - Kikuchi; Katsumi ;   et al.
2006-12-21
Wiring board, method for manufacturing same, and semiconductor package
App 20060283625 - Yamamichi; Shintaro ;   et al.
2006-12-21
Interconnecting substrate and semiconductor device
App 20060192287 - Ogawa; Kenta ;   et al.
2006-08-31
Light thin stacked package semiconductor device and process for fabrication thereof
Grant 6,762,488 - Maeda , et al. July 13, 2
2004-07-13
Light thin stacked package semiconductor device and process for fabrication thereof
App 20030178716 - Maeda, Takehiko ;   et al.
2003-09-25
Resin encapsulated BGA-type semiconductor device
App 20030166314 - Ono, Yoshihiro ;   et al.
2003-09-04
Semiconductor device and manufacturing method for the same
App 20030119296 - Tsukano, Jun ;   et al.
2003-06-26
Resin encapsulated BGA-type semiconductor device
App 20030107129 - Ono, Yoshihiro ;   et al.
2003-06-12

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